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 TJA1080
FlexRay transceiver
Rev. 01 -- 20 July 2006 Preliminary data sheet
1. General description
The TJA1080 is a FlexRay transceiver, which is compatible with the FlexRay electrical physical layer specification V2.1 Rev. A (see Ref. 1). It is primarily intended for communication systems from 1 Mbit/s to 10 Mbit/s, and provides an advanced interface between the protocol controller and the physical bus in a FlexRay network. The TJA1080 can be configured to be used as an active star transceiver or as a node transceiver. The TJA1080 provides differential transmit capability to the network and differential receive capability to the FlexRay controller. It offers excellent EMC performance as well as high ESD protection. The TJA1080 actively monitors the system performance using dedicated error and status information (readable by any microcontroller), as well as internal voltage and temperature monitoring. The TJA1080 supports the mode control as used in Philips TJA1054 (see Ref. 2) and TJA1041 (see Ref. 3) CAN transceivers.
2. Features
2.1 Optimized for time triggered communication systems
I I I I I I I I Data transfer up to 10 Mbit/s Usable for 14 V and 42 V powered systems Very low ElectroMagnetic Emission (EME) to support unshielded cable Differential receiver with high common-mode range for ElectroMagnetic Immunity (EMI) Transceiver can be used for small linear passive bus topologies as well as active star topologies Auto I/O level adaptation to host controller supply voltage VIO Bus guardian interface included Automotive product qualification in accordance with AEC-Q100
Philips Semiconductors
TJA1080
FlexRay transceiver
2.2 Low power management
I Low power management including two inhibit switches I Very low current in Sleep and Standby mode I Wake-up via wake-up symbol on the bus lines (remote), negative edge on pin WAKE (local), and a positive edge on pin STBN if VIO is present I Wake-up source recognition I Automatic power-down (in star Sleep mode) in star configuration
2.3 Diagnosis (detection and signalling)
I I I I I I Overtemperature detection Short-circuit on bus lines VBAT power-on flag (first battery connection and cold start) Pin TXEN and pin BGE clamping Undervoltage detection on pins VBAT, VCC and VIO Wake source indication
2.4 Protections
I Bus pins protected against 8 kV HBM ESD pulses I Bus pins protected against transients in automotive environment (ISO 7637 class C compliant) I Bus pins short-circuit proof to battery voltage (14 V and 42 V) and ground I Fail-safe mode in case of an undervoltage on pins VBAT, VCC or VIO I Passive behavior of bus lines in the event that transceiver is not powered up
3. Quick reference data
Table 1. Symbol VBAT VCC VBUF VIO VTRXD0 VTRXD1 VBP VBM IBAT Quick reference data Parameter supply voltage on pin VBAT supply voltage supply voltage on pin VBUF supply voltage on pin VIO voltage on pin TRXD0 voltage on pin TRXD1 voltage on pin BP voltage on pin BM supply current on pin VBAT low power modes in node configuration normal power modes Conditions no time limit operating range no time limit operating range no time limit operating range no time limit operating range Min -0.3 6.5 -0.3 4.75 -0.3 4.75 -0.3 2.2 -0.3 -0.3 -60 -60 35 0.075 Typ Max +60 60 +5.5 5.25 +5.5 5.25 +5.5 5.25 +5.5 +5.5 +60 +60 50 1 Unit V V V V V V V V V V V V A mA
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Preliminary data sheet
Rev. 01 -- 20 July 2006
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Philips Semiconductors
TJA1080
FlexRay transceiver
Table 1. Symbol ICC
Quick reference data ...continued Parameter supply current Conditions low power modes Normal mode; VBGE = 0 V; VTXEN = VIO; Receive only mode; star Idle mode Normal mode; VBGE = VIO; VTXEN = 0 V; VBUF open Normal mode; VBGE = VIO; VTXEN = 0 V; Rbus = star Transmit mode star Receive mode
[1]
Min -1 -
Typ 0 10
Max +5 15
Unit A mA
-
28.5
35
mA
-
10
15
mA
-1 600
50 38 +1 30 800
62 42 +5 1000 1200
mA mA A A mV
IIO
supply current on pin VIO
low power modes Normal and Receive only mode; VTXD = VIO
VOH(dif)
differential HIGH-level output voltage on pins BP and BM; 40 < Rbus < 55 ; VCC = VBUF = 5 V differential LOW-level output voltage on pins BP and BM; 40 < Rbus < 55 ; VCC = VBUF = 5 V on pins BP and BM; normal power modes; -10 V < VBP < +15 V; -10 V < VBM < +15 V on pins BP and BM; normal power modes; -10 V < VBP < +15 V; -10 V < VBM < +15 V
[2]
VOL(dif)
-1200
-800
-600
mV
VIH(dif)
differential HIGH-level input voltage
150
225
300
mV
VIL(dif)
differential LOW-level input voltage
-300
-225
-150
mV
Tvj
[1] [2]
virtual junction temperature
-40
-
+150
C
Current flows from VCC to VBUF. This means that the maximum sum current ICC + IBUF is 35 mA. In accordance with IEC 60747-1. An alternative definition of virtual junction temperature Tvj is: Tvj = Tamb + TD x Rth(j-a), where Rth(j-a) is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation (P) and ambient temperature (Tamb).
4. Ordering information
Table 2. Ordering information Package Name TJA1080TS/N SSOP20 Description plastic shrink small outline package; 20 leads; body with 5.3 mm Version SOT339-1 Type number
TJA1080_1
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Preliminary data sheet
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TJA1080
FlexRay transceiver
5. Block diagram
VIO 4 VCC 19 VBUF 20 VBAT 14 1 2
INH2 INH1
TJA1080
11
TRXD0
18 SIGNAL ROUTER TRXD1 10 TRANSMITTER 17
BP BM
VIO
TXD TXEN BGE STBN EN
5 6 8 9 3 INPUT VOLTAGE ADAPTATION BUS FAILURE DETECTION
RXD ERRN RXEN
7 13 12 VBAT
OUTPUT VOLTAGE ADAPTATION
RXDINT STATE MACHINE RXDINT NORMAL RECEIVER
WAKE
15
WAKE-UP DETECTION
OVERTEMPERATURE DETECTION
OSCILLATOR LOWPOWER RECEIVER
UNDERVOLTAGE DETECTION
16
001aae436
GND
Fig 1. Block diagram
TJA1080_1
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Philips Semiconductors
TJA1080
FlexRay transceiver
6. Pinning information
6.1 Pinning
INH2 INH1 EN VIO TXD TXEN RXD BGE STBN
1 2 3 4 5 6 7 8 9
20 VBUF 19 VCC 18 BP 17 BM 16 GND 15 WAKE 14 VBAT 13 ERRN 12 RXEN 11 TRXD0
001aae437
TJA1080TS
TRXD1 10
Fig 2. Pin configuration
6.2 Pin description
Table 3. INH2 INH1 EN VIO TXD TXEN RXD BGE STBN TRXD1 TRXD0 RXEN ERRN VBAT WAKE GND BM BP VCC VBUF
TJA1080_1
Pin description Type O O I P I I O I I I/O I/O O O P I P I/O I/O P P Description inhibit 2 output for switching external voltage regulator inhibit 1 output for switching external voltage regulator enable input; when HIGH enabled; internal pull-down supply voltage for VIO voltage level adaptation transmit data input; internal pull-down transmitter enable input; when HIGH transmitter disabled; internal pull-up receive data output bus guardian enable input; when LOW transmitter disabled; internal pull-down standby input; when LOW low power mode; internal pull-down data bus line 1 for inner star connection data bus line 0 for inner star connection receive data enable output; when LOW bus activity detected error diagnoses output; when LOW error detected battery supply voltage local wake-up input; internal pull-up or pull-down (depends on voltage at pin WAKE) ground bus line minus bus line plus supply voltage (+5 V) buffer supply voltage
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Symbol Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
Preliminary data sheet
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Philips Semiconductors
TJA1080
FlexRay transceiver
7. Functional description
The block diagram of the total transceiver is illustrated in Figure 1.
7.1 Operating configurations
7.1.1 Node configuration
In node configuration the transceiver operates as a stand-alone transceiver. The transceiver can be configured as node by connecting pins TRXD0 and TRXD1 to ground during a power-on situation (PWON flag is set). The configuration will be latched when the PWON flag is reset. The following operating modes are selectable:
* * * * *
Normal: normal power mode Receive: normal power mode Standby: low power mode Go-to-sleep: low power mode Sleep: low power mode
7.1.2 Star configuration
In star configuration the transceiver operates as a branch of a FlexRay active star. The transceiver can be configured as star by connecting pin TRXD0 or TRXD1 to VBUF during a PWON situation (PWON flag is set). The configuration will be latched when the PWON flag is reset. It is possible to redirect data from one branch to other branches via the inner bus. It is also possible to send data to all branches via pin TXD, if pins TXEN and BGE have the correct polarity. The following operating modes are available:
* * * * * *
Star idle: normal power mode Star transmit: normal power mode Star receive: normal power mode Star sleep: low power mode Star standby: low power mode Star locked: normal power mode
In the star configuration all modes are autonomously controlled by the transceiver, except in the case of a wake-up.
