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HT36B0 8-Bit Music Synthesizer MCU
Features
* Operating voltage: 3.6V~5.0V * Operating frequency: 3.58MHz~12MHz, * Polyphonic up to 16 notes * Independent pan and volume mix can be assigned to
RC typ. 11.059MHz
* 36 bidirectional I/O lines * Two 16-bit programmable timer/event counters with
each sound component
* Sampling rate of 44.1kHz as 11.059MHz for system
frequency
* Eight-level subroutine nesting * HALT function and wake-up feature to reduce power
overflow interrupts
* Watchdog Timer * Built-in 8-bit MCU with 7688 bits RAM * Built-in 256K16-bit ROM for program/data shared * Digital output pins for external DAC * Single data format with 16 bits digital stereo audio
consumption
* Bit manipulation instructions * 16-bit table read instructions * 63 powerful instructions * All instructions in 1 or 2 machine cycles * UART input/output 31.25kbps * 28-pin SOP, 64-pin QFP package
output
* MIDI interface available * Two High D/A converter resolution: 16 bits
General Description
The HT36B0 is an 8-bit high performance RISC-like microcontroller specifically designed for music applications. It provides an 8-bit MCU and a 16 channel wavetable synthesizer. The program ROM is composed of both program control codes and wavetable voice codes, and can be easily programmed. The HT36B0 has a built-in 8-bit microprocessor which programs the synthesizer to generate the melody by setting the special register from 20H~2AH. A HALT feature is provided to reduce power consumption.
Block Diagram
PA PB PC PD PE 0~ 0~ 0~ 0~ 0~ PA PB PC PD PE 7 7 7 7 3 8 - B it MCU 7688 RAM
2 5 6 K 1 6 - b it ROM VDD VDDA VSS VSSA
IN T OSC1 OSC2 M ID I_ IN M ID I_ O U T M ID I_ T H R U RES
M u ltip lie r /P h a s e G e n e ra l
S te re o 1 6 - B it DAC
RCH LCH
DOUT
LO AD
DCLK
Rev. 1.00
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June 30, 2003
HT36B0
Pin Assignment
DOUT LO AD DCK PD0 PD1 PD2 PD3 PD4 PD5 PD6 PD7 PE0 PE1
RCH 1 2 3 4 5 6 7 8 9 LCH VDDA VSSA VSS 1 2 3 4 5 6 7 8 9 10 11 12 13 14 VDD RES M ID I_ O U T M ID I_ T H R U M ID I_ IN NC NC NC NC NC PA7 PA6 PA5 28 27 26 25 24 23 22 21 20 19 18 17 16 15 OSC1 OSC2 VSSA VDDA LCH RCH NC NC IN T PA0 PA1 PA2 PA3 PA4 OSC2 OSC1 VSS VDD RES M ID I_ O U T M ID I_ T H R U M ID I_ IN PC7 PC6 PC5 PC4 PC3 PC2 NC
64 63 62 61 60 59 58 57 56 55 54 53 52
51 50 49 48 47 46 45 44
PE2 PE3 IN T PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7
10 11 12 13 14 15 16 17 18 19
H T36B 0 6 4 Q F P -A
43 42 41 40 39 38 37 36 35 34 33
H T36B 0 2 8 S O P -A
20 21 22 23 24 25 26 27 28 29 30 31 32
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
PC1
PC0
Rev. 1.00
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HT36B0
Pad Assignment
M ID I_ T H R U M ID I_ O U T
M ID I_ IN
VDDA
OSC1
OSC2
VSSA
VSS
RCH
VDD
RES
LCH
PC2 1 2 3 4
PC3 52
PC4 51
PC6 PC5 50 49
PC7 48
47
46 45
44
43
42
41
40
39
38
37
36
35 34 33 32 31 30 29 28 (0 , 0 ) 27 26 25 24 23 22
DCK LO AD DOUT PD0 PD1 PD2 PD3 PD4 PD5 PD6 PD7 PE0 PE1 PE2
PC1 PC0 PB7
5
6
7 PB4
8 PB3
9 PB2
10 PB1
11 PB0
12 PA7
13 PA6
14 PA5
15 PA4
16 PA3
17 18 PA2 PA1
19 PA0
20 IN T
21 PE3
PB5 PB6
Chip size: 132.5 194.7 (mil) * The IC substrate should be connected to VSS in the PCB layout artwork.
