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SPEC. No. SW ISSUE PAGE ELECTRONIC COMPONENTS GROUP SHARP CORPORATION
ED-96027A September 13 Pages DMSION DEVICES DIV 30, 1998
REPRESENTATIVE OPTO-ELECTRONIC
SPECIFICATION
DEVICE SPECIFICATION FOR
Business dealing name
PHOTOCOUPLER
MODEL No.
PC3H4
1. These specification sheets include materials protected Please do not reproduce or cause anyone to reproduce
under copyright of Sharp Corporation them without Sharp's consent.
("Sharp").
2. When using this product. please observe the absolute maximum ratings and the instructions for use outlined in these specification sheets. as well as the precautions mentioned below. Sharp assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets, and the precautions mentioned below. (Precautions) (1) This product is designed for use in the following application areas : OA equipment * Audio visual equipment * Home appliances * Telecommunication equipment (Terminal) Measuring equipment * Tooling machines * Computers [
l l
If the use of the product in the above application areas is for equipment listed in paragraphs (2) or (31, please be sure to observe the precautions given in those respective paragraphs. (21 Appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment. should be taken to ensure reliability and safety when this product is used for equipment which demands high reliability and safety in function and precision, such as ; * Transportation control and safety equipment (aircraft, train, automobile etc.1 * Rescue and security equipment * Trafhc signals * Gas leakage sensor breakers C * Other safety equipment (3) Please do not use this product for equipment which require extremely high reliability and safety in function and precision, such as ; * Space equipment * Telecommunication equipment (for trunk lines1 * Nuclear power control equipment * Medical equipment 1
1
1
1
(4) Please contact and consult with a Sharp sales representative regarding interpretation of the above three paragraphs. 3. Please contact and consult with a Sharp sales representative
if there are any questions
for any questions about this product.
CUSTOMERS
APPROVAL
DATE PRESENTED BY T. Matsumura, Department General Manager Engineering Dept.51 Opto-Electronic Devices Div. ELECOM Group SHARP CORPORATION of
DATE BY
SHARP CORPORATION
ED-96027A MODEL No.
1 September
30, 1998 PAGE
PC3H4
l/11
1. Application This specification applies Model No. PC3H4. to the outline and characteristics of photocoupler;
2. Outline Refer to the attached drawing No. CY8374KO2.
3. Ratings
and characteristics sheet, page 4 to 6.
Refer to the attached
4. Reliability Refer to the attached sheet, page 7.
5. Incoming
inspection sheet, page 8.
Refer to the attached
6. Supplement 6.1 Isolation voltage shaI.I be measured in the following method. side and between
(1) Short between anode and cathode on the primary collector and emitter on the secondary side. (2) The dielectric withstand tester voltage with zero-cross
circuit
shall be used.
(3) The wave form of applied
shah be a sine wave.
6.2 Packaging
spectications sheet, page 9 to 11.
Refer to the attached
SHARP CORPORATION
PC3H4
6.3
Collector ("3" mark
current
(Ic)
Delivery business
rank
table name of ordered mark product) Test conditions IF'+ 1mA Ta=25'C
: indicates
dealing Rank
Ordered product
Business dealingname PC3H4 PC3H4A
Ic (mA)
A or no mark A out at production
0.2 to 4.0 0.5 to 1.5 process.
Vc,=5V,
High temperature
test are carried
6.4 This Model is approved Approved
by UL.
Model No. : PC3H4
UL tile No. : E64380
6.5 This product
is AC input
type.
6.6 This product This product This product
is not designed is assembled incorporates
against with
irradiation. input and output. diode.
electrical
non-coherent
light emitting
6.7
ODS materials This product shall not contain the following materials. Also, the following materials shall not be used in the production for this product. Materials for ODS : CFC,, Halon, Carbon 1.1.1 -Trichloroethane tetrachloride, (Methylchloroform)
process
6.8 Brominated
flame retardants such as the PBBO, and PBB, are not used
Specific brominated flame retardants in this device at all.
7. Notes Refer to the attached sheet- .1-l, 2.
SHARP CORPORATION
Anode mark \
Date code l l Rankmark /
Pin Nos. and internal connection diagram
:...::...::...: e d i-l d
Epoxy resin
*l) 2-digit number shall be marked according to DIN standard. *21 Dimensions in parenthesis are shown for reference.
I
Product mass : Approx. 0.05g Name Drawing No.
UNIT:
l/l
mm
PC3H4 Outline Dimensions (Business dealing name : PC3H4) CY8374K02
SHARP CORPORATION
ED-96027A
MODEL No.
