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S72MS-P based MCP/PoP Products
1.8 Volt-only x16 Flash Memory and SDRAM on Split Bus NAND Interface ORNANDTM Flash on Bus 1 Mobile SDRAM on Bus 2
Data Sheet (Advance Information)
S72MS-P based MCP/PoP Products Cover Sheet
Notice to Readers: This document states the current technical specifications regarding the Spansion product(s) described herein. Each product described herein may be designated as Advance Information, Preliminary, or Full Production. See Notice On Data Sheet Designations for definitions.
Publication Number S72MS-P_00
Revision 01
Issue Date September 14, 2006
Data
Sheet
(Advance
Information)
Notice On Data Sheet Designations
Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers of product information or intended specifications throughout the product life cycle, including development, qualification, initial production, and full production. In all cases, however, readers are encouraged to verify that they have the latest information before finalizing their design. The following descriptions of Spansion data sheet designations are presented here to highlight their presence and definitions.
Advance Information
The Advance Information designation indicates that Spansion Inc. is developing one or more specific products, but has not committed any design to production. Information presented in a document with this designation is likely to change, and in some cases, development on the product may discontinue. Spansion Inc. therefore places the following conditions upon Advance Information content:
"This document contains information on one or more products under development at Spansion Inc. The information is intended to help you evaluate this product. Do not design in this product without contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed product without notice."
Preliminary
The Preliminary designation indicates that the product development has progressed such that a commitment to production has taken place. This designation covers several aspects of the product life cycle, including product qualification, initial production, and the subsequent phases in the manufacturing process that occur before full production is achieved. Changes to the technical specifications presented in a Preliminary document should be expected while keeping these aspects of production under consideration. Spansion places the following conditions upon Preliminary content:
"This document states the current technical specifications regarding the Spansion product(s) described herein. The Preliminary status of this document indicates that product qualification has been completed, and that initial production has begun. Due to the phases of the manufacturing process that require maintaining efficiency and quality, this document may be revised by subsequent versions or modifications due to changes in technical specifications."
Combination
Some data sheets contain a combination of products with different designations (Advance Information, Preliminary, or Full Production). This type of document distinguishes these products and their designations wherever necessary, typically on the first page, the ordering information page, and pages with the DC Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first page refers the reader to the notice on this page.
Full Production (No Designation on Document)
When a product has been in production for a period of time such that no changes or only nominal changes are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include those affecting the number of ordering part numbers available, such as the addition or deletion of a speed option, temperature range, package type, or VIO range. Changes may also include those needed to clarify a description or to correct a typographical error or incorrect specification. Spansion Inc. applies the following conditions to documents in this category:
"This document states the current technical specifications regarding the Spansion product(s) described herein. Spansion Inc. deems the products to have been in sufficient production volume such that subsequent versions of this document are not expected to change. However, typographical or specification corrections, or modifications to the valid combinations offered may occur."
Questions regarding these document designations may be directed to your local sales office.
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S72MS-P based MCP/PoP Products
S72MS-P_00_01 September 14, 2006
S72MS-P based MCP/PoP Products
1.8 Volt-only x16 Flash Memory and SDRAM on Split Bus NAND Interface ORNANDTM Flash on Bus 1 Mobile SDRAM on Bus 2
Data Sheet (Advance Information)
Features
Power supply voltage of 1.7 to 1.95V Flash access time: 25 ns for ORNAND Flash Mobile SDRAM burst frequency: 104 MHz (SDR), 133 MHz (DDR) ORNAND bus width: x8 or x16 Package: 11.0 x 13.0 mm MCP Operating Temperature -25C to +85C (wireless)
The S72MS series is a product line of stacked packages and consists of:
One or two NAND Interface ORNAND die Separate bus for one or more Mobile SDRAM die
The products covered by this document are listed in the table below.
ORNAND Flash Density Device S72MS512PE0HF94V 1024Mb 512Mb X (x8) 512Mb DRAM Density 256Mb X (x16 SDR) 128Mb
For detailed specifications, please refer to the individual data sheets.
Document S30MS-P 256 Mb Mobile SDR-DRAM Type 5 Publication Identification Number (PID) S30MS-P_00 SDRAM_10
Publication Number S72MS-P_00
Revision 01
Issue Date September 14, 2006
This document contains information on one or more products under development at Spansion Inc. The information is intended to help you evaluate this product. Do not design in this product without contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed product without notice.
Data
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1.
Product Selector Guide
Device-Model# S72MS512PE0HF94V ORNAND Flash Density 512 Mb ORNAND Bus Width x8 ECC Required Yes DRAM Density 256 Mb DRAM Speed 104 MHz (SDR) DRAM Supplier Type 5 Package MCP 11x13mm 137-ball
2. Product Block Diagram
2.1 ORNAND Flash + DRAM MCP
N-I/O0-N-I/O7
I/O0-I/O7
N-RB#
RB#
N-CLE N-CE# N-ALE N-RE# N-WP# N-WE#
CLE CE# ALE RE# WP# WE#
MS512P x8 ORNAND Memory
VSS PRE
N-VSS N-PRE
VCC
N-VCC
D-A0-D-A12
A0-A12
D-BA0 D-BA1 D-CLK D-CKE D-CE# D-LDQM D-WE# D-RAS# D-CAS# D-UDQM
BA0 BA1 CLK CKE CE# LDQM WE# RAS# CAS# UDQM
DQ0-DQ15
D-DQ0-D-DQ15
256Mb x16 SDR DRAM Memory
VSS VSSQ VCC VCCQ D-VSS D-VSSQ D-VCC D-VCCQ
Note 1. For MCPs, VSS is shared between all Flash (NOR and ORNAND). Also, VSSQ is tied to VSS internally within the MCP.
