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Micrel ULTRA-PRECISION DIFFERENTIAL LVPECL 2:1 MUX with INTERNAL TERMINATION Precision EdgeTM SY58018U Precision EdgeTM SY58018U FEATURES s Guaranteed AC performance over temperature and voltage: * DC to 5Gbps data throughput * DC to > 4GHz fMAX (clock) * < 260ps propagation delay * < 110ps tr / tf times s Ultra-low crosstalk-induced jitter: 0.7psrms s Ultra-low jitter design: * < 1psrms random jitter * < 10psp-p deterministic jitter * < 10psp-p total jitter (clock) s Unique input termination and VT pin accepts DCcoupled and AC-coupled inputs (CML, PECL, LVDS) s 800mV (100k) LVPECL output swing s Power supply 2.5V 5% or 3.3V 10% s -40C to +85C temperature range s Available in 16-pin (3mm x 3mm) MLFTM package Precision EdgeTM DESCRIPTION The SY58018U is a 2.5V/3.3V precision, high-speed, 2:1 differential MUX capable of handling clocks up to 4GHz and data up to 5Gbps. The differential input includes Micrel's unique, 3-pin input termination architecture that allows customers to interface to any differential signal (AC- or DC-coupled) as small as 100mV without any level shifting or termination resistor networks in the signal path. The outputs are 800mV, 100k compatible, LVPECL, with extremely fast rise/fall times guaranteed to be less than 110ps. The SY58018U operates from a 2.5V 5% supply or a 3.3V 10% supply and is guaranteed over the full industrial temperature range of -40C to +85C. For applications that require CML outputs, consider the SY58017U or for 400mV LVPECL outputs the SY58019U. The SY58018U is part of Micrel's high-speed, Precision EdgeTM product line. All support documentation can be found on Micrel's web site at www.micrel.com. APPLICATIONS s s s s Redundant clock distribution SONET/SDH clock/data distribution Loopback Fibre Channel distribution FUNCTIONAL BLOCK DIAGRAM IN0 50 VT0 50 /IN0 MUX IN1 50 VT1 50 /IN1 1 S 0 TYPICAL PERFORMANCE 5Gbps Output /Q0 SEL (TTL/CMOS) Output Swing (200mV/div.) Q0 TIME (25ps/div.) (223--1PRBS) Precision Edge is a trademark of Micrel, Inc. AnyGate is a registered trademark of Micrel, Inc. MicroLeadFrame and MLF are trademarks of Amkor Technology, Inc. M0643-012704 Rev.: A Amendment: /0 1 Issue Date: Jan. 2004 Micrel Precision EdgeTM SY58018U PACKAGE/ORDERING INFORMATION VT0 GND GND VCC Ordering Information(1) Part Number Package Type MLF-16 MLF-16 Operating Range Industrial Industrial Package Marking 018U 018U 16 15 14 13 IN0 /IN0 IN1 /IN1 1 2 3 4 5678 12 11 10 9 Q GND GND /Q SY58018UMI SY58018UMITR(2) Notes: 1. Contact factory for die availability. Dice are guaranteed at TA = 25C, DC electricals only. 2. Tape and Reel. 16-Pin MLFTM PIN DESCRIPTION Pin Number 1, 2 3, 4 Pin Name IN0, /IN0 IN1, /IN1 Pin Function Differential Input: These input pairs are the differential signal inputs to the device. They accept differential AC- or DC-coupled signals as small as 100mV. Each pin of a pair internally terminates to a VT pin through 50. Note that these inputs will default to an indeterminate state if left open. Please refer to the "Input Interface Applications" section for more details. Input Termination Center-Tap: Each side of the differential input pair terminates to a VT pin. The VT0 and VT1 pins provide a center-tap to a termination network for maximum interface flexibility. See "Input Interface Applications" section for more details. This single-ended TTL/CMOS compatible input selects the inputs to the multiplexer. Note that this input is internally connected to a 25k pull-up resistor and will default to a logic HIGH state if left open. No connect. Positive Power Supply: Bypass with 0.1F0.01F low ESR capacitors. 