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TJA1080
FlexRay transceiver
7.1.3 Bus activity and idle detection
The following mechanisms for activity and idle detection are valid for node and star configurations in normal power modes:
* If the absolute differential voltage on the bus lines is higher than Vi(dif)det(act) for
tdet(act)(bus), then activity is detected on the bus lines and pin RXEN is switched to LOW which results in pin RXD being released
* If, after bus activity detection, the differential voltage on the bus lines is higher than
VIH(dif), pin RXD will go HIGH
* If, after bus activity detection, the differential voltage on the bus lines is lower than
VIL(dif), pin RXD will go LOW
* If the absolute differential voltage on the bus lines is lower than Vi(dif)det(act) for
tdet(idle)(bus), then idle is detected on the bus lines and pin RXEN is switched to HIGH. This results in pin RXD being blocked (pin RXD is switched to HIGH or stays HIGH) Additionally, in star configuration, activity and idle can be detected:
* If pin TXEN is LOW for longer than tdet(act)(TXEN), activity is detected on pin TXEN * If pin TXEN is HIGH for longer than tdet(idle)(TXEN), idle is detected on pin TXEN * If pin TRXD0 or TRXD1 is LOW for longer than tdet(act)(TRXD), activity is detected on
pins TRXD0 and TRXD1
* If pin TRXD0 or TRXD1 is HIGH for longer than tdet(idle)(TRXD), idle is detected on pins
TRXD0 and TRXD1
7.2 Operating modes in node configuration
The TJA1080 provides two control pins STBN and EN in order to select one of the modes of operation in node configuration. See Table 4 for a detailed description of the pin signalling in node configuration, and Figure 3 for the timing diagram. All modes are directly controlled via pins EN and STBN unless an undervoltage situation is present. If VIO and (VBUF or VBAT) are within their operating range, pin ERRN indicates the error flag.
Table 4. Pin STBN EN ERRN RXEN RXD Pin signalling in node configuration Mode Normal HIGH HIGH LOW: error flag set [3] HIGH: error flag set[3] [4] LOW: bus activity HIGH: bus idle LOW: bus DATA_0 HIGH: bus DATA_1 or idle Receive only HIGH LOW Go-to-sleep LOW HIGH LOW: wake flag set [4] HIGH: wake flag reset [4] LOW: wake flag set [4] HIGH: wake flag reset [4] LOW: wake flag set [4] HIGH: wake flag reset [4] Standby LOW LOW Sleep LOW X
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TJA1080
FlexRay transceiver
Table 4. Pin INH1 INH2 Transmitter
[3] [4] [5]
Pin signalling in node configuration ...continued Mode Normal HIGH HIGH enabled disabled [4] Receive only Go-to-sleep HIGH float [5] disabled [4] Standby HIGH float [5] Sleep float [4] float [4]
Pin ERRN provides a serial interface for retrieving diagnostic information. Valid if VIO and VBUF or VBAT are present. If wake flag is not set.
TXD
BGE
TXEN
BP BM
RXEN
RXD
001aae439
Fig 3. Timing diagram in normal mode node configuration
The state diagram in node configuration is illustrated in Figure 4.
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TJA1080
FlexRay transceiver
1 RECEIVE ONLY STBN = 1 EN = 0 4 NORMAL STBN = 1 EN = 1
3, 30 15, 25, 43, 44 31, 32 8, 17, 40 6, 33 11, 21
5 10, 20 7, 16, 39 2 14, 24, 41, 42 28, 29
12, 22, 36 STANDBY(1) 19 STBN = 0 EN = 0 9, 18 GO-TO-SLEEP STBN = 0 EN = 1 23
37, 38 26, 45, 46
13, 34, 35 27, 47, 48
SLEEP STBN = 0 EN = X
001aae438
(1) At the first battery connection the transceiver will enter the Standby mode.
Fig 4. State diagram in node configuration
The state transitions are represented with numbers, which correspond with the numbers in the last column of Table 5 to Table 8.
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Preliminary data sheet Rev. 01 -- 20 July 2006
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved. TJA1080_1
Philips Semiconductors
Table 5. State transitions forced by EN and STBN (node configuration) indicates the action that initiates a transaction; 1 and 2 are the consequences of a transaction. Transition from mode Normal Direction to mode receive only go-to-sleep standby Receive only normal go-to-sleep standby Standby normal receive only go-to-sleep Go-to-sleep normal receive only standby sleep Sleep normal receive only
[1] [2] [3] [4] [5]
Transition number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
Pin STBN H L L H L L H H L H H L L H H EN L H L H H L H L H H L L H H L
Flag UVVIO cleared cleared cleared cleared cleared cleared cleared cleared cleared cleared cleared cleared cleared 2 cleared 2 cleared UVVBAT cleared cleared cleared cleared cleared cleared cleared cleared cleared cleared cleared cleared cleared 2 cleared 2 cleared UVVCC cleared cleared cleared cleared cleared cleared 2 cleared 2 cleared X cleared cleared X X 2 cleared 2 cleared PWON cleared cleared cleared X X X X X X X X X X X X Wake cleared cleared cleared X X X 1 set 1 set X 1 set 1 set X cleared 1 set 1 set
Note
[1]
[2][3] [2][3]
[2][4] [2][4] [4] [5] [2][3] [2][3]
STBN must be set to LOW 60 s after EN. Positive edge on pin STBN sets the wake flag. Setting the wake flag clears the UVVIO, UVVBAT and UVVCC flag. Hold time of go-to-sleep is less than the minimum hold time. Hold time of go-to-sleep becomes greater than the minimum hold time.
FlexRay transceiver
TJA1080
10 of 44
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Preliminary data sheet Rev. 01 -- 20 July 2006
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Philips Semiconductors
Table 6. State transitions forced by a wake-up (node configuration) indicates the action that initiates a transaction; 1 and 2 are the consequences of a transaction. Transition from mode Standby Direction to mode normal receive only go-to-sleep standby Go-to-sleep normal receive only standby go-to-sleep Sleep normal receive only standby go-to-sleep
[1]
Transition number 16 17 18 19 20 21 22 23 24 25 26 27
Pin STBN H H L L H H L L H H L L EN H L H L H L L H H L L H
Flag Wake set set set set set set set set set set set set UVVIO cleared cleared cleared cleared cleared cleared cleared cleared 1 cleared 1 cleared 1 cleared 1 cleared UVVBAT cleared cleared cleared cleared cleared cleared cleared cleared 1 cleared 1 cleared 1 cleared 1 cleared UVVCC 1 cleared 1 cleared 1 cleared 1 cleared cleared cleared cleared cleared 1 cleared 1 cleared 1 cleared 1 cleared PWON X X X X X X X X X X X X
Note
[1] [1] [1] [1]
[1] [1] [1] [1]
Setting the wake flag clears the UVVIO, UVVBAT and UVVCC flag.
FlexRay transceiver
TJA1080
11 of 44
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Preliminary data sheet Rev. 01 -- 20 July 2006
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Philips Semiconductors
Table 7. State transitions forced by an undervoltage condition (node configuration) indicates the action that initiates a transaction; 1 and 2 are the consequences of a transaction. Transition from mode Normal Direction to mode sleep sleep standby Receive only sleep sleep standby Go-to-sleep sleep sleep standby Standby sleep sleep
[1] [2] [3]
Transition number 28 29 30 31 32 33 34 35 36 37 38
Flag UVVIO set cleared cleared set cleared cleared set cleared cleared set cleared UVVBAT cleared set cleared cleared set cleared cleared set cleared cleared set UVVCC cleared cleared set cleared cleared set cleared cleared set X X PWON cleared cleared cleared X X X X X X X X Wake 1 cleared 1 cleared 1 cleared 1 cleared 1 cleared 1 cleared 1 cleared 1 cleared 1 cleared 1 cleared 1 cleared
Note
[1] [1] [1] [1] [1] [1] [1] [1] [1] [1][2] [1][3]
UVVIO, UVVBAT or UVVCC detected clears the wake flag. UVVIO overrules UVVCC. UVVBAT overrules UVVCC.
FlexRay transceiver
TJA1080
12 of 44
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Preliminary data sheet Rev. 01 -- 20 July 2006
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Philips Semiconductors
Table 8. State transitions forced by an undervoltage recovery (node configuration) indicates the action that initiates a transaction; 1 and 2 are the consequences of a transaction. Transition from mode Standby Sleep Direction to mode normal receive only normal normal receive only receive only standby standby go-to-sleep go-to-sleep
[1] [2] [3] [4] Recovery of UVVCC flag. Recovery of UVVBAT flag. Clearing the UVVBAT flag sets the wake flag. Recovery of UVVIO flag.
Transition number 39 40 41 42 43 44 45 46 47 48
Pin STBN H H H H H H L L L L EN H L H H L L L L H H
Flag UVVIO cleared cleared cleared cleared cleared cleared cleared cleared cleared cleared UVVBAT cleared cleared cleared cleared cleared cleared cleared cleared cleared cleared UVVCC cleared cleared cleared cleared cleared cleared cleared cleared cleared cleared PWON X X X X X X X X X X Wake X X 1 set X 1 set X 1 set X 1 set X
Note
[1] [1] [2][3] [4] [2][3] [4] [2][3] [4] [2][3] [4]
FlexRay transceiver
TJA1080
13 of 44
Philips Semiconductors
TJA1080
FlexRay transceiver
7.2.1 Normal mode
In Normal mode the transceiver is able to transmit and receive data via the bus lines BP and BM. The output of the normal receiver is directly connected to pin RXD. The transmitter behavior in normal mode of operation, with no time-out present on pins TXEN and BGE and the temperature flag not set is given in Table 9. In this mode pins INH1 and INH2 are set HIGH.
