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TQFP
Thin Profile Quad Flat Pack
* 7 x 7mm to 14 x 14mm * 32 to 128 lead count * Lead pitch range from 0.80mm to 0.40mm
FEATURES
* Body Sizes: 7 x 7mm to 14 x 14mm * Package Height: 1.0mm * Lead Counts: 32L to 128L * Lead pitch: 0.80mm to 0.40mm * Wide range of open tool leadframe and die pad sizes available * JEDEC standard compliant * Lead-free and Green material sets available
DESCRIPTION
The Thin Profile Quad Flat Pack (TQFP) belongs to STATS ChipPAC's QFP family. At 1.0mm body thickness, the TQFP is the thinnest package in the QFP family. This thin package is made possible by a well controlled low loop wire bonding process and package warpage control during the molding process. TQFP is suitable for mainstream cost sensitive applications where thickness and weight are premium.
APPLICATIONS
* ASIC * DSP * Gate Array * Logic/Microprocessors/Controllers * Multimedia, PC Chipsets
www.statschippac.com
TQFP
Thin Profile Quad Flat Pack
SPECIFICATIONS
Die Thickness Gold Wire Lead Finish Marking Packing Options 230-280m (9-11mils) range preferred 25/30m (1.0/1.2mils) diameter, 99.999%Au 85/15 Sn/Pb or Matte Tin Laser/ink JEDEC tray/tape and reel
RELIABILITY
Moisture Sensitivity Level Temperature Cycling High Temperature Storage Pressure Cooker Test Liquid Thermal Shock (opt) JEDEC Level 3 -65C/150C, 1000 cycles 150C, 500 hrs 121C 100% RH, 2 atm, 168 hrs -55C/125C, 1000 cycles
THERMAL PERFORMANCE, ja (C/W)
Package 48L 100L Body Size (mm) 7 x 7 x 1.0 14 x 14 x 1.0 Pad Size (mm) 5.3 x 5.3 9.0 x 9.0 Die Size (mm) 3.8 x 3.8 7.8 x 7.8 Thermal Performance, ja (C/W) 53.4 38.6
Note: Simulation data for package mounted on 4 layer PCB (per JEDEC JESD51-7) under natural convection as defined in JESD51-2.
ELECTRICAL PERFORMANCE
Electrical parasitic data is highly dependent on the package layout. 3D electrical simulation can be used on the specific package design to provide the best prediction of electrical behavior. Data below is for a frequency of 100MHz and assumes 1.0 mil gold bonding wire. Conductor Component Wire Lead (7 x 7mm, 32L) Total (7 x 7mm, 32L) Wire Lead (14 x 14mm, 128L) Total (14 x 14mm, 128L) 2 3.0 - 4.5 Length (mm) 2 1.4 - 2.2 Resistance (mOhms) 120 11.0 - 18.0 131 - 138 120 24.0 - 36.0 144.0 - 156.0 Inductance (nH) 1.65 0.64 - 0.99 2.29 - 2.64 1.65 1.96 - 2.92 3.61 - 4.57 Inductance Mutual (nH) 0.45 - 0.85 0.31 - 0.49 0.76 - 1.34 0.45 - 0.85 1.08 - 1.61 1.53 - 2.46 Capacitance (pF) 0.10 0.21 - 0.33 0.31 - 0.43 0.10 0.45 - 0.67 0.55 - 0.77 Capacitance Mutual (pF) 0.01 - 0.02 0.07 - 0.12 0.08 - 0.14 0.01 - 0.02 0.20 - 0.30 0.21 - 0.32
CROSS-SECTION
PACKAGE CONFIGURATIONS
Package Size (mm)
7x7 10 x 10 12 x 12 14 x 14
Lead Count
32, 48 44, 52, 64 80, 100 100, 128
Corporate Office Global Offices
10 Ang Mo Kio St. 65, #05-17/20 Techpoint, Singapore 569059 Tel: 65-6824-7777 Fax: 65-6720-7823 USA 510-979-8000 JAPAN 81-43-351-3320 KOREA 82-31-639-8911 TAIWAN 886-3-593-6565 CHINA 86-21-5976-5858 UK 44-1483-413-700 MALAYSIA 603-4257-6222 NETHERLANDS 31-38-333-2023
The STATS ChipPAC logo is a registered trademark of STATS ChipPAC Ltd. All other product names and other company names herein are for identification purposes only and may be the trademarks or registered trademarks of their respective owners. STATS ChipPAC disclaims any and all rights in those marks. STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given, or that the use of such information will not infringe on intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of, or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice.
(c)Copyright 2005. STATS ChipPAC Ltd. All rights reserved. January 2005

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