1 September
30, 1998
PAG E
PC3H4
4/11
3. Ratings
and characteristics maximum ratings Ta=25C
3.1 Absolute
l 1 Forward current
*l
Total power dissipation Topr Tstg
Vii0
Operating temperature Storage temperature *3 Isolation voltage *4 Soldering temperature
-30 to t100 -40 to t125 2.5 260
"C "C kVrms "C
Tsol
@l The derating factors of absolute maximum ratings due to ambient temperature are shown in Fig. 1 to 4. *2 Pulse widths100 ps, Duty ratio : 0.001 (Refer to Fig. 5)
*3 AC for 1 min, 40 to 6O%RH, f=GOHz *4 For 10s
SHARP CORPORATION
ED-96027A MODEL No.
1 September
30. 1998
PAGE
PC3H4
3.2 Electra-optical characteristics Ta=25"C Parameter Forward Input Terminal Dark capacitance Ct E EO
BvCEO
5/11
SJTIlbol voltage VF
Conditions I,=f2OmA v=o, f=lkHz V,,&OV, Ic=O. 1mA IF=0 I,=10 /IA, I,=0 IF0
MIN.
TYP. 1.2
MAX. 1.4
unit V PF
current
70
nA V
output
Collector-emitter breakdown voltage Emitter-collector breakdown voltage
BvECO
6
V
4.0 0.1 0.2
mA V
Transfer charac-
10"
-
R
I
Floating
capacitance
0.6
I
1.0
PF PS
Ic=2mA R,=lOO Q
PS
SHARP CORPORATION
(Fig. 1) Forward ambient 50 3 k '" i? 2 -g f2 g 40 30 20 10 0 -30
current vs. temperature
(Fig. 2) Diode power dissipation vs. ambient temperature
5 g 100
a
g d it 1 4 80 70 60
0 Ambient
25
55
75
100 Ta ( `C )
125 Ambient
25 temperature Ta ( "C )
125
temperature
(Fig. 3) Collector power dissipation vs. ambient temperature 5
(Fig. 4) Total power vs. ambient
dissipation temperature
170 s 150 _a rn ! 100
Ei
b
3
& 3 5 r 50 0 -30
-30
0 Ambient
25
50
75
100 Ta ( "C )
125
0 Ambient
25
50
75
100 Ta (`C )
125
temperature
temperature
(Fig. 5) Peak forward current vs. duty ratio Pulse width5100 Ta=25% ps
3 a
3
A" 5 lo-"2
5 1o'22 5 lo-`2
Duty ratio
5 10"
SHARP CORPORATION
ED-96027A
MODEL No.
1 September
30, 1998
PAGE
PC3H4
4. Reliability The reliability of products items listed below. Test Items shall satisfy
7/11
Confidence level : 90% LTPD: 10%/20% Failure *1 Judgement Criteria Samples (n) Defective(C) n=ll, n=ll, v,>ux 1.2 n=ll, C=O C=O C=O
Test Conditions
Solderability Soldering Terminal (Bending) Mechanical heat
*2 l3
23O"C, 5 s 26O"C, 10s Weight : IN 1 time/each terminaI 15000m/s', 0.5ms 3 times/ +X, +Y, +Z direction 100 to 2000 to 1ooHz/4min 200m/s2 4 times/ X, Y, Z direction 1 cycle -40C to t125"C (30min) (30min) 20 cycles test +85"C, 85%RH, 500h *5 U : Upper specification limit L : Lower specification limit
strength l4 shock
EEO >ux2 Ic>" ' `2
n=ll.
C=O
Variable vibration
frequency
n=ll,
C=O
Temperature cycling
n=22,C=O
High temp. and high humidity storage High temp. storage Low temp. storage Operation Iife
n=22 ,C=O
+125C,
lOOOh
n=22 ,C=O n=22 ,C=O n=22,C=O
-40C. 1 OOOh I,=t50mA, Ptot= 170mW Ta=25"C, 1 OOOh conforms to JIS C 7021.
*l *2
Test method,
Solder shalI adhere at the area of 95% or more of immersed portion of lead, and pin hole or other holes shall not be concentrated on one portion. dipped direction into solder is shown by specified shall be 0.2mm below. solvent in attach sheet- l-l. away from the
*3 The lead pin depth root of lead pins. *4 Terminal *5 It evaluates bending
after washing
n
0.2mm or more Soldering area
SHARP CORPORATION
ED-96027A
MODEL No. '
1 September
30, 1998
PAGE
PC3H4
8/11
5. Incoming inspection 5.1 Inspection items (11 Electrical characteristics V,, I,, (2) Appearance , Ic, Visa
5.2 Sampling
method
and Inspection
level
A single sampling plan, normal inspection level II based on IS0 2859 is applied. The AQL according to the inspection items are shown below.