Rev. 1.00
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HT36B0
Pad Coordinates
Pad No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 X -1496.60 -1517.35 -1517.35 -1517.35 -1496.90 -1396.90 -1286.30 -1186.30 -1075.70 -975.70 -865.10 546.65 657.25 757.25 867.85 967.85 1078.45 1178.45 1289.05 1391.25 1499.65 1515.85 1515.85 1515.85 1515.85 1515.85 Y 2302.60 -1856.15 -1966.75 -2066.75 -2307.35 -2307.35 -2307.35 -2307.35 -2307.35 -2307.35 -2307.35 -2307.35 -2307.35 -2307.35 -2307.35 -2307.35 -2307.35 -2307.35 -2307.35 -2307.35 -2307.35 -435.50 -335.50 -224.90 -124.90 -14.30 Pad No. 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 X 1515.85 1515.85 1515.85 1515.85 1515.85 1515.85 1515.85 1515.85 1515.85 1517.85 1404.55 1292.11 1143.45 975.076 294.224 176.10 -431.00 -547.124 -654.20 -754.20 -864.80 -964.80 -1075.40 -1175.40 -1286.00 -1386.00 Y 85.70 196.30 296.30 406.90 506.90 617.50 717.75 825.85 926.35 2262.00 2262.00 2262.00 2262.00 2282.60 2282.60 2300.10 2300.10 2302.60 2302.60 2302.60 2302.60 2302.60 2302.60 2302.60 2302.60 2302.60 Unit: mm
Pad Description
Pad Name PA7~PA0 PB7~PB0 PC7~PC0 PD0~PD7 PE0~PE3 INT DOUT LOAD DCLK RCH LCH I/O I/O I/O I/O I/O I/O I O O O O O Internal Connection Pull-High or None Pull-High or None Pull-High or None Pull-High or None Pull-High or None Pull-High 3/4 3/4 3/4 3/4 3/4 Function Bidirectional 8-bit Input/Output port, wake-up by mask option Bidirectional 8-bit Input/Output port Bidirectional 8-bit Input/Output port Bidirectional 8-bit Input/Output port Bidirectional 4-bit Input/Output port External interrupt DAC data out DAC word clock DAC bit clock R channel audio output L channel audio output
Rev. 1.00
4
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HT36B0
Pad Name VDDA VSSA OSC1 OSC2 GND VDD RES MIDI_OUT MIDI_THRN MIDI_IN I/O 3/4 3/4 I O 3/4 3/4 I O O I Internal Connection 3/4 3/4 DAC power supply Negative power supply of DAC, ground OSC1 and OSC2 are connected to an RC network or a crystal (by mask option) for the internal system clock. In the case of RC operation, OSC2 is the output terminal for 1/8 system clock. The system clock may come from the crystal, the two pins cannot be floating. Negative power supply, ground Positive power supply Reset input, active low MIDI Output MIDI through MIDI input Function
3/4
3/4 3/4 3/4 3/4 3/4 3/4
Absolute Maximum Ratings
Supply Voltage .............................VSS-0.3V to VSS+6V Input Voltage .............................VSS-0.3V to VDD+0.3V Storage Temperature ...........................-50C to 125C Operating Temperature ..........................-25C to 70C
Note: These are stress ratings only. Stresses exceeding the range specified under Absolute Maximum Ratings may cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.