0.01F capacitor should be as close to VCC pin as possible. Differential Outputs: This 100k compatible LVPECL output pair is the output of the device. Normally terminate with 50 to VCC - 2V. See "Output Interface Applications" section. It is a logic function of the IN0, IN1, and SEL inputs. Please refer to the "Truth Table" for details. Ground. Ground pins and exposed pad must be connected to the same ground plane. 16, 5 VT0, VT1 6 7 8, 13 12, 9 10, 11, 14, 15 GND, Exposed Pad TRUTH TABLE SEL 0 1 Output CH0 Input Selected CH1 Input Selected M0643-012704 VT1 SEL NC VCC SEL NC VCC Q, /Q 2 Micrel Precision EdgeTM SY58018U Absolute Maximum Ratings(1) Power Supply Voltage (VCC ) ...................... -0.5V to +4.0V Input Voltage (VIN) ......................................... -0.5V to VCC LVPECL Output Current (IOUT) Continuous ............................................................. 50mA Surge .................................................................... 100mA Termination Current(3) Source or Sink Current on VT pin ....................... 100mA Input Current Source or Sink Current on IN, /IN pin ................... 50mA Lead Temperature (soldering, 10 sec.) ..................... 265C Storage Temperature Range (TS ) ........... -65C to +150C Operating Ratings(2) Power Supply Voltage (VCC) ............... +2.375V to +2.625V ............................................................ +3.0V to +3.6V Ambient Temperature Range (TA) ............. -40C to +85C Package Thermal Resistance(4) MLFTM (JA) Still-Air ............................................................. 60C/W MLFTM (JB) Junction-to-Board ............................................ 38C/W DC ELECTRICAL CHARACTERISTICS(5) TA= -40C to +85C, unless otherwise stated. Symbol VCC ICC RDIFF_IN RIN Parameter Power Supply Voltage Power Supply Current Differential Input Resistance (IN0-to-/IN0, IN1-to-/IN1) Input Resistance (IN0-to-VT0, /IN0-to-VT0, IN1-to-VT1, /IN1-to-VT1) Input HIGH Voltage (IN0, /IN0, IN1, /IN1) Input LOW Voltage (IN0, /IN0, IN1, /IN1) Input Voltage Swing (IN0, /IN0, IN1, /IN1) Differential Input Voltage Swing |IN0, /IN0|, |IN1, /IN1| IN to VT (IN0, /IN0, IN1, /IN1) See Figure 1a See Figure 1b Note 6 Condition VCC = 2.5V VCC = 3.3V No load, max. VCC 80 40 Min 2.375 3.0 Typ 2.5 3.3 50 100 50 Max 2.625 3.6 65 120 60 Units V V mA VIH VIL VIN VDIFF_IN VT IN Notes: VCC - 1.6 0 100 200 VCC VIH - 0.1 1700 V V mV mV 1.28 V 1. Permanent device damage may occur if "Absolute Maximum Ratings" are exceeded. This is a stress rating only and functional operation is not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to "Absolute Maximum Ratings" conditions for extended periods may affect device reliability. 2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings. 3. Due to the limited drive capability, use for input of the same package only. 4. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device's most negative potential (GND) on the PCB. JB uses 4-layer JA in still-air number, unless otherwise stated. 5. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. 6. VIH (min) not lower than 1.2V. M0643-012704 3 Micrel Precision EdgeTM SY58018U LVPECL OUTPUT DC ELECTRICAL CHARACTERISTICS(7) VCC = 2.5V 5% or 3.3V 10%; TA= -40C to +85C; RL = 50 to VCC-2V, unless otherwise stated. Symbol VOH VOL VOUT VDIFF_OUT Parameter Output HIGH Voltage Q, /Q Output LOW Voltage Q, /Q Output Differential Swing Q, /Q Differential Output Voltage Swing Q, /Q See Figure 1a See Figure 1b Condition Min VCC - 1.145 VCC - 1.945 550 1100 800 1600 Typ Max VCC - 0.895 VCC - 1.695 Units V V mV mV LVTTL/CMOS DC ELECTRICAL CHARACTERISTICS(7) VCC = 2.5V 5% or 3.3V 10%; TA= -40C to 85C Symbol VIH VIL IIH IIL Note: 7. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. Parameter Input HIGH Voltage Input LOW Voltage Input HIGH Current Input LOW Current Condition Min 2.0 Typ Max Units V 0.8 40 -300 V A A M0643-012704 4 Micrel Precision EdgeTM SY58018U AC ELECTRICAL CHARACTERISTICS(8) VCC = 2.5V 5% or 3.3V 10%; TA= -40C to 85C, RL = 50 to VCC - 2V, unless otherwise stated. Symbol fMAX tpd Parameter Maximum Operating Frequency VOUT 400mV Differential Propagation Delay (IN0 or IN1-to-Q) (SEL-to-Q) Differential Propagation Delay Temperature Coefficient Input-to-Input Skew Part-to-Part Skew tJITTER Data Clock Random Jitter Deterministic Jitter Cycle-to-Cycle Jitter Total Jitter Crosstalk-Induced Jitter Note 15 tr, tf Notes: 8. 9. High frequency AC parameters are guaranteed by design and characterization. Input-to-input skew is the difference in time from and input-to-output in comparison to any other input-to-output. In addition, the input-to-input skew does not include the output skew. Condition NRZ Data Clock Min 5 Typ Max Units Gbps 4 110 50 190 180 75 240 350 GHz ps ps fs/C 15 100 1 10 1 10 0.7 ps ps psrms psp-p psrms psp-p psrms ps tpd Tempco tSKEW Note 9 Note 10 Note 11 Note 12 Note 13 Note 14 4 Output Rise/Fall Time 20% to 80%, at full swing 35 75 110 10. Part-to-part skew is defined for two parts with identical power supply voltages at the same temperature and with no skew of the edges at the respective inputs. 11. RJ is measured with a K28.7 comma detect character pattern, measured at 10.7Gbps and 2.5Gbps/3.2Gbps. 12. DJ is measured at 2.5Gbps/3.2Gbps, with both K28.5 and 223 - 1 PRBS pattern. 13. Cycle-to-cycle jitter definition: the variation of periods between adjacent cycles, Tn - Tn-1 where T is the time between rising edges of the output signal. 14. Total jitter definition: with an ideal clock input of frequency fMAX no more than one output edge in 1012 output edges will deviate by more than the specified peak-to-peak jitter value. 15. Crosstalk is measured at the output while applying two similar frequencies that are asynchronous with respect to each other at the inputs. M0643-012704 5 Micrel Precision EdgeTM SY58018U SINGLE-ENDED AND DIFFERENTIAL SWINGS VIN, VOUT 800mV (Typ.) VDIFF_IN, VDIFF_OUT 1600mV (Typ.) Figure 1a. Single-Ended Voltage Swing Figure 1b. Differential Voltage Swing TIMING DIAGRAMS IN0 /IN0 tpd Q /Q SEL tpd Q /Q tpd M0643-012704 6 Micrel Precision EdgeTM SY58018U TYPICAL OPERATING CHARACTERISTICS VCC = 3.3V, VIN = 100mV, TA = 25C, unless otherwise stated. Propagation Delay vs. Temperature 188 PROPAGATION DELAY (ps) 186 184 182 180 178 176 174 172 170 -40 -20 0 20 40 60 80 100 120 PROPAGATION DELAY (ps) Propagation Delay vs. Input Voltage Swing 166 165 164 163 162 161 160 100 200 300 400 500 600 700 800 INPUT VOLTAGE SWING (mV) TEMPERATURE (C) Output Amplitude vs. Frequency 800 OUTPUT AMPLITUDE (mV) 700 600 500 400 300 200 100 0 0 1 2 3 4 5 6 7 8 9 10 FREQUENCY (GHz) M0643-012704 7 Micrel Precision EdgeTM SY58018U TYPICAL OPERATING CHARACTERISTICS VCC = 3.3V, VIN = 100mV, TA = 25C, unless otherwise stated. 200MHz Output 1.25GHz Output Output Swing (200mV/div.) TIME (600ps/div.) Output Swing (200mV/div.) TIME (100ps/div.) 2.5Gbps Output 3.2Gbps Output Output Swing (200mV/div.) Output Swing (200mV/div.) TIME (100ps/div.) (223--1PRBS) TIME (100ps/div.) (223--1PRBS) 5Gbps Output Output Swing (200mV/div.) TIME (25ps/div.) (223--1PRBS) M0643-012704 8 Micrel Precision EdgeTM SY58018U INPUT AND OUTPUT STAGES VCC VCC IN 50 VT GND 50 /IN /Q Q Figure 2a. Simplified Differential Input Stage Figure 2b. Simplified LVPECL Output Stage INPUT INTERFACE APPLICATIONS VCC VCC IN LVPECL VCC IN /IN SY58018U GND VCC 0.01F Rpd VT PECL /IN Rpd GND GND VCC --1.4V VT Rpd SY58018U IN CML /IN SY58018U GND NC VT For VCC = 3.3V, Rpd = 50 For VCC = 2.5V, Rpd = 19 For 