Table 9. BGE L X H H X H L L Transmitter function table TXEN TXD X X H L Transmitter transmitter is disabled transmitter is disabled transmitter is enabled; the bus lines are actively driven; BP is driven HIGH and BM is driven LOW transmitter is enabled; the bus lines are actively driven; BP is driven LOW and BM is driven HIGH
7.2.2 Receive only mode
In receive only mode the transceiver can only receive data. The transmitter is disabled, regardless of the voltages on pins BGE and TXEN. In this mode pins INH1 and INH2 are set HIGH.
7.2.3 Standby mode
In Standby mode the transceiver enters a low power mode which means very low current consumption. In the Standby mode the device is not able to transmit or receive data and the low power receiver is activated to monitor bus activity. Standby mode can be entered if the correct polarity is applied to pins EN and STBN (see Figure 4 and Table 5) or an undervoltage is present on pin VCC; see Figure 4. If an undervoltage is present on pin VCC, direct switching to a normal power mode is not possible. By applying a positive edge on pin STBN and thus setting the wake flag, all undervoltage flags are reset and therefore switching to a normal power mode is possible. The transceiver will then enter the mode indicated on pins EN and STBN In this mode the transceiver can be switched to any other mode if no undervoltage is present on pins VIO and VBAT. Pin INH1 is set to HIGH. If the wake flag is set, pin INH2 is set to HIGH and pins RXEN and RXD are set to LOW, otherwise pin INH2 is floating and pins RXEN and RXD are set to HIGH; see Section 7.5.
7.2.4 Go-to-sleep mode
In this mode the transceiver behaves as in Standby mode. If this mode is selected for a longer time than the go-to-sleep command hold time (minimum hold time) and the wake flag has been previously cleared, the transceiver will enter Sleep mode, regardless of the voltage on pin EN. If the voltage regulator that supplies the host is switched via pin INH1, pin EN becomes LOW if pin INH1 is switched off.
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TJA1080
FlexRay transceiver
7.2.5 Sleep mode
In Sleep mode the transceiver has entered a low power mode. The only difference with Standby mode is that pin INH1 is also set floating. Sleep mode is directly entered if the UVVIO or UVVBAT flag is set. In this mode the transceiver can be switched to any other mode if no undervoltage is present on pins VIO, VCC and VBAT. In case of an undervoltage on pin VCC or VBAT while VIO is present, the wake flag is set by a positive edge on pin STBN. The undervoltage flags will be reset by setting the wake flag, and therefore the transceiver will enter the mode indicated on pins EN and STBN if VIO is present. A detailed description of the wake-up mechanism is given in Section 7.5.
7.3 Operating modes in star configuration
In star configuration mode control via pins EN and STBN is not possible. The transceiver autonomously controls the operating modes except in the case of wake-up. The timing diagram of a transceiver configured in star configuration is illustrated in Figure 6. The state diagram in star configuration is illustrated in Figure 5. A detailed description of the pin signalling in star configuration is given in Table 10. If VIO and (VBUF or VBAT) are within their operating range, pin ERRN will indicate the error flag.
Table 10. Mode Pin signalling in star configuration TRXD0 / TRXD1
[1]
ERRN LOW HIGH
RXEN LOW HIGH bus idle
RXD LOW bus DATA_0 HIGH bus DATA_1
Transmitter INH1 enabled disabled [1] HIGH
INH2 HIGH
Star Transmit output input [2] Star Receive output Star Idle Star Locked Star Sleep
[1] [2] [3] [4]
error flag error flag bus set [3] reset [3] activity
input input input error flag Error flag wake flag wake flag wake flag wake flag reset [1][3] set [1] reset [1] set [1] reset [1] set [1][3] float [1] float [1]
Star Standby input
Valid if VIO and (VBUF or VBAT) are present. TRXD lines are switched as input if TRXD activity is the initiator for star Transmit mode. Pin ERRN provides a serial interface for retrieving diagnostic information. TRXD lines switched as output if TXEN activity is the initiator for star Transmit mode.
Pin BGE has to be connected to pin VIO in order to enable the transmitter via pin TXEN. If pin BGE is connected to ground, it is not possible to activate the transmitter via pin TXEN. If pin TXEN is not used (no controller connected to the transceiver), it has to be connected to pin VIO in order to prevent TXEN activity detection. In all modes pin RXD is connected to the output of the normal mode receiver and therefore represents the data on the bus lines.
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TJA1080
FlexRay transceiver
STAR LOCKED INH1 = HIGH INH2 = HIGH TXEN activity detected for longer than tto(tx-locked) idle detected on the bus lines and TXEN for longer than tto(locked-idle) bus activity detected for longer than tto(rx-locked)
STAR TRANSMIT INH1 = HIGH INH2 = HIGH
idle detected on TRXD0, TRXD1, TXEN and the bus lines
STAR IDLE INH1 = HIGH INH2 = HIGH
idle detected on TRXD0, TRXD1, TXEN and the bus lines
STAR RECEIVE INH1 = HIGH INH2 = HIGH
TRXD0, TRXD1, TXEN activity detected
bus activity detected wake flag 1 or UVVCC signal 0
wake flag 1 time in star locked longer than tto(locked-sleep) no acivity on TRXD0, TRXD1, TXEN and the bus lines for longer than tto(idle-sleep)
STAR SLEEP INH1 = floating INH2 = floating
STAR STANDBY INH1 = HIGH INH2 = HIGH from star idle, star transmit or star receive if wake flag set and under voltage present on VCC for longer than t > tto(uv)(VCC)
from any mode if UVVCC flag is set regardless PWON flag
power-on VBAT > VBAT(PWON)
001aae441
Fig 5. State diagram in star configuration
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FlexRay transceiver
star transmit TRXD0 TRXD1
star idle
star receive
star idle
star transmit
star idle
TXEN
TXD
TRXDOUT
BP BM
RXEN
RXD
001aae440
TRXDOUT is a virtual signal that indicates the state of the TRXD lines. TRXDOUT HIGH means TRXD lines switched as output. TRXDOUT LOW means TRXD lines switched as input.
Fig 6. Timing diagram in star configuration
7.3.1 Star Idle mode
This mode is entered if one of the following events occurs:
* From star Receive mode and star Transmit mode if idle is detected on the bus lines,
on pin TXEN and on pins TRXD0 and TRXD1.
* If the transceiver is in star Locked mode and idle is detected on the bus lines and pin
TXEN for longer than tto(locked-idle).
* If the transceiver is in star Standby mode and the wake flag is set or no undervoltage
is present.
* If the transceiver is in star Sleep mode and the wake flag is set, the transceiver enters
star Idle mode in order to obtain a stable starting point (no glitches on the bus lines etc).
* In star Idle mode the transceiver monitors pins TXEN, TRXD0 and TRXD1 and the
bus lines for activity. In this mode the transmitter is disabled.
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FlexRay transceiver
7.3.2 Star Transmit mode
This mode is entered if one of the following events occur:
* If the transceiver is in star Idle mode and activity is detected on pin TXEN. * If the transceiver is in star Idle mode and activity is detected on pins TRXD0 and
TRXD1. In star Transmit mode the transmitter is enabled and the transceiver can transmit data on the bus lines. It transmits the data received on pins TXD or TRXD0 and TRXD1 on the bus lines.
7.3.3 Star Receive mode
This mode is entered if the transceiver is in star Idle mode and activity has been detected on the bus lines. In star Receive mode the transceiver transmit data via the TRXD0 and TRXD1 lines to other transceivers connected to the bus lines. The transmitter is always disabled.
7.3.4 Star Standby mode
This mode is entered if one of the following events occur:
* From star Idle, star Transmit or star Receive modes if the wake flag is set and an
undervoltage on pin VCC is present for longer than tto(uv)(VCC).
* If the PWON flag is set.
In star Standby mode the transceiver enters a low power mode. In this mode the current consumption is as low as possible to prevent discharging the capacitor at pin VBUF. If pins VIO and VBUF are within their temperature range, pins RXD and RXEN will indicate the wake flag.
7.3.5 Star Sleep mode
This mode is entered if one of the following events occur:
* From any mode if an undervoltage on pin VCC is present for longer than tdet(uv)(VCC). * If the transceiver is in star Idle mode and no activity is detected on the bus lines and
pins TXEN, TRXD0 and TRXD1 for longer than tto(idle-sleep).
* If star Locked mode is active for longer than tto(locked-sleep).
In star Sleep mode the transceiver will enter a low power mode. In this mode the current consumption is as low as possible to prevent the car battery from discharging. The inhibit switches are switched off. In this mode the wake flag wakes the transceiver. A detailed description of the wake-up mechanism is given in Section 7.5. If pins VIO and VBUF are within their temperature range, pins RXD and RXEN will indicate the wake flag.
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7.3.6 Star Locked mode
This mode is entered if one of the following events occur:
* If the transceiver is in star Transmit mode and activity on pin TXEN is detected for
longer than tto(tx-locked).
* If the transceiver is in star Receive mode and activity is detected on the bus lines for
longer than tto(rx-locked). This mode is a fail-silent mode and in this mode the transmitter is disabled.
7.4 Start-up
7.4.1 Node configuration
Node configuration can be selected by applying a voltage lower than 0.3VBUF to pins TRXD0 and TRXD1 during power-on. Node configuration is latched by resetting the PWON flag while the voltage on pins TRXD0 and TRXD1 is lower than 0.3VBUF; see Section 7.7.4 for (re)setting the PWON flag.