I Defect
1 Major defect
I 1
Inspection
item
1 AQL(%)
1
1
I I I
I
I
Electrical characteristics Unreadable marking Appearance defect except the above mentioned.
I
0.1
I
o.4
SHARP CORPORATION
6.2 Package 6.2.1
specifications conditions and Dimensions (Refer to the attached sheet, Page 10) on
Taping
(1) Tape structure
The tape shall have a structure in which a cover tape is sealed heat-pressed the carrier tape of protect against static electricity. (2) Reel structure and Dimensions (Refer to the attached its dimensions sheet, Page 11)
The taping reel shall be of plastic with as shown in the attached drawing. (3) Direction of product insertion
(Refer to the attached
sheet,
Page 11) at the
Product direction in carrier hole side on the tape. (4) Joint of tape
tape shall direct to the anode mark
The cover tape and carrier (5) The way to repair
tape in one reel shall be jointless. devices devices cut a bottom of carrier tape with a cutter, and the cut portion shall be sealed with adhesive tape.
taped failure
The way to repair taped failure after replacing to good devices, 6.2.2 Adhesiveness
l
of cover tape be
The exfoliation force between carrier tape and cover tape shall 0.2N to 0.7N for the angle from 160' to 180' . method and quantity
6.2.3
Rolling
l
Wind the tape back on the reel so that the cover tape will be outside the tape. Attach more than 20cm of blank tape to the trailer and the leader of the tape and fix the both ends with adhesive tape. One reel shah contain 3OOOpcs.
6.2.4
Marking
l
The outer * Model
packaging * Number
case shall be marked of pieces delivered
with
following
information. date
No.
* Production
6.2.5
Storage
condition
. Taped products shah be stored at the temperature 5 to 30C and the humidities lower than 70%RH. 6.2.6 Safety protection during shipping or degradation of electrical
* There shall be no deformation of component characteristics due to shipping.
SHARP CORPORATION
ED-96027A MODEL No.
1 September
30, 1998 PAGE
PC3H4
lO/ll
Carrier
tape structure
and Dimensions
5" max
A
f0.3
B
kO.1
C
kO.1
D
kO.1
E
to.1
F
zko.1
mm
12.0
5.5
1.75
8.0
2.0
4.0
G
+o. 1 -0.0 $51.5
H
kO.1
I
kO.05
J
kO.1
K
kO.1
L
+o. 1 -0.0
mm
7.5
0.3
2.3
3.1
4 1.6
SHARP CORPORATION
ED-96027A
MODEL No.
1 September
30. 199!
PAGE
PC3H4
ll/ll
Reel structure
and Dimensions
a
Check word a mm 330 b 13.5t1.5
C
d 13t0.5
e 23tl
f 2.0 to.5
g 2.0 to.5
lOOf
Direction of product insertion
Pull-out
direction
SHARP CORPORATION
ED-96027A MODEL No.
1 September
PC3H4
30, 1999 PAG E Attach sheet- 1- 1
Precautions
for Photocouplers
1 For cleaning ( 1) Solvent cleaning : Solvent temperature 45C or less Immersion for 3 mm or less : The effect to device by ultrasonic cleaning differs by cleaning bath size, ultrasonic power output, cleaning time, PCB size or device mounting condition etc. Please test it in actual using condition and confirm that doesn't occur any defect before starting the ultrasonic cleaning. : Ethyl alcohol, Methyl alcohol, Isopropyl alcohol
I
(2) Ultrasonic
cleaning
(31 Applicable
solvent
In case when the other solvent is used, there are cases that the packaging resin is eroded. Please use the other solvent after thorough confirmation is performed in actual using condition.
2. The LED used in the Photocoupler generally decreases the light emission power by operation. In case of long operation time, please design the circuit with considering the degradation of the light emission power of the LED. (50%/5years)
3. There are cases that the deviation of the CTR and the degradation of the LED become big at IF is less than 1 .OmA. Please design the circuit with considering this point.
of the light emission
power
I-
SHARP CORPORATION
ED-96027A MODEL No.
1 September
PC3H4
30, 1994, PAGE Attach sheet- 1-2
4. Precautions
for Soldering :
Photocouplers ,
( 1) If solder reflow
It is recommended that only one soldering be done at the temperature and the time within the temperature profile as shown in the figure below.
230C
25C
lmill < I- 1.5nlin , 7
Since, influence to the device is different according to reflow equipment and its condition, please use the device after confirming no damage in the actual using condition.
(21 Other
precautions
An infrared lamp used to heat up for soldering may cause a localized temperature rise in the resin. So keep the package temperature within that specified in Item (1). Also avoid immersing the resin part in the solder.
1
I

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