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HMC247
v00.0505
400 ANALOG PHASE SHIFTER 5 - 18 GHz
Typical Applications
The HMC247 is ideal for: * Fiber Optics * Military * Test Equipment
Features
Wide Bandwidth: 5 - 18 GHz >400 Phase Shift Single Positive Voltage Control Small Size: 2.5mm x 1.6mm
Functional Diagram
General Description
The HMC247 is an Analog Phase Shifter die which is controlled via an analog control voltage from 0 to +10V. The HMC247 provides a continuously variable phase shift of 0 to 300 degrees at 9 GHz, and 0 to 100 degrees at 18 GHz, with consistent insertion loss versus phase shift. The phase shift is monotonic with respect to the control voltage. The control port has a modulation bandwidth of 50 MHz. The low insertion loss and compact size enable this part to be used in a wide range of applications, including the phase adjustment of clocks in fiber optic systems and test equipment. All data is measured with the chip in a 50 ohm test fixture, connected via 0.076 mm (3 mil) ribbon bonds of minimal length <0.31 mm (<12 mils).
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Electrical Specifi cations, TA = +25 C, 50 Ohm System
Parameter Phase Shift Range: Frequency (GHz) 5 - 10 GHz 10 - 13 GHz 13 - 18 GHz 5 - 10 GHz 10 - 18 GHz 5 - 18 GHz 5 - 18 GHz 5 - 18 GHz 5 - 18 GHz 5 - 18 GHz Min. 180 135 45 Typ. 400 200 120 8 4 8 0 - 10 50 40 0.5 12 7 Max. Units degrees degrees degrees dB dB dB Volt MHz deg /Volt deg /C
Insertion Loss Return Loss (Input and Output) Control Voltage Range Modulation Bandwidth Phase Voltage Sensitivity Insertion Phase Temperature Sensitivity
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
HMC247
v00.0505
400 ANALOG PHASE SHIFTER 5 - 18 GHz
Insertion Loss vs. Control Voltage @ 12 GHz
0 -1 INSERTION LOSS (dB) -2 -3 -4 -5 -6 -7 -8 -9 -10 0 1 2 3 4 5 Vctl (Vdc) 6 7 8 9 10
+25C +85C -55C
Phase Shift vs. Control Voltage
NORMALIZED PHASE SHIFT (degrees) 500
6 GHz 12 GHz 18 GHz
400
300
200
100
0 0 0.5 1 1.5 2 2.5 Vctl (Vdc) 3 3.5 4 4.5 5
Phase Shift vs. Frequency @ Vctl = 10V (Relative to Vctl = 0V)
NORMALIZED PHASE SHIFT (degrees) 600 500 400 300 200 100 0 5 6 7 8 9 10 11 12 13 14 15 16 17 18 FREQUENCY (GHz)
Insertion Loss vs. Frequency
0 -2 -4 -6 -8 -10 -12 -14 5 6 7 8 9 10 11 12 13 14 15 16 17 18 FREQUENCY (GHz)
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0V 2V 4V 6V 8V 10V
Input Return Loss vs. Frequency, Vctl = 0 to +10V
0
Output Return Loss vs. Frequency, Vctl = 0 to +10V
0
RETURN LOSS (dB)
-10
RETURN LOSS (dB)
-5
-5
-10
-15
-15
-20 5 6 7 8 9 10 11 12 13 14 15 16 17 18 FREQUENCY (GHz)
-20 5 6 7 8 9 10 11 12 13 14 15 16 17 18 FREQUENCY (GHz)
For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
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SWITCHES - CHIP
INSERTION LOSS (dB)
+25C +85C -55C
HMC247
v00.0505
400 ANALOG PHASE SHIFTER 5 - 18 GHz
Second Harmonics vs. Control Voltage, Pin = -10 dBm
100 90 2nd HARMONICS (dBc) 80
Input IP3 vs. Control Voltage
35 30 INPUT IP3 (dBm) 25 20 15 10 5 0
70 60 50 40 30 20 10 0 0 1 2 3 4 5 Vctl (Vdc) 6 7 8 9 10
6 GHz 12 GHz 18 GHz
6 GHz 12 GHz 18 GHz
0
1
2
3
4
5 Vctl (Vdc)
6
7
8
9
10
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SWITCHES - CHIP
Insertion Loss vs. Pin @ 7 GHz
0 -1 INSERTION LOSS (dB)
Insertion Loss vs. Pin @ 12 GHz
0 -1 INSERTION LOSS (dB)