7.4.2 Star configuration
Star configuration can be selected by applying a voltage higher than 0.7VBUF to pins TRXD0 or TRXD1 during power-on. Star configuration is latched by resetting the PWON flag while one of the voltages on pins TRXD0 or TRXD1 is higher than 0.7VBUF. See Section 7.7.4 for (re)setting the PWON flag. In this case the transceiver goes from node Standby mode to star Idle mode.
7.5 Wake-up mechanism
7.5.1 Node configuration
If a node configured transceiver is in Sleep mode (pins INH1 and INH2 are switched off), it will enter Standby mode or go-to-sleep mode (depending on the level at pin EN). In both modes pin INH1 is switched on, pin INH2 is switched on or off depending on whether the wake flag is set. If no undervoltage is present on pins VIO and VBAT, the transceiver switches immediately to the mode indicated on pins EN and STBN. In Standby, go-to-sleep and Sleep mode pins RXD and RXEN are driven LOW if the wake flag is set.
7.5.2 Star configuration
If a star configured transceiver is in Sleep mode (pins INH1 and INH2 are switched off) it will enter star Idle mode (pins INH1 and INH2 are switched on) if the wake flag is set. In star Idle mode, the transceiver enters the appropriate mode directly, depending on which event has set the wake flag:
* If the wake-up source was pin WAKE or a positive edge on pin STBN, the transceiver
will remain in star Idle mode.
* If the wake-up source was activity detected on pins TRXD0 and TRXD1, the
transceiver will change from star Idle mode to star Transmit mode.
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* If the wake-up source was a wake-up symbol, the transceiver will change from star
Idle mode to star Receive mode.
7.5.3 Bus wake-up
Bus wake-up is detected if two consecutive DATA_0 of at least tdet(wake)DATA_0 separated by an idle or DATA_1 of at least tdet(wake)idle, followed by an idle or DATA_1 of at least tdet(wake)idle are present on the bus lines within tdet(wake)tot.
tdet(wake)tot
0V Vdif -425 mV tdet(wake)Data_0 tdet(wake)idle tdet(wake)Data_0 tdet(wake)idle
001aae442
Fig 7. Bus wake-up timing
7.5.4 Local wake-up via pin WAKE
If the voltage on pin WAKE is lower than Vth(det)(WAKE) for longer than twake(WAKE) (falling edge on pin WAKE) a local wake-up event on pin WAKE is detected. At the same time, the biasing of this pin is switched to pull-down. If the voltage on pin WAKE is higher than Vth(det)(WAKE) for longer than twake, the biasing of this pin is switched to pull-up, and no local wake-up will be detected.
pull-up twake(WAKE) VBAT WAKE 0V
pull-down twake(WAKE)
pull-up
RXD and RXEN
INH1 and INH2
VBAT 0V
001aae443
Sleep mode: VIO and (VBAT or VCC) still provided.
Fig 8. Local wake-up timing via pin WAKE
7.6 Fail silent behavior
In order to be fail silent, undervoltage detection is implemented. An undervoltage will be detected on pins VCC, VIO and VBAT.
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7.6.1 VBAT undervoltage
* Node configuration: If the UVVBAT flag is set the transceiver will enter Sleep mode
(pins INH1 and INH2 are switched off) regardless of the voltage present on pins EN and STBN. If the undervoltage recovers the wake flag will be set and the transceiver will enter the mode determined by the voltages on pins EN and STBN.
* Star configuration: The TJA1080 in star configuration is able to transmit and receive
data as long as VCC and VIO are within their operating range, regardless of the undervoltage on VBAT.
7.6.2 VCC undervoltage
* Node configuration: If the UVVCC flag is set the transceiver will enter the Standby
mode (pin INH2 is switched off) regardless of the voltage present on pins EN and STBN. If the undervoltage recovers or the wake flag is set mode switching via pins EN and STBN is possible.
* Star configuration: If the UVVCC flag is set the transceiver will enter the star Sleep
mode.
7.6.3 VIO undervoltage
* Node configuration: If the voltage on pin VIO is lower than Vuvd(VIO) (even if the UVVIO
flag is reset) pins EN, STBN, TXD and BGE are set LOW (internally) and pin TXEN is set HIGH (internally). If the UVVIO flag is set the transceiver will enter Sleep mode (pins INH1 and INH2 are switched off).
* Star configuration: If an undervoltage is present on pin VIO (even if the UVVIO flag is
reset) pins EN, STBN, TXD and BGE are set LOW (internally) and pin TXEN is set HIGH (internally). If the VIO undervoltage flag is set, pin INH1 is switched off. If an undervoltage is present on pin VIO and VCC is within the operating range, the TJA1080 will forward the received data to all other branches.
7.7 Flags
7.7.1 Local wake-up source flag
The local wake-up source flag can only be set in a low power mode. When a wake-up event on pin WAKE is detected (see Section 7.5.4) it sets the local wake-up source flag. The local wake-up source flag is reset by entering a low power mode.
7.7.2 Remote wake-up source flag
The remote wake-up source flag can only be set in a low power mode. When a bus wake-up event is detected on the bus lines (see Section 7.5.3) it sets the remote wake-up source flag. The remote wake-up source flag is reset by entering a low power mode.
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7.7.3 Wake flag
The wake flag is set if one of the following events occurs:
* * * *
The local or remote wake-up source flag is set (edge sensitive) A positive edge is detected on pin STBN if VIO is present Recovery of the UVVBAT flag (only in node configuration) By recognizing activity on pins TRXD0 and TRXD1 (only in star configuration)
In node configuration the wake flag is reset by entering Normal mode, a low power mode or setting one of the undervoltage flags. In star configuration the wake flag is reset by entering a low power mode or by recovery of the UVVCC signal (without trec(uv)(VCC)).
7.7.4 Power-on flag
The PWON flag is set if the internal supply voltage for the digital part becomes higher than the lowest value it needs to operate. In node configuration, entering Normal mode resets the PWON flag. In star configuration the PWON flag is reset when the UVVCC signal goes LOW (no undervoltage detected).
7.7.5 Node or star configuration flag
Configuration flag set means node configuration.
7.7.6 Temperature medium flag
The temperature medium flag is set if the junction temperature exceeds Tj(warn)(medium) in a normal power mode. The temperature medium flag is reset when the junction temperature becomes lower than Tj(warn)(medium) in a normal power mode. No action will be taken if this flag is set.
7.7.7 Temperature high flag
The temperature high flag is set if the junction temperature exceeds Tj(dis)(high) in a normal power mode. In node configuration the temperature high flag is reset if a negative edge is applied to pin TXEN while the junction temperature is lower than Tj(dis)(high) in a normal power mode. In star configuration mode the temperature high flag is reset by any activity detection (edge) while the junction temperature is lower than Tj(dis)(high) in a normal power mode. If the temperature high flag is set the transmitter is disabled and pins TRXD0 and TRXD1 are switched off.
7.7.8 TXEN_BGE clamped flag
The TXEN_BGE clamped flag is set if pin TXEN is LOW and pin BGE is HIGH for longer than tdetCL(TXEN_BGE). The TXEN_BGE clamped flag is reset if pin TXEN is HIGH or pin BGE is LOW. If the TXEN_BGE flag is set, the transmitter is disabled.
7.7.9 Bus error flag
The bus error flag is set if pin TXEN is LOW and pin BGE is HIGH and the data received from the bus lines (pins BP and BM) is different to that received on pin TXD. The TJA1080 also expects that a data frame begins with a bit value other than the last bit of the previous data frame.
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This is the case for a valid data frame which begins with the DATA_0 period of the Transmission Start Sequence (TSS) and ends with the DATA_1 bit of the Frame End Sequence (FES). Any violation of this frame format will be detected by the TJA1080. Consequently, when transmitting a wake-up pattern, a bus error will be signalled. This error indication should be ignored and the status register should be cleared by reading the vector. No action will be taken if the bus error flag is set.
7.7.10 UVVBAT flag
The UVVBAT flag is set if the voltage on pin VBAT is lower than Vuvd(VBAT). The UVVBAT flag is reset if the voltage is higher than Vuvd(VBAT) or by setting the wake flag; see Section 7.6.1.
7.7.11 UVVCC flag
The UVVCC flag is set if the voltage on pin VCC is lower than Vuvd(VCC) for longer than tdet(uv)(VCC). The flag is reset if the voltage on pin VCC is higher than Vuvd(VCC) for longer than trec(uv)(VCC) or the wake flag is set; see Section 7.6.2.
7.7.12 UVVIO flag
The UVVIO flag is set if the voltage on pin VIO is lower than Vuvd(VIO) for longer than tdet(uv)(VIO). The flag is reset if the voltage on pin VIO is higher than Vuvd(VIO) or the wake flag is set; see Section 7.6.3.
7.7.13 Error flag
The error flag is set if one of the status bits S4 to S12 is set. The error flag is reset if none of the S4 to S12 status bits are set; see Table 11.
7.8 TRXD collision
A TRXD collision is detected when two or more TJA1080s in star configuration enter star Receive mode.