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3. Connection Diagrams
3.1 512 Mb x8 ORNAND Flash with 256 Mb DRAM
1 A D-CKE B D-RAS# C D-A10 D D-A0 E D-VCCQ F D-VSSQ G D-DQ0 H D-DQ1 J D-DQ2 K D-DQ3 L D-DQ4 M D-DQ5 N WE# P D-DQS0 D-VSS D-A1 D-A2 D-VSS D-VCC D-A3 D-A4 RY/BY# D-DQS1 D-BA0 D-DQ6 D-DQ7 D-VSSQ D-VCCQ D-DQ8 D-DQ9 D-BA1 RE# RFU RFU VSS RFU RFU DNU RFU DNU D-DQ10 VCC RFU N-IO2 RFU RFU N-IO5 RFU WP# D-DQ11 DNU N-IO0 RFU RFU VCC RFU N-IO7 VSS D-DQ12 RFU RFU RFU N-IO3 N-IO4 RFU RFU DNU D-DQ13 RFU VSS N-IO1 N-IO6 RFU RFU D-DQ14 RFU RFU RFU RFU RFU RFU RFU D-DQ15 RFU RFU RFU RFU RFU RFU RFU RFU D-VSSQ SDR DRAM Only RFU RFU D-DM1 F-RST# DNU RFU RFU RFU D-VCCQ ORNAND Flash 1 Only RFU RFU D-DM0 F-ACC F-WE# RFU RFU CE# D-A5 Do Not Use RFU VSS RFU RFU RFU PRE ALE CLE RFU Reserved For Future Use D-WE# D-A9 D-A8 D-VSSQ D-VCCQ D-A7 D-A6 RFU D-CAS# Legend D-CLK D-CLK# RFU D-VSS D-VCC D-A12 D-A11 D-VSS D-CE# 2 3 4 5 6 7 8 9 10
3.1.1
Special Handling Instructions For FBGA Package
Special handling is required for Flash Memory products in FBGA packages. Flash memory devices in FBGA packages may be damaged if exposed to ultrasonic cleaning methods. The package and/or data integrity may be compromised if the package body is exposed to temperatures above 150xC for prolonged periods of time.
3.1.2
Look-ahead Ballout for Future Designs
Please refer to the Design-in Scalable Wireless Solutions with Spansion Products application note (publication number: Design_Scalable_Wireless_A0_E). Contact your local Spansion sales representative for more details.
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3.2
DRAM Input/Output Descriptions
D-Amax-D-A0 D-DQ15-D-DQ0 D-CLK D-CE# D-CKE D-BA1-BA0 D-RAS# D-CAS# D-DM1-D-DM0 D-WE# D-VSS D-CLK# D-VSSQ D-VCCQ D-VCC D-DQS0 - DDQS1 SDRAM Address inputs SDRAM Data input/output SDRAM System Clock SDRAM Chip Select SDRAM Clock Enable SDRAM Bank Select SDRAM Row Address Strobe SDRAM Column Address Strobe SDRAM Data Input Mask SDRAM Write Enable input SDRAM Ground DDR SDRAM Clock - in addition to D-CLK, this signal is available for DDRAMs that need CLK# for normal operations SDRAM Input/Output Buffer ground SDRAM Input/Output Buffer power supply SDRAM device power supply DDR SDRAM Data Strobe pins. DQS provides the read data strobes (as output) and the write data strobes (as input). Each DQS pin corresponds to eight DQ pins, respectively.
Note Some of the signal descriptions specifically apply to DDR DRAM only.
3.2.1
ORNAND Signal Descriptions
N-PRE N-ALE N-CLE N-CE# N-WP# N-WE# N-RE# N-RY/BY# N-I/O0-N-I/O15 N-VCC ORNAND Power-On Read Enable. Tie to VSS on customer board if not used ORNAND Address Latch Enable ORNAND Command Latch Enable ORNAND Chip-enablE ORNAND Write-protect ORNAND Write-enable ORNAND Read-enable ORNAND Ready-Busy ORNAND I/O Signals (I/O0-I/O7 for x8 bus width) ORNAND Power Supply
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4.
