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| EE-SX4134 Dimensions Note: All units are in millimeters unless otherwise indicated. Photomicrosensor Features * * * * Ultra-compact model with a 2 mm wide slot. Photo IC output model. Operates at a VCC of 2.2 to 7 V. PCB surface mounting type. (Transmissive) Absolute Maximum Ratings (Ta = 25C) Item Emitter Forward current Reverse voltage Detector Internal Circuit A V O K G Symbol IF VR VCC VOUT IOUT POUT Topr Tstg Tsol Tsol Rated value 25 mA (see note 1) 5V 9V 17 V 8 mA 80 mW (see note 1) --25C to 85C --40C to 90C 230C (see note 2) 300C (see note 2) Supply voltage Output voltage Output current Permissible output dissipation Unless otherwise specified, the tolerances are 0.15 mm. Terminal No. A K V O G Name Anode Cathode Supply voltage (Vcc) Output (OUT) Ground (GND) Ambient temperature Operating Storage Reflow soldering Manual soldering Note: Ordering Information Description Photomicrosensor (Transmissive) 1. Refer to the temperature rating chart if the ambient temperature exceeds 25C. 2. Complete soldering within 10 seconds for reflow soldering and within 3 seconds for manual soldering. Part number EE-SX4134 Electrical and Optical Characteristics (Ta = 25C) Item Emitter Forward voltage Reverse current Peak emission wavelength Detector Power supply voltage Low-level output voltage High-level output current Current consumption Peak spectral sensitivity wavelength LED current when output is ON Hysteresis Response frequency Response delay time Response delay time Symbol VF IR P VCC VOL IOH ICC P IFT nH f tPHL tPLH Value 1.2 V typ., 1.4 V max. 0.01 A typ., 10 A max. 940 nm typ. 2.2 V min., 7 V max. 0.12 V typ., 0.4 V max. 10 A max. 2.8 mA typ., 4 mA max. 870 mm typ. 2.0 mA typ., 3.5 mA max. 21% typ. 3 kHz min. 7 s typ. 18 s typ. IF = 20 mA VR = 5 V IF = 20 mA --Vcc = 2.2 to 7 V, IOL = 8 mA, IF = 7 mA Vcc = 2.2 tp 7 V, IF = 0 mA, VO = 17 V Vcc = 7 V Vcc = 2.2 to 7 V VCC = 2.2 to 7 V VCC = 2.2 to 7 V (see note 1) VCC = 2.2 to 7 V, IF = 5 mA, IOL = 8 mA (see note 2) VCC = 2.2 to 7 V, IF = 5 mA, IOL = 8 mA (see note 3) VCC = 2.2 to 7 V, IF = 5 mA, IOL = 8 mA (see note 3) Condition EE-SX4134 Note: 1. Hysteresis denotes the difference in forward LED current value, expressed in percentage, calculated from the respective forward LED currents when the photo IC in turned from ON to OFF and when the photo IC in turned from OFF to ON. 2. The value of the response frequency is measured by rotating the disk as shown below. (P.P.S = pulse/s) Disk 2.1 mm 0.5 mm EE-SX4134 3. The following illustrations show the definition of response delay time. Input Output 0.5 mm Engineering Data Output allowable dissipation Pc (mW) Forward Current vs. Collector Dissipation Temperature Rating Forward Current vs. Forward Voltage Characteristics (Typical) LED Current vs. Supply Voltage (Typical) Forward current I F (mA) Forward current I F (mA) Ambient temperature Ta (C) Forward voltage VF (V) LED current I FT (mA) Supply voltage VCC (V) LED Current vs. Ambient Temperature Characteristics (Typical) Low-level Output Voltage vs. Output Current (Typical) Low level output voltage V (V) OL Low-level Output Voltage vs. Ambient Temperature Characteristics (Typical) Low level output voltage V (V) OL LED current I FT (mA) Ambient temperature Ta (C) Output current IC (mA) Ambient temperature Ta (C) Current Consumption vs. Supply Voltage (Typical) Current consumption Icc (mA) Response Delay Time vs. Forward Current (Typical) Response delay time tPHL, tPLH ( s) Repeat Sensing Position Characteristics (Typical) Output transistor 0.01 Supply voltage VCC (V) Forward current IF (mA) Distance d (mm) EE-SX4134 Unit: mm EE-SX4134 Reel Tape and Reel 210.8 dia. 20.5 13 0.5 dia. 3302 dia. 801 dia. Product name Quantity Lot number 12.4+2 0 18.4 max. Tape 1.5 dia. Tape configuration Terminating part (40 mm min.) Parts mounted Leading part (400 mm min.) Pull-out direction Empty (40 mm min.) Tape quantity 2,000 pcs./reel EE-SX4134 Soldering Information Reflow soldering EE-SX4134 Precautions * The following soldering paste is recommended: Melting temperature: 178 to 192C Composition: Sn 63%, Pb 37% * * The recommended thickness of the metal mask for screen printing is between 0.2 and 0.25 mm. Set the reflow oven so that the temperature profile shown in the following chart is obtained for the upper surface of the product being soldered. 10 sec. max. 230C max. Temperature 4C/s max. 140 to 160C 4C/s max. 60 to 120 sec 40 sec. max. Time Manual soldering * Use "Sn 60" (60% tin and 40% lead) or solder with silver content. * Use a soldering iron of less than 25 W, and keep the temperature of the iron tip at 300C or below. * * Solder each point for a maximum of three seconds. After soldering, allow the product to return to room temperature before handling it. Storage To protect the product from the effects of humidity until the package is opened, dry-box storage is recommended. If this is not possible, store the product under the following conditions: Temperature: 10 to 30C Humidity: 60% max. The product is packed in a humidity-proof envelope. Reflow soldering must be done within 48 hours after opening the envelope, during which time the product must be stored under 30C at 80% maximum humidity. If it is necessary to store the product after opening the envelope, use dry-box storage or reseal the envelope. Baking If a product has remained packed in a humidity-proof envelope for six months or more, or if more than 48 hours have lapsed since the envelope was opened, bake the product under the following conditions before use: Reel: 60C for 24 hours or more Bulk: 80C for 4 hours or more NOTE: DIMENSIONS SHOWN ARE IN MILLIMETERS. To convert millimeters to inches divide by 25.4. R OMRON ELECTRONICS LLC One East Commerce Drive Schaumburg, IL 60173 OMRON CANADA, INC. 885 Milner Avenue Toronto, Ontario M1B 5V8 OMRON ON-LINE Global - http://www.omron.com USA - http://www.omron.com/oei Canada - http://www.omron.com/oci Printed in U.S.A. 847-882-2288 Cat. No. GC NAPMS-1 02/03 416-286-6465 Specifications subject to change without notice. |
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