7.9 Status register
The status register can be read out on pin ERRN by using pin EN as clock; the status bits are given in Table 11. The timing diagram is illustrated in Figure 9. The status register is accessible if the UVVIO flag is not set in node or star configuration. A negative edge on pin EN starts the read out. Within the period td(EN-ERRN) after the first edge on pin EN, pin ERRN will go HIGH if it was previously LOW. On the second negative edge on pin EN the first status bit (S0) will be shifted out. The status bits are valid after td(EN-ERRN). If no edge is detected on pin EN for longer than tdet(EN), the transceiver will enter the state selected on pins EN and STBN (node configuration) and status bit S4 to S12 will be reset if the corresponding flag has been reset. Pin ERRN is LOW if the corresponding status bit is set.
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Table 11. S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 S10 S11 S12
Status bits Description local wake-up source flag is redirected to this bit remote wake-up source flag is redirected to this bit node configuration flag is redirected to this bit status bit set means PWON flag has been set previously status bit set means bus error flag has been set previously status bit set means temperature high flag has been set previously status bit set means temperature medium flag has been set previously status bit set means TXEN_BGE clamped flag has been set previously status bit set means UVVBAT flag has been set previously status bit set means UVVCC flag has been set previously status bit set means UVVIO flag has been set previously status bit is set if star Locked mode has been entered previously status bit is set if a TRXD collision has been detected previously LOCAL WAKEUP REMOTE WAKEUP NODE CONFIG PWON BUS ERROR TEMP HIGH TEMP MEDIUM TXEN_BGE CLAMPED UVVBAT UVVCC UVVIO STAR LOCKED TRXD COLLISION
Bit number Status bit
normal
receive only
standby
receive only
normal
STBN tdet(EN) 0.7VIO
0.7VIO 0.3VIO td(stb) td(stb) tdet(EN)
EN TEN 0.7VIO 0.3VIO
0.3VIO td(EN-ERRN) S0 S1 S2
001aae444
ERRN
Fig 9. Timing diagram for status bits
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8. Limiting values
Table 12. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to GND. Symbol VBAT VCC VBUF VIO VINH1 VINH2 VWAKE Io(WAKE) VBGE VTXEN VTXD VERRN VRXD VRXEN VEN VSTBN VTRXD0 VTRXD1 VBP VBM Vtrt Parameter supply voltage on pin VBAT supply voltage supply voltage on pin VBUF supply voltage on pin VIO voltage on pin INH1 voltage on pin INH2 voltage on pin WAKE output current on pin WAKE voltage on pin BGE voltage on pin TXEN voltage on pin TXD voltage on pin ERRN voltage on pin RXD voltage on pin RXEN voltage on pin EN voltage on pin STBN voltage on pin TRXD0 voltage on pin TRXD1 voltage on pin BP voltage on pin BM transient voltage on pins BP and BM on pin VBAT on pin VBAT on pin VBAT Tstg Tvj VESD storage temperature virtual junction temperature electrostatic discharge voltage HBM on pins BP and BM to ground HBM at any other pin MM on all pins CDM on all pins
[1] [2] [3] [4]
[5] [6] [7] [8] [9] [1] [2] [3] [4]
Conditions no time limit operating range no time limit operating range no time limit operating range no time limit operating range
Min -0.3 6.5 -0.3 4.75 -0.3 4.75 -0.3 2.2 -0.3 -0.3 -0.3
Max +60 60 +5.5 5.25 +5.5 5.25 +5.5 5.25 VBAT + 0.3 VBAT + 0.3 VBAT + 0.3 VIO + 0.3 VIO + 0.3 VIO + 0.3 VIO + 0.3 VIO + 0.3 VIO + 0.3 +5.5 +5.5 +5.5 +5.5 +60 +60 +200 +200 60 60 +150 +150 +8.0 +4.0 +200 +1000
Unit V V V V V V V V V V V mA V V V V V V V V V V V V V V V V C C kV kV V V
pin GND not connected no time limit no time limit no time limit no time limit no time limit no time limit no time limit no time limit no time limit no time limit
-15 -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -60 -60 -200 -200 6.5 -55 -40 -8.0 -4.0 -200 -1000
According to ISO 7637, part 3 test pulses a and b; Class C; see Figure 13; RL = 45 ; CL = 100 pF. According to ISO 7637, part 2 test pulses 1, 2, 3a and 3b; Class C; see Figure 13; RL = 45 ; CL = 100 pF. According to ISO 7637, part 2 test pulse 4; Class C; see Figure 13; RL = 45 ; CL = 100 pF. According to ISO 7637, part 2 test pulse 5b; Class C; see Figure 13; RL = 45 ; CL = 100 pF.
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[5]
In accordance with IEC 60747-1. An alternative definition of virtual junction temperature Tvj is: Tvj = Tamb + TD x Rth(j-a), where Rth(j-a) is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation (P) and ambient temperature (Tamb). HBM: C = 100 pF; R = 1.5 k. HBM: C = 100 pF; R = 1.5 k. MM: C = 200 pF; L = 0.75 H; R = 10 . CDM: C = 330 pF; R = 150 .
[6] [7] [8] [9]
9. Thermal characteristics
Table 13. Symbol Rth(j-a) Rth(j-s) Thermal characteristics Parameter thermal resistance from junction to ambient thermal resistance from junction to substrate Conditions in free air in free air Typ 126 Unit K/W K/W
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10. Static characteristics
Table 14. Static characteristics All parameters are guaranteed for VBAT = 6.5 V to 60 V; VCC = 4.75 V to 5.25 V; VBUF = 4.75 V to 5.25 V; VIO = 2.2 V to 5.25 V; Tvj = -40 C to + 150 C; Rbus = 45 ; RTRXD = 200 unless otherwise specified. All voltages are defined with respect to ground; positive currents flow into the IC.[1][2] Symbol Pin VBAT IBAT supply current on pin VBAT low power modes in node configuration star Sleep mode star Standby mode normal power modes Vuvd(VBAT) Pin VCC ICC supply current low power modes Normal mode; VBGE = 0 V; VTXEN = VIO; Receive only mode; star Idle mode Normal mode; VBGE = VIO; VTXEN = 0 V; VBUF open Normal mode; VBGE = VIO; VTXEN = 0 V; Rbus = star Transmit mode star Receive mode Vuvd(VCC) Pin VIO IIO supply current on pin VIO low power modes Normal and Receive only mode; VTXD = VIO Vuvd(VIO) Vuvr(VIO) Vuvhys(VIO) undervoltage detection voltage on pin VIO undervoltage recovery voltage on pin VIO undervoltage hysteresis voltage on pin VIO -1 1 1 25 +1 30 1.5 1.6 +5 1000 2 2.2 A A V V mV undervoltage detection voltage on pin VCC
[3]
Parameter
Conditions
Min 2.75
Typ 35 40 75 0.075 3.8
Max 50 50 150 1 4,5
Unit A A A mA V
undervoltage detection voltage on pin VBAT
-1 -
0 10
+5 15
A mA
2.75
28.5 10 50 38 3.8
35 15 62 42 4.5
mA mA mA mA V
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Table 14. Static characteristics ...continued All parameters are guaranteed for VBAT = 6.5 V to 60 V; VCC = 4.75 V to 5.25 V; VBUF = 4.75 V to 5.25 V; VIO = 2.2 V to 5.25 V; Tvj = -40 C to + 150 C; Rbus = 45 ; RTRXD = 200 unless otherwise specified. All voltages are defined with respect to ground; positive currents flow into the IC.[1][2] Symbol Pin VBUF IBUF supply current on pin VBUF low power modes in node configuration low power modes in star configuration VBUF = 0 V; VCC = 0 V VBUF = 5.25 V Normal mode; VBGE = VIO; VTXEN = 0 V; VBUF = VCC star Transmit mode star Receive mode Normal mode; VBGE = 0 V; VTXEN = VIO; Receive only mode; star Idle mode VBUF(on) on-state voltage on pin VBUF VCC switch is switched on; Normal mode; VBGE = VIO; VTXEN = 0 V; VCC > maximum value of Vuvd(VCC) VCC switch is switched off; low power modes in star configuration; VCC < minimum value of Vuvd(VCC)
[3]
Parameter
Conditions
Min -1
Typ 0
Max +5
Unit A
-40 -1 -
-20 0 26.5 47 35 10
+1 +5 35 62 42 15
A A mA mA mA mA
VCC - 0.25 VCC - 0.05 VCC
V
VBUF(off)
off-state voltage on pin VBUF
4.5
4.9
5.25
V
Pin EN VIH(EN) VIL(EN) IIH(EN) IIL(EN) Pin STBN VIH(STBN) VIL(STBN) IIH(STBN) IIL(STBN) HIGH-level input voltage on pin STBN LOW-level input voltage on pin STBN HIGH-level input current on pin STBN LOW-level input current on pin STBN VSTBN = 0.7VIO VSTBN = 0 V 0.7VIO -0.3 3 -1 0.5VIO 0.5VIO 8 0 5.5 0.3VIO 11 +1 V V A A HIGH-level input voltage on pin EN LOW-level input voltage on pin EN HIGH-level input current on pin EN LOW-level input current on pin EN VEN = 0.7VIO VEN = 0 V 0.7VIO -0.3 3 -1 0.5VIO 0.5VIO 8 0 5.5 0.3VIO 11 +1 V V A A
