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 Freescale Semiconductor Technical Data
Document Number: MRF9582NT1 Rev. 1, 7/2006
Silicon Lateral FET, N - Channel Enhancement - Mode MOSFET
Designed for use in medium voltage, moderate power amplifiers such as portable analog and digital cellular radios and PC RF modems. * Typical CW RF Performance @ 849 MHz: VDD = 12.5 Volts, IDQ = 300 mA, Pout = 38 dBm Power Gain -- 10.5 dB Drain Efficiency -- 55% * Capable of Handling 10:1 VSWR, @ 12.5 Vdc, 849 MHz, 38 dBm * RoHS Compliant * In Tape and Reel. T1 Suffix = 1,000 Units per 12 mm, 7 inch Reel
MRF9582NT1
849 MHz, 38 dBm, 12.5 V HIGH FREQUENCY POWER TRANSISTOR LDMOS FET
3
2
1
4
CASE 449 - 02, STYLE 1 PLD - 1
Table 1. Maximum Ratings
Rating Drain - Source Voltage Drain - Gate Voltage (RGS = 1.0 M) Gate - Source Voltage Drain Current - Continuous Total Device Dissipation @ TC = 85C Storage Temperature Range Operating Junction Temperature Symbol VDSS VDGO VGS ID PD Tstg TJ Value 17 17 4.0 1.5 10.5 - 65 to 150 150 Unit Vdc Vdc Vdc Adc W C C
Table 2. Thermal Characteristics
Characteristic Thermal Resistance, Junction - to - Case Symbol RJC Rating 1 Value 6 Unit C/W Unit C
Table 3. Moisture Sensitivity Level
Test Methodology Per JESD 22 - A113, IPC/JEDEC J - STD - 020 Package Peak Temperature 260
NOTE - CAUTION - MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and packaging MOS devices should be observed.
(c) Freescale Semiconductor, Inc., 2006. All rights reserved.
MRF9582NT1 1
RF Device Data Freescale Semiconductor
Table 4. Electrical Characteristics (TC = 25C, unless otherwise noted) Characteristic
Off Characteristics Drain - Source Breakdown Voltage (VGS = 0, ID = 100 nAdc) Drain - Source Leakage Current (VDS = 12.5 Vdc, VGS = 0) Gate - Source Leakage Current (VGS = 5 Vdc, VDS = 0) On Characteristics Gate Threshold Voltage Resistance Drain - Source (VGS = 5 Vdc, ID = 300 mA) Dynamic Characteristics Input Capacitance (VDS = 12.5 Vdc, VGS = 0, f = 1.0 MHz) Output Capacitance (VDS = 12.5 Vdc, VGS = 0, f = 1.0 MHz) Feedback Capacitance (VDS = 12.5 Vdc, VGS = 0, f = 1.0 MHz) Typical Characteristics Power Gain (VDD = 12.5 Vdc, Pin = 27.5 dBm, f = 849 MHz) Drain Efficiency (VDD = 12.5 Vdc, Pin = 27.5 dBm, f = 849 MHz) Output Power Gps D Pout -- -- -- 10.5 55 38 -- -- -- dB % dBm Ciss Coss Crss -- -- -- 30.77 15.6 0.82 -- -- -- pF pF pF VGS RDS(on) -- 0.05 2.4 0.5 -- 0.8 Vdc V(BR)DSS IDSS IGSS -- -- -- 45 -- -- -- 100 100 Vdc nAdc nAdc
Symbol
Min
Typ
Max
Unit
MRF9582NT1 2 RF Device Data Freescale Semiconductor
TYPICAL CHARACTERISTICS
40 39.5 OUTPUT POWER (dBm) 13.75 V 39 38.5 38 37.5 37 820 11.25 V Pin = 27.5 dBm TA = 25C Vg = 2.4 V 830 835 840 845 850 855 f, FREQUENCY (MHz) 12.50 V EFFICIENCY (%) 70 68 66 64 62 60 820 Pin = 27.5 dBm TA = 25C Vg = 2.4 V
13.75 V 12.50 V 11.25 V
825
825
830
835
840
845
850
855
f, FREQUENCY (MHz)
Figure 1. Output Power versus Frequency
Figure 2. Efficiency versus Frequency
39 IDQ, QUIESCENT CURRENT (mA) -35C
400 350 300 250 200 150 100 820 -35C 825 830 835 840 845 850 855 25C 85C
OUTPUT POWER (dBm)
38.8 38.6
25C
38.4 38.2 38 820
85C Pin = 27.5 dBm VDD = 12.5 V Vg = 2.4 V 825 830 835 840 845 850 855
Pin = 27.5 dBm VDD = 12.5 V Vg = 2.4 V
f, FREQUENCY (MHz)
f, FREQUENCY (MHz)
Figure 3. Output Power versus Frequency
Figure 4. Quiescent Current versus Frequency
MRF9582NT1 RF Device Data Freescale Semiconductor 3
f = 849 MHz Zsource
Zo = 5
Zload f = 849 MHz
VDD = 12.5 Vdc, IDQ = 300 mA, Pout = 38 dBm f MHz 849 Zsource = Zload = Zsource 2.5 + j0.5 Zload 2.5 - j2.5
Test circuit impedance as measured from gate to ground. Test circuit impedance as measured from drain to ground.
Input Matching Network
Device Under Test
Output Matching Network
Z
source
Z
load
Figure 5. Series Equivalent Source and Load Impedance
MRF9582NT1 4 RF Device Data Freescale Semiconductor
NOTES
MRF9582NT1 RF Device Data Freescale Semiconductor 5
NOTES
MRF9582NT1 6 RF Device Data Freescale Semiconductor
PACKAGE DIMENSIONS
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH.
L S A
1
C E P H T G W 8 PL
ZONE U ZONE V
RB
4
3
N
F
2 PL
2
K D
2 PL
Q
DRAFT 4 PL
M
Y X
RF Device Data Freescale Semiconductor
EE EE
J
8 PL
Z
AA
RESIN BLEED/FLASH ALLOWABLE
DIM A B C D E F G H J K L M N P Q R S T U V W X Y Z AA
INCHES MIN MAX 0.185 0.195 0.175 0.185 0.058 0.064 0.017 0.023 0.014 0.017 0.027 0.033 0.071 0.077 0.017 0.023 0.000 0.007 0.018 0.026 0.253 0.263 5 _REF 1.75 REF 0.000 0.006 0.120 0.130 0.220 0.230 0.030 0.038 0.050 0.060 0.000 0.018 0.000 0.014 0.004 0.016 0.131 0.141 0.065 0.075 0.089 0.099 0.056 0.066 STYLE 1: PIN 1. 2. 3. 4.
MILLIMETERS MIN MAX 4.70 4.95 4.44 4.70 1.47 1.63 0.43 0.58 0.36 0.43 0.69 0.84 1.80 1.96 0.43 0.58 0.00 0.18 0.46 0.66 6.43 6.68 5 _REF 4.44 REF 0.00 0.15 3.05 3.30 5.59 5.84 0.76 0.97 1.27 1.52 0.00 0.46 0.00 0.36 0.10 0.41 3.33 3.58 1.65 1.90 2.26 2.51 1.42 1.67
CASE 449 - 02 ISSUE A
EE EEE EE EEE EEE
E E
DRAIN GATE SOURCE SOURCE
MRF9582NT1 7
How to Reach Us:
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MRF9582NT1 8Rev. 1, 7/2006
Document Number: MRF9582NT1
RF Device Data Freescale Semiconductor


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