D.C. Characteristics
Symbol VDD IDD ISTB IOH IOL VIH VIL RPH Parameter Operating Voltage Operating Current Standby Current (WDT Disabled) I/O Ports Source Current I/O Ports Sink Current Input High Voltage for I/O Ports Input Low Voltage for I/O Ports Test Conditions VDD 3/4 4.5V 4.5V Conditions 3/4 No load, fOSC=11.0592MHz No load, System HALT Min. 3.6 3/4 3/4 5 5 0.8VDD 0 3/4 Typ. 4.5 16 1 3/4 3/4 3/4 3/4 30 Max. 5.5 32 3 3/4 3/4 VDD 0.2VDD 3/4
Ta=25C Unit V mA mA mA mA V V kW
4.5V VOH=4.5V 4.5V VOL=0.5V 4.5V 4.5V 3/4 3/4
Pull-High Resistance of I/O Ports (INT) 4.5V VIL=0V
Rev. 1.00
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HT36B0
A.C. Characteristics
Symbol MCU interface fOSC fSYS tWDT tRES Symbol DAC interface fBC tCH tDOS tDOH tLCS tLCH DCK Bit Clock Frequency DCK Bit Clock H Level Time Data Output Setup Time Data Output Hold Time Load Clock Setup Time Load Clock Hold Time Fig 1 Fig 1 Fig 1 Fig 1 Fig 1 Fig 1 3/4 600 200 200 200 200 fSYS/16 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 MHz ns ns ns ns ns System Frequency System Clock Watchdog Time-Out Period (RC) External Reset Low Pulse Width Parameter 5V 5V 3/4 3/4 Figure 11.059MHz crystal 3/4 Without WDT prescaler 3/4 Min. Typ. 3/4 8 9 1 11.059 3/4 17 3/4 Max. 3/4 12 35 3/4 MHz MHz ms ms Unit Parameter Test Conditions VDD Conditions Min. Typ. Max. Unit
1 /fB
C
DCLK V tC
H
V
OH OL
tD
OS
tD LSB
OH
DOUT
V V tL
CH
OH OL
tL
CS
LO AD V
V
OH OL
Fig 1. Audio output timing
Rev. 1.00
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June 30, 2003
HT36B0
Application Circuit
V 10W 0 .1 m F 47mF VDDA VDD LCH 20kW 47mF 0 .1 m F 2 IN 8 VDD 1 VSS 4 5 CE V 47mF 0 .1 m F 20kW RES 0 .1 m F H T36B 0 VSSA VSS 2 IN 8 VDD 1 VSS 4 5 CE 7 OUTP H T82V733 OUTN SPK 8W
DD DD
V
DD
OUTN SPK 8W 7 OUTP
PA0~PA7 OSC1 1 1 .0 5 9 M H z OSC2 V
DD
V re f 3 1mF
H T82V733
PB0~PB7 PC 0~PC 7 PD 0~PD 7 PE0~PE3 RCH
100kW
10mF
V re f 3
V 10W 0 .1 m F 47mF VDDA
DD
VDD
V
DD
LCH OSC1 PA0~PA7 PB0~PB7 PC 0~PC 7 PD 0~PD 7 V
DD
1kW 750W
SPK 8W
V
DD
PE0~PE3 100kW RES 1kW 750W
SPK 8W
RCH VSSA VSS H T36B 0
0 .1 m F
Rev. 1.00
7
June 30, 2003
HT36B0
V 10W 0 .1 m F 47mF VDDA VDD PA0~PA7 PB0~PB7 PC 0~PC 7 PD 0~PD 7 PE0~PE3 OSC1 1 1 .0 5 9 M H z OSC2 V
DD DD
M ID I_ IN M ID I_ O U T M ID I_ T H R U DOUT LO AD DCLK
M ID I D e v ic e
DAC H T82V731
OP
100kW RES 0 .1 m F H T36B 0
VSSA VSS
Rev. 1.00
8
June 30, 2003
HT36B0
Package Information
28-pin SOP (300mil) Outline Dimensions
28 A
15 B
1
14
C C' G H D E F
a
Symbol A B C C D E F G H a
Dimensions in mil Min. 394 290 14 697 92 3/4 4 32 4 0 Nom. 3/4 3/4 3/4 3/4 3/4 50 3/4 3/4 3/4 3/4 Max. 419 300 20 713 104 3/4 3/4 38 12 10
Rev. 1.00
9
June 30, 2003
HT36B0
64-pin QFP (1420) Outline Dimensions
C D 51 33 G H
I 52 32 F A B E
64
20 K a J 1 19
Symbol A B C D E F G H I J K a