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Table 14. Static characteristics ...continued All parameters are guaranteed for VBAT = 6.5 V to 60 V; VCC = 4.75 V to 5.25 V; VBUF = 4.75 V to 5.25 V; VIO = 2.2 V to 5.25 V; Tvj = -40 C to + 150 C; Rbus = 45 ; RTRXD = 200 unless otherwise specified. All voltages are defined with respect to ground; positive currents flow into the IC.[1][2] Symbol Pin TXEN VIH(TXEN) VIL(TXEN) IIH(TXEN) IIL(TXEN) IL(TXEN) Pin BGE VIH(BGE) VIL(BGE) IIH(BGE) IIL(BGE) Pin TXD VIH(TXD) VIL(TXD) IIH(TXD) IIL(TXD) HIGH-level input voltage on pin TXD LOW-level input voltage on pin TXD HIGH-level input current on pin TXD LOW-level input current on pin TXD input leakage current on pin TXD normal power modes normal power modes VTXD = VIO normal power modes; VTXD = 0 V low power modes ILI(TXD) Pin RXD IOH(RXD) IOL(RXD) Pin ERRN IOH(ERRN) HIGH-level output current node configuration; on pin ERRN VERRN = VIO - 0.4 V; VIO = VCC star configuration; VERRN = VIO - 0.4 V; VIO = VCC
TJA1080_1
Parameter HIGH-level input voltage on pin TXEN LOW-level input voltage on pin TXEN HIGH-level input current on pin TXEN LOW-level input current on pin TXEN leakage current on pin TXEN HIGH-level input voltage on pin BGE LOW-level input voltage on pin BGE HIGH-level input current on pin BGE LOW-level input current on pin BGE
Conditions
Min 0.7VIO -0.3
Typ 0.5VIO 0.5VIO 0 -9 0
Max VIO + 0.3 0.3VIO +1 -3 +1
Unit V V A A A
VTXEN = VIO VTXEN = 0.3VIO VTXEN = 5.25 V; VIO = 0 V
-1 -12 -1
0.7VIO -0.3 VBGE = 0.7VIO VBGE = 0 V 3 -1
0.5VIO 0.5VIO 8 0
VIO + 0.3 0.3VIO 11 +1
V V A A
0.7VIO -0.3 70 -5 -1 -1
0.5VIO 0.5VIO 300 0 0 0
VIO + 0.3 0.3VIO 650 +5 +1 +1
V V A A A A
VTXD = 5.25 V; VIO = 0 V
HIGH-level output current VRXD = VIO - 0.4 V; VIO = VCC on pin RXD LOW-level output current on pin RXD VRXD = 0.4 V
-2 2
-4 7
-15 20
mA mA
-1500
-550
-100
A
-1
0
+1
A
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Table 14. Static characteristics ...continued All parameters are guaranteed for VBAT = 6.5 V to 60 V; VCC = 4.75 V to 5.25 V; VBUF = 4.75 V to 5.25 V; VIO = 2.2 V to 5.25 V; Tvj = -40 C to + 150 C; Rbus = 45 ; RTRXD = 200 unless otherwise specified. All voltages are defined with respect to ground; positive currents flow into the IC.[1][2] Symbol IOL(ERRN) Pin RXEN IOH(RXEN) IOL(RXEN) HIGH-level output current VRXEN = VIO - 0.4 V; on pin RXEN VIO = VCC LOW-level output current on pin RXEN HIGH-level input voltage on pin TRXD0 LOW-level input voltage on pin TRXD0 LOW-level output voltage on pin TRXD0 HIGH-level input voltage on pin TRXD1 LOW-level input voltage on pin TRXD1 LOW-level output voltage on pin TRXD1 idle output voltage on pin BP VRXEN = 0.4 V -4 1 -1.5 3 -0.5 8 mA mA Parameter LOW-level output current on pin ERRN Conditions VERRN = 0.4 V Min 300 Typ 700 Max 1500 Unit A
Pins TRXD0 and TRXD1 VIH(TRXD0) VIL(TRXD0) VOL(TRXD0) VIH(TRXD1) VIL(TRXD1) VOL(TRXD1) star Idle and star Transmit mode star Idle and star Transmit mode Rpu = 200 star Idle and star Transmit mode star Idle and star Transmit mode Rpu = 200 0.7VBUF -0.3 -0.3 0.7VBUF -0.3 -0.3 0.5VBUF 0.5VBUF +0.3 0.5VBUF 0.5VBUF +0.3 VBUF + 0.3 V 0.3VBUF +0.8 V V
VBUF + 0.3 V 0.3VBUF +0.8 V V
Pins BP and BM Vo(idle)(BP) Normal, Receive only, star Idle, star Transmit and star Receive mode; VTXEN = VIO Standby, go-to-sleep, Sleep, star Standby and star Sleep mode Vo(idle)(BM) idle output voltage on pin BM Normal, receive only, star Idle, star Transmit and star Receive mode; VTXEN = VIO Standby, go to sleep, Sleep, star Standby and star Sleep mode Io(idle)BP Io(idle)BM Vo(idle)(dif) VOH(dif) VOL(dif) idle output current on pin BP idle output current on pin BM differential idle output voltage differential HIGH-level output voltage differential LOW-level output voltage 40 < Rbus < 55 ; VCC = VBUF = 5 V 40 < Rbus < 55 ; VCC = VBUF = 5 V -60 V < |VBP| < +60 V -60 V < |VBM| < +60 V 0.4VBUF 0.5VBUF 0.6VBUF V
-0.1
0
+0.1
V
0.4VBUF
0.5VBUF
0.6VBUF
V
-0.1
0
+0.1
V
1 1 -25 600 -1200
3 3 0 800 -800
7.5 7.5 +25 1200 -600
mA mA mV mV mV
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FlexRay transceiver
Table 14. Static characteristics ...continued All parameters are guaranteed for VBAT = 6.5 V to 60 V; VCC = 4.75 V to 5.25 V; VBUF = 4.75 V to 5.25 V; VIO = 2.2 V to 5.25 V; Tvj = -40 C to + 150 C; Rbus = 45 ; RTRXD = 200 unless otherwise specified. All voltages are defined with respect to ground; positive currents flow into the IC.[1][2] Symbol VIH(dif) Parameter differential HIGH-level input voltage differential LOW-level input voltage Conditions normal power modes; -10 V < VBP < +15 V; -10 V < VBM < +15 V normal power modes; -10 V < VBP < +15 V; -10 V < VBM < +15 V low power modes; -10 V < VBP < +15 V; -10 V < VBM < +15 V |Vi(dif)det(act)| activity detection differential input voltage (absolute value) short-circuit output current on pin BP (absolute value) short-circuit output current on pin BM (absolute value) input resistance on pin BM differential input resistance between pin BP and pin BM input leakage current on pin BP input leakage current on pin BM normal power modes Min 150 Typ 225 Max 300 Unit mV
VIL(dif)
-300
-225
-150
mV
-400
-225
-125
mV
150
225
300
mV
|Io(sc)(BP)|
VBP = 0 V, 60 V
10
20
30
mA
|Io(sc)(BM)|
VBM = 0 V, 60 V
10
20
30
mA
Ri(BP) Ri(BM) Ri(dif)(BP-BM)
input resistance on pin BP Idle level; Rbus = Idle level; Rbus = Idle level; Rbus =
10 10 20
20 20 40
40 40 80
k k k
ILI(BP) ILI(BM)
VBP = 5 V; VBAT = VCC = VIO = 0 V VBM = 5 V; VBAT = VCC = VIO = 0 V Rbus = 45 Rbus = 45 Rbus = 45
-10 -10 0.4VBUF 0.4VBUF -25
0 0 0.5VBUF 0.5VBUF 0
+10 +10 0.6VBUF 0.6VBUF +25
A A V V mV
Vcm(bus)(DATA_0) DATA_0 bus common mode voltage Vcm(bus)(DATA_1) DATA_1 bus common mode voltage Vcm(bus) Pin INH1 VOH(INH1) IL(INH1) IOL(INH1) bus common mode voltage difference
HIGH-level output voltage IINH1 = -0.2 mA on pin INH1 leakage current on pin INH1 LOW-level output current on pin INH1 Sleep mode VINH1 = 0 V
VBAT - 0.8 -5 -15
VBAT - 0.3 0 -8
VBAT +5 -
V A mA
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FlexRay transceiver
Table 14. Static characteristics ...continued All parameters are guaranteed for VBAT = 6.5 V to 60 V; VCC = 4.75 V to 5.25 V; VBUF = 4.75 V to 5.25 V; VIO = 2.2 V to 5.25 V; Tvj = -40 C to + 150 C; Rbus = 45 ; RTRXD = 200 unless otherwise specified. All voltages are defined with respect to ground; positive currents flow into the IC.[1][2] Symbol Pin INH2 VOH(INH2) IL(INH2) IOL(INH2) Pin WAKE Vth(det)(WAKE) IIL(WAKE) IIH(WAKE) detection threshold voltage on pin WAKE LOW-level input current on pin WAKE HIGH-level input current on pin WAKE medium warning junction temperature high disable junction temperature low power mode VWAKE = 2.4 V for t > twake(WAKE) VWAKE = 4.6 V for t > twake(WAKE) 2.5 3 -11 3.7 6.5 -6.5 4.5 11 -3 V A A HIGH-level output voltage IINH2 = -0.2 mA on pin INH2 leakage current on pin INH2 LOW-level output current on pin INH2 Sleep mode VINH2 = 0 V VBAT - 0.8 -5 -15 VBAT - 0.3 0 -8 VBAT +5 V A mA Parameter Conditions Min Typ Max Unit
Temperature protection Tj(warn)(medium) Tj(dis)(high) 155 180 165 190 175 200 C C
[1]
All parameters are guaranteed over the virtual junction temperature range by design, but only 100 % are tested at 125 C for dies on wafer level (pre-testing) and above this for cased products 100 % are tested at Tamb = -40 C and +25 C (final testing) unless otherwise specified. Both pre-testing and final testing use correlated test conditions to cover the specified temperature and power supply voltage range. For bare dies all parameters are only guaranteed with the backside of the bare die connected to ground. At power-up VBAT should be supplied first. When VBAT reaches 6.5 V, VCC and VIO may be switched on with a delay of at least 60 s with respect to VBAT. Current flows from VCC to VBUF. This means that the maximum sum current ICC + IBUF is 35 mA.