Ordering Information
The order number is formed by a valid combinations of the following:
S72MS
512
P
F0
HF
0
4
V
0 PACKING TYPE 0 = Tray 2 = 7" Tape and Reel 3 = 13" Tape and Reel MODEL NUMBER 2 V = 104 MHz DRAM Speed, x8 MS-P (ECC required) MODEL NUMBER 1 4 = x16 SDR DRAM Type 5 PACKAGE DESCRIPTOR Depends on Character 12. For a more detailed description see Table 4.1. PACKAGE TYPE & MATERIAL SET HF = 1.2 mm MCP FBGA, Pb-free DRAM DENSITY F0 = 512 Mb DRAM E0 = 256 Mb DRAM PROCESS TECHNOLOGY P = 90 nm, MirrorBitTM Technology ORNAND FLASH DENSITY 01G = 1024 Mb 512 = 512 Mb PRODUCT FAMILY S72MS Stacked Products (MCP/PoP) 1.8 V ORNAND Flash on Bus 1 with Mobile DRAM on Bus 2
Table 4.1 Character Position Descriptions (Sheet 1 of 2)
Character 14 Description Character 12 Character 13 0 1 2 3 4 H, J, or G 5 6 7 8 9 9x12 mm 9x12 mm 11x13 mm 11x13 mm 11x13 mm 115 137 84 115 137 Package Area 7x9 mm 7x9 mm 8x11.6 mm 8x11.6 mm 9x12 mm Package Ball Count 56 80 64 84 84 0.35 mm Raw Ball Size
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Table 4.1 Character Position Descriptions (Sheet 2 of 2)
Character 14 Description Character 12 Character 13 A B D F G K H J K L M 14x14 mm 15x15 mm 15x15 mm 17x17 mm 17x17 mm 152 160 160 192 192 0.50 mm 0.45 mm 0.50 mm 0.45 mm 0.50 mm Package Area 11x11 mm 11x11 mm 12x12 mm 12x12 mm 14x14 mm Package Ball Count 112 112 128 128 152 Raw Ball Size 0.45 mm 0.50 mm 0.45 mm 0.50 mm 0.45 mm
4.1
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local sales office to confirm availability of specific valid combinations and to check on newly released combinations.
S72MS-P Valid Combinations Base Ordering Number S72MS512PE0 Package & Material Set HF Package Descriptor 9 Packing Type 0, 2, 3 (Note 1) ORNAND Flash Bus Width x8 (ECC)
DRAM Supplier Type 5
DRAM Speed 104 MHz
Package Type 11x13 mm (MCP)
Package Markings (Note 2)
Notes: 1. Packing Type 0 is standard. Specify other options as required. 2. BGA package marking omits leading S and packing type designator from ordering part number.
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5.
5.1
Physical Dimensions
TLK137--137-ball Fine-Pitch Ball Grid Array (FBGA) 13 x 11 mm Package
NOTES: PACKAGE JEDEC DxE SYMBOL A A1 A2 D E D1 E1 MD ME n Ob eE eD SD SE 0.35 TLK 137 N/A 13.00 mm x 11.00 mm PACKAGE MIN --0.17 0.79 NOM ------13.00 BSC. 11.00 BSC. 10.40 BSC. 7.20 BSC. 14 10 137 0.40 0.80 BSC. 0.80 BSC 0.40 BSC. G5,H5,H6 0.45 MAX 1.20 --0.96 PROFILE BALL HEIGHT BODY THICKNESS BODY SIZE BODY SIZE MATRIX FOOTPRINT MATRIX FOOTPRINT MATRIX SIZE D DIRECTION MATRIX SIZE E DIRECTION BALL COUNT BALL DIAMETER BALL PITCH BALL PITCH SOLDER BALL PLACEMENT DEPOPULATED SOLDER BALLS 9 8. 7 6 NOTE 1. 2. 3. 4. 5. DIMENSIONING AND TOLERANCING METHODS PER ASME Y14.5M-1994. ALL DIMENSIONS ARE IN MILLIMETERS. BALL POSITION DESIGNATION PER JEP95, SECTION 4.3, SPP-010. e REPRESENTS THE SOLDER BALL GRID PITCH. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D" DIRECTION. SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE "E" DIRECTION. n IS THE NUMBER OF POPULATED SOLDER BALL POSITIONS FOR MATRIX SIZE MD X ME. DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL DIAMETER IN A PLANE PARALLEL TO DATUM C. SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A AND B AND DEFINE THE POSITION OF THE CENTER SOLDER BALL IN THE OUTER ROW. WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE OUTER ROW SD OR SE = 0.000. WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE OUTER ROW, SD OR SE = e/2 "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED BALLS. A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
3606 \ 16-038.43 \ 9.14.06
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6.
6.1
Revision History
Revision 01 (September 14, 2006)
Initial release.
Colophon The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior authorization by the respective government entity will be required for export of those products. Trademarks and Notice The contents of this document are subject to change without notice. This document may contain information on a Spansion product under development by Spansion. Spansion reserves the right to change or discontinue work on any product without notice. The information in this document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose, merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. Spansion assumes no liability for any damages of any kind arising out of the use of the information in this document. Copyright (c) 2006 Spansion Inc. All Rights Reserved. Spansion, the Spansion logo, MirrorBit, ORNAND, HD-SIM, and combinations thereof are trademarks of Spansion Inc. Other names are for informational purposes only and may be trademarks of their respective owners.
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