3.3V, Rpd = 100 For 2.5V, Rpd = 50 (Option: May connect VT to VCC) Figure 3a. DC-Coupled LVPECL Interface VCC Figure 3b. AC-Coupled LVPECL Interface Figure 3c. DC-Coupled CML Interface VCC IN CML /IN LVDS IN SY58018U GND VCC --1.4V VT GND NC /IN SY58018U VT Figure 3d. AC-Coupled CML Interface Figure 3e. LVDS Interface M0643-012704 9 Micrel Precision EdgeTM SY58018U OUTPUT INTERFACE APPLICATIONS +3.3V +3.3V +3.3V ZO = 50 ZO = 50 R1 130 R1 130 +3.3V Z = 50 Z = 50 50 50 +3.3V R2 82 R2 82 source For 3.3V, Rb = 50 For 2.5V, Rb = 19 Destination Rb VCC C1 0.01F (optional) Figure 4a. Parallel Thevenin-Equivalent Termination +3.3V R1 130 Figure 4b. Three-Resistor "Y" Termination +3.3V ZO = 50 R2 82 Figure 4c. Terminating Unused I/O RELATED MICREL PRODUCTS AND SUPPORT DOCUMENTATION Part Number SY58016L SY58017U SY58019U SY58025U SY58026U SY58027U SY58051U SY58052U Function 3.3V 10Gbps Differential CML Line Driver/Receiver with Internal I/O Termination Ultra Precision Differential CML 2:1 Mux with Internal I/O Termination Ultra Precision Differential 400mV LVPECL 2:1 Mux with Internal Termination 10.7Gbps Dual 2:1 CML Mux with Internal I/O Termination 5Gbps Dual 2:1 Mux with Internal Termination 10.7Gbps Dual 2:1 400mV LVPECL Mux with Internal Termination 10.7Gbps AnyGate(R) with Internal Input and Output Termination 10Gbps Clock/Data Retimer with 50 Input Termination MLFTM Application Note HBW Solutions New Products and Applications Data Sheet Link http://www.micrel.com/product-info/products/sy58016l.shtml http://www.micrel.com/product-info/products/sy58017u.shtml http://www.micrel.com/product-info/products/sy58019u.shtml http://www.micrel.com/product-info/products/sy58025u.shtml http://www.micrel.com/product-info/products/sy58026u.shtml http://www.micrel.com/product-info/products/sy58027u.shtml http://www.micrel.com/product-info/products/sy58051u.shtml http://www.micrel.com/product-info/products/sy58052u.shtml www.amkor.com/products/notes_papers/MLF_AppNote_0902.pdf www.micrel.com/product-info/products/solutions.shtml M0643-012704 10 Micrel Precision EdgeTM SY58018U 16 LEAD MicroLeadFrameTM (MLF-16) 0.85 +0.15 -0.65 3.00BSC 2.75BSC 16 1 0.42 +0.18 -0.18 0.23 +0.07 -0.05 0.01 +0.04 -0.01 1.60 +0.10 -0.10 0.42 +0.18 -0.18 0.65 +0.15 -0.65 0.20 REF. N PIN 1 ID 1 0.50 DIA 2 3 4 2.75BSC 3.00BSC 2 3 4 1.60 +0.10 -0.10 12 max SEATING PLANE TOP VIEW CC C L 4 0.23 +0.07 -0.05 0.01 +0.04 -0.01 1. 2. 3. 4. 0.42 +0.18 -0.18 0.5 BSC 1.5 REF BOTTOM VIEW 0.40 +0.05 -0.05 0.5BSC FOR EVEN TERMINAL/SIDE SECTION "C-C" SCALE: NONE DIMENSIONS ARE IN mm. DIE THICKNESS ALLOWABLE IS 0.305mm MAX. PACKAGE WARPAGE MAX 0.05mm. THIS DIMENSION APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.20mm AND 0.25mm FROM TIP. 5. APPLIES ONLY FOR TERMINALS Rev. 02 Package EP- Exposed Pad Die CompSide Island Heat Dissipation Heat Dissipation VEE Heavy Copper Plane VEE Heavy Copper Plane PCB Thermal Consideration for 16-Pin MLFTM Package (Always solder, or equivalent, the exposed pad to the PCB) Package Notes: 1. 2. 3. Package meets Level 2 qualification. All parts are dry-packaged before shipment. Exposed pads must be soldered to a ground for proper thermal management. MICREL, INC. 1849 FORTUNE DRIVE SAN JOSE, CA 95131 TEL USA + 1 (408) 944-0800 FAX + 1 (408) 944-0970 WEB http://www.micrel.com The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer. Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser's use or sale of Micrel Products for use in life support appliances, devices or systems is at Purchaser's own risk and Purchaser agrees to fully indemnify Micrel for any damages resulting from such use or sale. (c) 2003 Micrel, Incorporated. M0643-012704 11 |
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