[2] [3]
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FlexRay transceiver
11. Dynamic characteristics
Table 15. Dynamic characteristics All parameters are guaranteed for VBAT = 6.5 V to 60 V; VCC = 4.75 V to 5.25 V; VBUF = 4.75 V to 5.25 V; VIO = 2.2 V to 5.25 V; Tvj = -40 C to + 150 C; Rbus = 45 ; RTRXD = 200 unless otherwise specified. All voltages are defined with respect to ground; positive currents flow into the IC[1]. Symbol Pins BP and BM td(TXD-bus) delay time from TXD to bus Normal or star Transmit mode DATA_0 DATA_1 td(TXD-bus) delay time difference from TXD to bus delay time from TRXD to bus Normal or star Transmit mode; between DATA_0 and DATA_1 star Transmit mode DATA_0 DATA_1 td(TRXD-bus) delay time difference from TRXD star Transmit mode; to bus between DATA_0 and DATA_1 delay time from bus to RXD normal or star Transmit mode; CRXD = 15 pF; see Figure 11 DATA_0 DATA_1 td(bus-RXD) delay time difference from bus to normal or star Transmit RXD mode; CRXD = 15 pF; between DATA_0 and DATA_1; see Figure 11 delay time from bus to TRXD star Receive mode; see Figure 11 DATA_0 DATA_1 td(bus-TRXD) delay time difference from bus to star Receive mode; TRXD between DATA_0 and DATA_1; see Figure 11 delay time from TXEN to bus idle delay time from TXEN to bus active delay time from BGE to bus active bus differential rise time bus differential fall time Normal mode Normal mode
[4] [3][4] [2] [2]
Parameter
Conditions
Min
Typ
Max
Unit
-
31 32 1
50 50 4
ns ns ns
td(TRXD-bus)
[3]
-
27 28 1
50 50 5
ns ns ns
td(bus-RXD)
-
28 30 2
50 50 5
ns ns ns
td(bus-TRXD)
-
28 28 0
50 50 5
ns ns ns
td(TXEN-busidle) td(TXEN-busact) td(BGE-busidle) td(BGE-busact) tr(dif)(bus) tf(dif)(bus)
8 8
28 22 30 22 12 12
50 50 50 50 23 23
ns ns ns ns ns ns
delay time from BGE to bus idle Normal mode Normal mode 10 % to 90 %; RL = 45 ; CL = 100 pF 90 % to 10 %; RL = 45 ; CL = 100 pF
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FlexRay transceiver
Table 15. Dynamic characteristics ...continued All parameters are guaranteed for VBAT = 6.5 V to 60 V; VCC = 4.75 V to 5.25 V; VBUF = 4.75 V to 5.25 V; VIO = 2.2 V to 5.25 V; Tvj = -40 C to + 150 C; Rbus = 45 ; RTRXD = 200 unless otherwise specified. All voltages are defined with respect to ground; positive currents flow into the IC[1]. Symbol tdet(wake)DATA_0 tdet(wake)idle tdet(wake)tot Undervoltage tdet(uv)(VCC) trec(uv)(VCC) tdet(uv)(VIO) tto(uv)(VCC) undervoltage detection time on pin VCC undervoltage recovery time on pin VCC undervoltage detection time on pin VIO undervoltage time-out time on pin VCC for entering Standby mode activity detection time on pin TXEN activity detection time on pin TRXD activity detection time on bus pins star configuration; wake flag is set 100 1 100 432 670 5.2 670 900 ms ms ms s Parameter Conditions Min 1 1 50 Typ 2.2 2.5 Max 4 4 115 Unit s s s WAKE symbol detection DATA_0 wake-up detection time Standby, Sleep, star Standby or star Sleep idle wake-up detection time mode; total wake-up detection time -10 V < VBP < +15 V; -10 V < VBM < +15 V
Activity detection tdet(act)(TXEN) tdet(act)(TRXD) tdet(act)(bus) tdet(idle)(TXEN) tdet(idle)(TRXD) tdet(idle)(bus) Star modes tto(idle-sleep) tto(tx-locked) tto(rx-locked) tto(locked-sleep) tto(locked-idle) Node modes td(STBN-RXD) td(STBN-INH2) th(gotosleep) Status register tdet(EN) TEN td(EN-ERRN) detection time on pin EN time period on pin EN delay time from EN to ERRN for mode control for reading status bits for reading status bits 20 4 0.8 80 20 2 s s s STBN to RXD delay time STBN to INH2 delay time go-to-sleep hold time wake flag set 20 1 3 35 2 10 50 s s s idle to sleep time-out time transmit to locked time-out time receive to locked time-out time locked to sleep time-out time locked to idle time-out time 640 2600 2600 64 1.4 2660 10400 10400 333 5.1 ms s s ms s star configuration star configuration Vdif: 0 400 mV 100 100 100 100 50 100 140 140 150 140 75 150 200 200 250 200 100 250 ns ns ns ns ns ns
idle detection time on pin TXEN star configuration idle detection time on pin TRXD star configuration idle detection time on bus pins Vdif: 400 mV 0
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FlexRay transceiver
Table 15. Dynamic characteristics ...continued All parameters are guaranteed for VBAT = 6.5 V to 60 V; VCC = 4.75 V to 5.25 V; VBUF = 4.75 V to 5.25 V; VIO = 2.2 V to 5.25 V; Tvj = -40 C to + 150 C; Rbus = 45 ; RTRXD = 200 unless otherwise specified. All voltages are defined with respect to ground; positive currents flow into the IC[1]. Symbol WAKE twake(WAKE) wake-up time on pin WAKE low power mode; falling edge on pin WAKE; 6.5 V < VBAT < 27 V low power mode; falling edge on pin WAKE; 27 V < VBAT < 60 V Miscellaneous tdetCL(TXEN_BGE) TXEN_BGE clamp detection time
[1] [2] [3] [4]
Parameter
Conditions
Min 5
Typ 25
Max 100
Unit s
25
75
175
s
2600
-
10400
s
At power-up VBAT should be supplied first. When VBAT reaches 6.5 V, VCC and VIO may be switched on with a delay of at least 60 s with respect to VBAT. Rise and fall time (10 % to 90 %) of tr(TXD) and tf(TXD) = 5 ns. Rise and fall time (10 % to 90 %) of tr(TRXD) and tf(TRXD) = 5 ns. The worst case asymmetry from one branch to another is the sum of the delay difference from TRXD0 and TRXD1 to DATA_0 and DATA_1 plus the delay difference from DATA_0 and DATA_1 to TRXD0 and TRXD1. The TJA1080 should not be used in topologies with cascaded stars.
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xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
Preliminary data sheet Rev. 01 -- 20 July 2006
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Philips Semiconductors
td(TXD-bus) td(TXD-bus) 0.7VIO TXD 0.3VIO td(TXEN-busidle)
td(TXEN-busact) td(BGE-busidle)
td(BGE-busact)
0.7VIO TXEN 0.3VIO
0.7VIO BGE 0.3VIO
BP and BM
+300 mV 0V -300 mV
90 % -150 mV -300 mV -150 mV -300 mV 10 %
0.7VIO RXEN 0.3VIO
0.7VIO RXD 0.3VIO td(bus-RXD) td(bus-RXD) tdet(idle)(bus) tdet(act)(bus) tdet(idle)(bus) tdet(act)(bus) tr(dif)(bus) tf(dif)(bus)
001aae445
Fig 10. Detailed timing diagram in node configuration
FlexRay transceiver
TJA1080
36 of 44
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FlexRay transceiver
Vdif (mV) 600
22.5 ns
22.5 ns
300
57.5 ns -300 -600 80 ns RXD td(bus-RXD) td(bus-RXD)
Vdif (mV) 600
22.5 ns
22.5 ns
300
57.5 ns -300 -600 80 ns RXD td(bus-RXD) td(bus-RXD)
001aae446
Vdif is the receiver test signal.
Fig 11. Receiver test signal
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FlexRay transceiver
12. Test information
+12 V +5 V
100 nF 10 F 22 F
4 VIO
19 VCC
14 VBAT
20 VBUF BP 18
RL CL
TJA1080
BM
17
RXD
7
15 pF
001aae447
Fig 12. Test circuit for dynamic characteristics
ISO 7637 PULSE GENERATOR
12 V or 42 V
+5 V
100 nF 10 F 10 F
4 VIO
19 VCC
14 VBAT
20 VBUF BP 18
RL 1 nF
TJA1080
BM 17
CL
ISO 7637 PULSE GENERATOR
001aae448
1 nF
The waveforms of the applied transients are in accordance with ISO 7637, test pulses 1, 2, 3a, 3b, 4 and 5. Test conditions: Normal mode: bus idle Normal mode: bus active; TXD at 5 MHz and TXEN at 1 kHz
Fig 13. Test circuit for automotive transients
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FlexRay transceiver
13. Package outline
SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm SOT339-1
D
E
A X
c y HE vMA
Z 20 11
Q A2 pin 1 index A1 (A 3) Lp L 1 e bp 10 wM detail X A
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2 A1 0.21 0.05 A2 1.80 1.65 A3 0.25 bp 0.38 0.25 c 0.20 0.09 D (1) 7.4 7.0 E (1) 5.4 5.2 e 0.65 HE 7.9 7.6 L 1.25 Lp 1.03 0.63 Q 0.9 0.7 v 0.2 w 0.13 y 0.1 Z (1) 0.9 0.5 8 o 0
o
Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION SOT339-1 REFERENCES IEC JEDEC MO-150 JEITA EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-19
Fig 14. Package outline SOT339-1 (SSOP20)
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FlexRay transceiver
14. Soldering
14.1 Introduction to soldering surface mount packages
There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended.
