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| VSM0805 Vishay Foil Resistors SURFACE MOUNT Bulk Metal(R) Foil Technology Discrete Surface Mount Chip Resistors FEATURES * Nominal TCR: + 0.6ppm/C (0 to 25C) - 0.6ppm/C (+ 25C to + 60C) + 2.2ppm/C (- 55C to + 25C) - 1.8ppm/C (+ 25C to + 125C) * Absolute Tolerance: to 0.01% * Resistance Range: 5.5 to 12K * Load Life Stability: 0.025% (2000 hours @ 70C) * Shelf Life Stability: 0.005% Maximum R * Voltage Coefficient: < 0.00001%/volt (< 0.1ppm/V) * Current Noise: < - 40dB * Non Inductive: < 0.08H * Terminal Finishes Available: Lead (Pb)-free (Sn 99.3% Cu 0.7%) Tin/Lead Alloy (Sn 62% Pb 36% Ag 2%) Product may not be to scale The VSM0805 represents the latest addition and smallest size to the Precision Bulk Metal(R) Foil (BMF) technology surface mount chip resistor series. The VSM0805 has a conventional full wrap around termination. The BMF technology offers designers the lowest and most predictable absolute Temperature Coefficient Resistance available. The TCR is a process capability not a selection process and for the most part is independent of ohmic value and lot related variations. The availability of tight absolute tolerance provides a good cost solution for the variability of other components when compiling the total error budget. BMF offers the best stability available; and is an order of magnitude better than thin film technology. The noise generated by the resistor is non measurable and its design and construction make it well suited for high frequency applications. The BMF is the ultimate resistor component for analog applications. TABLE 1 - TOLERANCE VERSUS RESISTANCE VALUE VALUE () 250 to 12K 100 to < 250 50 to < 100 25 to < 50 10 to < 25 5.5 to <10 TIGHTEST TOLERANCE (%)* 0.01 0.02 0.05 0.1 0.25 0.5 FIGURE 1 - NOMINAL TCR CURVE -55 -50 +500 +400 +300 +200 +100 -25 0 +25 +50 +75 +100 +125 *Tighter tolerances are available. Please contact Application Engineering. Soldering temperatures used during installation may cause resistance to shift up to 0.05%. -5 +5 pp m pp m Nominal Resistance/ Temperature (RT) Curve TABLE 2 - TYPICAL PERFORMANCE SPECIFICATIONS TEST MIL-PRF-55342G CHARACTERISTIC. E R LIMITS 0.10% 0.10% 0.10% 0.10% 0.20% 0.20% 0.50% VSM MAXIMUM R LIMITS* 0.02% 0.02% 0.02% 0.05% 0.05% 0.10% 0.025% R R (ppm) 0 -100 -200 -300 -400 -500 Maximum Spread 2.3 ppm/C +2.2 ppm/C Nominal Chord Slope (TCR) -1.8 ppm/C Nominal Chord Slope (TCR) Standard Spread 2.0 ppm/C Thermal Shock Low Temperature Operation Short Time Overload High Temperature Exposure Resistance to Bonding -55C / +25C / +125C are the test points with +25C as the reference temperature The TCR for values < 100 are influenced by the termination composition and result in a deviation from this curve. Contact our application engineering department for detailed specification on low values Moisture Resistance Life 2000 hours @ + 70C *As shown + 0.01 Ohms to allow for measurement errors at low values. SALES * ISRAEL: foilsales.israel@vishay.com * FRANCE/SWITZERLAND/SOUTHERN EUROPE: foilsales.eusouth@vishay.com * AMERICAS: foilsales.usa@vishay.com * ASIA/JAPAN: foilsales.asia@vishay.com * UK/HOLLAND/SCANDANAVIA: foilsales.eunorth@vishay.com * GERMANY/CZECH REPUBLIC/AUSTRIA: foilsales.eucentral@vishay.com www.vishay.com 22 For technical questions in the Americas, contact foilsupport1@vishay.com Document Number: 63061 For technical questions in Asia/Japan/Europe/Africa/Israel, contact foilsupport2@vishay.com Revision 17-Aug-04 VSM0805 Bulk Metal Foil Technology Discrete Surface Mount Chip Resistors FIGURE 2 - POWER DERATING CURVE Percent of Rated Power 125 100 (R) Vishay Foil Resistors SURFACE MOUNT FIGURE 3 - RECOMMENDED MOUNTING -55C +70C Rated Power 25% to 85% of T 75 50 25 0 -75 -50 -25 0 +25 +50 +75 +100 +125 +150 +175 Ambient Temperature (C) A low profile solder fillet is recommended to avoid unnecessary stresses along top edge of metallization. IR and vapor phase reflow are best. Avoid the use of cleaning agents which could attack epoxy resins, which form part of the resistor construction. TABLE 3 - CHIP SIZES AND SPECIFICATIONS in inches (millimeters) Top View L Bottom View L Recommended Land Pattern X T W T D W Footprint G Z CHIP SIZE L W T D POWER MAXIMUM RESISTANCE MAXIMUM + 70C VOLTAGE (mW) 50 (V) 22 RANGE () 5.5 - 12K WEIGHT (mG) 6 Z* G* X* 0.005 (0.13) 0.005 (0.13) MAXIMUM 0.005 (0.13) 0805 0.080 (2.03) 0.050 (1.27) 0.025 (0.64) 0.015 (0.38) 0.004 (0.10) 0.004 (0.10) 0.004 (0.10) 0.122 (3.10) 0.028 (0.70) 0.050 (1.27) *Land Pattern Dimensions (Z, G, X) are per IPC-782A TABLE 4 - ORDERING INFORMATION - VSM STYLE CHIP RESISTORS MODEL VSM CHIP SIZE 0805 RESISTANCE VALUE RESISTANCE RANGE LETTER DESIGNATOR MULTIPLIER FACTOR x 1.0 x 103 TOLERANCE T 0.01% Q 0.02% A 0.05% B 0.1% C 0.25% D 0.5% F 1.0% TERMINATION S - Lead (Pb)-free B - Tin/Lead PACKAGING T = Tape and Reel W = Waffle PacK 5 to <1K R Example: 249R00 = 249 1K to 12K K Example: 10K000 = 10.0K SALES * ISRAEL: foilsales.israel@vishay.com * FRANCE/SWITZERLAND/SOUTHERN EUROPE: foilsales.eusouth@vishay.com * AMERICAS: foilsales.usa@vishay.com * ASIA/JAPAN: foilsales.asia@vishay.com * UK/HOLLAND/SCANDANAVIA: foilsales.eunorth@vishay.com * GERMANY/CZECH REPUBLIC/AUSTRIA: foilsales.eucentral@vishay.com For technical questions in the Americas, contact foilsupport1@vishay.com Document Number: 63061 For technical questions in Asia/Japan/Europe/Africa/Israel, contact foilsupport2@vishay.com Revision 17-Aug-04 www.vishay.com 23 |
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