Dimensions in mm Min. 18.80 13.90 24.80 19.90 3/4 3/4 2.50 3/4 3/4 1.15 0.10 0 Nom. 3/4 3/4 3/4 3/4 1 0.40 3/4 3/4 0.10 3/4 3/4 3/4 Max. 19.20 14.10 25.20 20.10 3/4 3/4 3.10 3.40 3/4 1.45 0.20 7
Rev. 1.00
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June 30, 2003
HT36B0
Product Tape and Reel Specifications
Reel Dimensions
T2 D
A
B
C
T1
SOP 28W (300mil) Symbol A B C D T1 T2 Description Reel Outer Diameter Reel Inner Diameter Spindle Hole Diameter Key Slit Width Space Between Flange Reel Thickness Dimensions in mm 3301.0 621.5 13.0+0.5 -0.2 2.00.5 24.8+0.3 -0.2 30.20.2
Rev. 1.00
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June 30, 2003
HT36B0
Carrier Tape Dimensions
D
E F
P0
P1
t
W C
B0
D1
P
K0 A0
SOP 28W (300mil) Symbol W P E F D D1 P0 P1 A0 B0 K0 t C Description Carrier Tape Width Cavity Pitch Perforation Position Cavity to Perforation (Width Direction) Perforation Diameter Cavity Hole Diameter Perforation Pitch Cavity to Perforation (Length Direction) Cavity Length Cavity Width Cavity Depth Carrier Tape Thickness Cover Tape Width Dimensions in mm 24.00.3 12.00.1 1.750.1 11.50.1 1.5+0.1 1.5+0.25 4.00.1 2.00.1 10.850.1 18.340.1 2.970.1 0.350.01 21.3
Rev. 1.00
12
June 30, 2003
HT36B0
Holtek Semiconductor Inc. (Headquarters) No.3, Creation Rd. II, Science Park, Hsinchu, Taiwan Tel: 886-3-563-1999 Fax: 886-3-563-1189 http://www.holtek.com.tw Holtek Semiconductor Inc. (Taipei Sales Office) 4F-2, No. 3-2, YuanQu St., Nankang Software Park, Taipei 115, Taiwan Tel: 886-2-2655-7070 Fax: 886-2-2655-7373 Fax: 886-2-2655-7383 (International sales hotline) Holtek Semiconductor Inc. (Shanghai Sales Office) 7th Floor, Building 2, No.889, Yi Shan Rd., Shanghai, China 200233 Tel: 021-6485-5560 Fax: 021-6485-0313 http://www.holtek.com.cn Holtek Semiconductor Inc. (Shenzhen Sales Office) 43F, SEG Plaza, Shen Nan Zhong Road, Shenzhen, China 518031 Tel: 0755-8346-5589 Fax: 0755-8346-5590 ISDN: 0755-8346-5591 Holtek Semiconductor Inc. (Beijing Sales Office) Suite 1721, Jinyu Tower, A129 West Xuan Wu Men Street, Xicheng District, Beijing, China 100031 Tel: 010-6641-0030, 6641-7751, 6641-7752 Fax: 010-6641-0125 Holmate Semiconductor, Inc. (North America Sales Office) 46712 Fremont Blvd., Fremont, CA 94538 Tel: 510-252-9880 Fax: 510-252-9885 http://www.holmate.com Copyright O 2003 by HOLTEK SEMICONDUCTOR INC. The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable without further modification, nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. Holteks products are not authorized for use as critical components in life support devices or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information, please visit our web site at http://www.holtek.com.tw.
Rev. 1.00
13
June 30, 2003

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