14.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 seconds and 200 seconds depending on heating method. Typical reflow temperatures range from 215 C to 260 C depending on solder paste material. The peak top-surface temperature of the packages should be kept below:
Table 16. SnPb eutectic process - package peak reflow temperatures (from J-STD-020C July 2004) Volume mm3 < 350 240 C + 0/-5 C 225 C + 0/-5 C Volume mm3 350 225 C + 0/-5 C 225 C + 0/-5 C
Package thickness < 2.5 mm 2.5 mm Table 17.
Pb-free process - package peak reflow temperatures (from J-STD-020C July 2004) Volume mm3 < 350 260 C + 0 C 260 C + 0 C 250 C + 0 C Volume mm3 350 to 2000 260 C + 0 C 250 C + 0 C 245 C + 0 C Volume mm3 > 2000 260 C + 0 C 245 C + 0 C 245 C + 0 C
Package thickness < 1.6 mm 1.6 mm to 2.5 mm 2.5 mm
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
14.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results:
* Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
* For packages with leads on two sides and a pitch (e):
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- larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end.
* For packages with leads on four sides, the footprint must be placed at a 45 angle to
the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
14.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 seconds to 5 seconds between 270 C and 320 C.
14.5 Package related soldering information
Table 18. Package[1] BGA, HTSSON..T[3], LBGA, LFBGA, SQFP, SSOP..T[3], TFBGA, VFBGA, XSON DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC[5], SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO, VSSOP CWQCCN..L[8],
[1] [2]
Suitability of surface mount IC packages for wave and reflow soldering methods Soldering method Wave not suitable not suitable[4] Reflow[2] suitable suitable
suitable not not WQCCN..L[8] recommended[5][6] recommended[7]
suitable suitable suitable not suitable
PMFP[9],
not suitable
For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your Philips Semiconductors sales office. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods.
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FlexRay transceiver
[3]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 C 10 C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. Hot bar soldering or manual soldering is suitable for PMFP packages.
[4]
[5] [6] [7] [8]
[9]
15. Abbreviations
Table 19. CAN CDM EMC EME EMI ESD HBM MM PWON Abbreviations Description Communications Area Network Charge Device Model ElectroMagnetic Compatibility ElectroMagnetic Emission ElectroMagnetic Interference ElectroStatic Discharge Human Body Model Machine Model Power-on Abbreviation
16. References
[1] [2] [3] EPL -- FlexRay Communications System Electrical Physical Layer Specification Version 2.1 Rev. A, FlexRay Consortium, Dec 2005 PS41 -- Product Specification: TJA1041; High speed CAN transceiver, www.semiconductors.philips.com PS54 -- Product Specification: TJA1054; Fault-tolerant CAN transceiver, www.semiconductors.philips.com
17. Revision history
Table 20. TJA1080_1 Revision history Release date 20060720 Data sheet status Objective data sheet Change notice Supersedes Document ID
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FlexRay transceiver
18. Legal information
18.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.semiconductors.philips.com.
18.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. Philips Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local Philips Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
malfunction of a Philips Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. Philips Semiconductors accepts no liability for inclusion and/or use of Philips Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- Philips Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.semiconductors.philips.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by Philips Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
18.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, Philips Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- Philips Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- Philips Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
19. Contact information
For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
TJA1080_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 20 July 2006
43 of 44
Philips Semiconductors
TJA1080
FlexRay transceiver
20. Contents
1 2 2.1 2.2 2.3 2.4 3 4 5 6 6.1 6.2 7 7.1 7.1.1 7.1.2 7.1.3 7.2 7.2.1 7.2.2 7.2.3 7.2.4 7.2.5 7.3 7.3.1 7.3.2 7.3.3 7.3.4 7.3.5 7.3.6 7.4 7.4.1 7.4.2 7.5 7.5.1 7.5.2 7.5.3 7.5.4 7.6 7.6.1 7.6.2 7.6.3 7.7 7.7.1 7.7.2 7.7.3 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Optimized for time triggered communication systems. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Low power management . . . . . . . . . . . . . . . . . 2 Diagnosis (detection and signalling) . . . . . . . . . 2 Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pinning information . . . . . . . . . . . . . . . . . . . . . . 5 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 Functional description . . . . . . . . . . . . . . . . . . . 6 Operating configurations. . . . . . . . . . . . . . . . . . 6 Node configuration . . . . . . . . . . . . . . . . . . . . . . 6 Star configuration . . . . . . . . . . . . . . . . . . . . . . . 6 Bus activity and idle detection . . . . . . . . . . . . . 7 Operating modes in node configuration . . . . . . 7 Normal mode . . . . . . . . . . . . . . . . . . . . . . . . . 14 Receive only mode . . . . . . . . . . . . . . . . . . . . . 14 Standby mode. . . . . . . . . . . . . . . . . . . . . . . . . 14 Go-to-sleep mode . . . . . . . . . . . . . . . . . . . . . . 14 Sleep mode. . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Operating modes in star configuration . . . . . . 15 Star Idle mode . . . . . . . . . . . . . . . . . . . . . . . . 17 Star Transmit mode. . . . . . . . . . . . . . . . . . . . . 18 Star Receive mode . . . . . . . . . . . . . . . . . . . . . 18 Star Standby mode . . . . . . . . . . . . . . . . . . . . . 18 Star Sleep mode . . . . . . . . . . . . . . . . . . . . . . . 18 Star Locked mode. . . . . . . . . . . . . . . . . . . . . . 19 Start-up. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Node configuration . . . . . . . . . . . . . . . . . . . . . 19 Star configuration . . . . . . . . . . . . . . . . . . . . . . 19 Wake-up mechanism . . . . . . . . . . . . . . . . . . . 19 Node configuration . . . . . . . . . . . . . . . . . . . . . 19 Star configuration . . . . . . . . . . . . . . . . . . . . . . 19 Bus wake-up . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Local wake-up via pin WAKE . . . . . . . . . . . . . 20 Fail silent behavior . . . . . . . . . . . . . . . . . . . . . 20 VBAT undervoltage. . . . . . . . . . . . . . . . . . . . . . 21 VCC undervoltage . . . . . . . . . . . . . . . . . . . . . . 21 VIO undervoltage. . . . . . . . . . . . . . . . . . . . . . . 21 Flags . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Local wake-up source flag . . . . . . . . . . . . . . . 21 Remote wake-up source flag . . . . . . . . . . . . . 21 Wake flag . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 7.7.4 7.7.5 7.7.6 7.7.7 7.7.8 7.7.9 7.7.10 7.7.11 7.7.12 7.7.13 7.8 7.9 8 9 10 11 12 13 14 14.1 14.2 14.3 14.4 14.5 15 16 17 18 18.1 18.2 18.3 18.4 19 20 Power-on flag . . . . . . . . . . . . . . . . . . . . . . . . . Node or star configuration flag . . . . . . . . . . . . Temperature medium flag . . . . . . . . . . . . . . . Temperature high flag . . . . . . . . . . . . . . . . . . TXEN_BGE clamped flag. . . . . . . . . . . . . . . . Bus error flag . . . . . . . . . . . . . . . . . . . . . . . . . UVVBAT flag. . . . . . . . . . . . . . . . . . . . . . . . . . . UVVCC flag . . . . . . . . . . . . . . . . . . . . . . . . . . . UVVIO flag. . . . . . . . . . . . . . . . . . . . . . . . . . . . Error flag . . . . . . . . . . . . . . . . . . . . . . . . . . . . TRXD collision . . . . . . . . . . . . . . . . . . . . . . . . Status register . . . . . . . . . . . . . . . . . . . . . . . . Limiting values . . . . . . . . . . . . . . . . . . . . . . . . Thermal characteristics . . . . . . . . . . . . . . . . . Static characteristics . . . . . . . . . . . . . . . . . . . Dynamic characteristics . . . . . . . . . . . . . . . . . Test information. . . . . . . . . . . . . . . . . . . . . . . . Package outline . . . . . . . . . . . . . . . . . . . . . . . . Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . Manual soldering . . . . . . . . . . . . . . . . . . . . . . Package related soldering information . . . . . . Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . References . . . . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . Legal information . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information . . . . . . . . . . . . . . . . . . . . Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 22 22 22 22 22 23 23 23 23 23 23 25 26 27 33 38 39 40 40 40 40 41 41 42 42 42 43 43 43 43 43 43 44
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) Koninklijke Philips Electronics N.V. 2006.
All rights reserved.
For more information, please visit: http://www.semiconductors.philips.com. For sales office addresses, email to: sales.addresses@www.semiconductors.philips.com. Date of release: 20 July 2006 Document identifier: TJA1080_1


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