-2 -3 -4 -5 -6 -7 -8 -9 -10 -15 -10 -5 0 5
0V 5V 10V
-2 -3 -4 -5 -6 -7 -8 -9
0V 5V 10V
10
15
20
25
-10 -15
-10
-5
0
5
10
15
20
25
INPUT POWER (dBm)
INPUT POWER (dBm)
Insertion Loss vs. Pin @ 18 GHz
0 -1 INSERTION LOSS (dB) -2 -3 -4 -5 -6 -7 -8 -9 -10 -15 -10 -5 0 5 10 15 20 25
0V 5V 10V
Phase Shift vs. Pin @ 7 GHz
NORMALIZED PHASE SHIFT (degrees) 5 4 3 2 1 0 -1 -2 -3 -4 -5 -10 -5 0 5
0V 5V 10V
INPUT POWER (dBm)
INPUT POWER (dBm)
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
HMC247
v00.0505
400 ANALOG PHASE SHIFTER 5 - 18 GHz
Phase Shift vs. Pin @ 12 GHz
NORMALIZED PHASE SHIFT (degrees) 0.5 0.4 0.3 0.2 0.1 0 -0.1 -0.2 -0.3 -0.4 -0.5 -10 -5 0 5
0V 5V 10V
Phase Shift vs. Pin @ 18 GHz
NORMALIZED PHASE SHIFT (degrees) 0.5 0.4 0.3 0.2 0.1 0 -0.1 -0.2 -0.3 -0.4 -0.5 -10 -5 0 5
0V 5V 10V
INPUT POWER (dBm)
INPUT POWER (dBm)
Absolute Maximum Ratings
Control Voltage (Vctl) Reverse Current Input Power (RFin) Channel Temperature (Tc) Continuous Pdiss (T = 85 C) (derate 28 mW/C above 85 C) Thermal Resistance (junction to die bottom) Storage Temperature Operating Temperature +11 Vdc 5 mA +30 dBm 150 C 1.83 W 35.6 C/W -65 to +150 C -55 to +85 C
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SWITCHES - CHIP
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
HMC247
v00.0505
400 ANALOG PHASE SHIFTER 5 - 18 GHz
Assembly Diagram
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SWITCHES - CHIP
Pad Descriptions
Pin Number 1, 2 Function RFIN Description Port is DC blocked. Interface Schematic
3
Vctl
Phase shift control pin. Application of voltage between 0 and 10 volts causes the transmission phase to change. The DC equivalent circuit is a series connected diode resistor
4, 5
RFOUT
Port is DC blocked.
GND
The backside of the die must be connected to RF / DC ground.
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
HMC247
v00.0505
400 ANALOG PHASE SHIFTER 5 - 18 GHz
Outline Drawing
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1. ALL DIMENSIONS ARE IN INCHES [MM] 2. TIE ALL UNLABLED BOND PADS TO GROUND. 3. DIE THICKNESS IS .004" 4. TYPICAL BOND PAD IS .004" SQUARE. 5. BACKSIDE METALIZATION: GOLD. 6. BOND PAD METALIZATION: GOLD.
Handling Precautions
Follow these precautions to avoid permanent damage. Storage: All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD protective bag for shipment. Once the sealed ESD protective bag has been opened, all die should be stored in a dry nitrogen environment. Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems. Static Sensitivity: Follow ESD precautions to protect against > 250V ESD strikes. Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize inductive pick-up. General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers.
Mounting
The chip is back-metallized and can be die mounted with electrically conductive epoxy. The mounting surface should be clean and fl at. Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule.
Wire Bonding
Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 deg. C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or substrate. All bonds should be as short as possible <0.31mm (12 mils).
For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
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SWITCHES - CHIP

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