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| ac DECEMBER 2002 PRELIMINARY XRT8010 REV. P1.0.0 350MHZ CLOCK & CRYSTAL MULTIPLIER WITH LVDS OUTPUTS DESCRIPTION The XRT8010 is a monolithic analog phase locked loop that provides a high frequency LVDS clock output, using a low frequency crystal or reference clock. It is designed for SONET/SDH and other low jitter applications.The high performance of the IC provides a very low jitter LVDS clock output up to 350 MHz, while operating at 3.3 volts. The XRT8010 has a selectable 8x or 16x internal multiplier for an external crystal or signal source. The Output Enable pin provides a true disconnect for the LVDS output. The very compact (4 x 4 mm) low inductance package is ideal for high frequency operation. FEATURES * Up to 350 MHz operation * Low Output Jitter: s 6 ps rms at 312 MHz, input referred Optimized for 15 to 40 MHz crystals Uses parallel fundamental mode * On Chip Crystal Oscillator Circuit s s * Selectable 8x or 16x multiplier * Selectable /1 or /2 LVDS output * LVDS output meets TIA/EIA 644A Specification (2001) APPLICATIONS * Gigabit Ethernet * SONET/SDH * SPI-4 Phase 2 * Voltage Controlled Crystal Oscillator (VCXO) * 8x or 16x Clock Multiplier s s * 3.3V Low power CMOS: <80 mW typical * -40C to +85C operating temperature * Extremely small 16-lead QFN package Computer Systems Telecommunication systems FIGURE 1. XRT8010 BLOCK DIAGRAM 15-40 MHz Crystal XTAL1 XTAL2 12-20pF +3.3 V AVDD AVDD REXT 10K OVDD 1220pF Oscillator Circuit and Input Buffer VCO Calibration Logic Phase Detector XRT8010 Voltage Reference and Bias Generator Charge Pump Loop Filter VCO Selectable /1 or /2 Divider Feedback Divider /8, 16 or 32 LVDS Output AGND (Crystal) AGND AGND FS1 FS0 PD OE OGND Exar Corporation 48720 Kato Road, Fremont CA, 94538 * (510) 668-7000 * FAX (510) 668-7017 * www.exar.com ac PRELIMINARY XRT8010 PIN DESCRIPTION PIN # 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 NAME AVDD AGND XTAL1 XTAL2 AGND REXT OE PD FS1 FS0 AGND OGND OUTN OUTP OVDD AVDD O O I I I I I I O TYPE XRT8010 350MHZ CLOCK & CRYSTAL MULTIPLIER WITH LVDS OUTPUTS REV. P1.0.0 DESCRIPTION + 3.3V Analog Supply for Crystal Oscillator Analog Ground for Crystal Oscillator Crystal pin 1 or external clock input Crystal pin 2 (output drive for crystal) Analog Ground External Bias Resistor (10K to ground) Output Enable, Active low (Internal 50K pull-down to ground) Power Down, Active High (Internal 50K pull-down to ground) Frequency select "1" (Internal 50K pull-down to ground) Frequency select "0" (Internal 50K pull-up to VDD) Analog Ground Output Ground for LVDS outputs LVDS negative output for 50 line LVDS positive output for 50 line + 3.3V Digital Supply for LVDS Output buffer + 3.3V Analog Supply FIGURE 2. PIN-OUT OF THE XRT8010 (TOP VIEW) 16 15 14 13 1 2 3 4 12 11 10 9 5 6 7 8 2 XRT8010 350MHZ CLOCK & CRYSTAL MULTIPLIER WITH LVDS OUTPUTS REV. P1.0.0 ac PRELIMINARY ABSOLUTE MAXIMUM RATINGS Supply voltage VIN Storage Temperature Operating Temperature ESD -0.5 to 6.0 V -0.5 to 6.0 V -65C to + 150C -40C to + 85C 2,000 volts ELECTRICAL SPECIFICATIONS: PARAMETER Supply Voltage Supply current Input Digital High Input Digital Low Crystal Frequency Power on Calibration time SYMBOL VDD IDD VINH VINL 15 2.0 0.8 40 5 MIN 3.0 TYP 3.3 20 MAX 3.6 25 UNIT V mA V V MHz ms Crystal Jitter < 1 ps p-p After VDD reaches 2.8VNote: calibration time = 16,000 clock cycles 312 MHz nominal FOUT CL = 5pF, RL = 100 CL = 5pF, RL = 100 LVDS output Differential CONDITIONS Max Frequency Rise time Fall Time Duty cycle Output skew Output Loading Output voltage Common Mode Voltage Output short circuit current Output Jitter, Cycle-tocycle Output Jitter, Accumulated Crystal Frequency Range FOUT TR TF 250 325 300 300 MHz ps ps % ps 45 55 10 100 -400 VCM 1.2 -5.7 6 16 15 400 mV V Differential (OUTP-OUTN) -8 10 20 40 mA ps ps MHz Current limit to ground, VDD or Vp to Vn rms, at 312 MHz, Input referred rms, over 1,000 cycles, at 312 MHz Fundamental Mode Crystal 3 ac PRELIMINARY XRT8010 350MHZ CLOCK & CRYSTAL MULTIPLIER WITH LVDS OUTPUTS REV. P1.0.0 FIGURE 3. LVDS OUTPUT WAVEFORMS AND TEST CIRCUITS TABLE 1: FREQUENCY SELECTION TABLE FS0PIN 10 1 0 1 0 FS1PIN 9 1 1 0 0 CRYSTAL FREQUENCY 39.0 MHz 39.0 MHz 19.5 MHz 19.5 MHz INTERNAL CAPACITOR 12 pF 12 pF 20 pF 20 pF MULTIPLY RATIO 8x 8x 16x 16x OUTPUT DIVIDE 1 2 1 2 FREQUENCY OUTPUT 312 MHz 156 MHz 312 MHz 156 MHz NOTES: 1. Use Parallel Fundamental mode crystal 2. FS0 has a 50K pull-up resistor to VDD on chip 3. FS1 has a 50K pull-down resistor to ground on chip 4 XRT8010 350MHZ CLOCK & CRYSTAL MULTIPLIER WITH LVDS OUTPUTS REV. P1.0.0 ac PRELIMINARY TABLE 2: POWER-DOWN AND OUTPUT TRI-STATE SELECTION TABLE PD PIN 8 1 0 OE PIN 7 X 1 STATUS Outputs tri-stated and chip Powered-down "X" = don't care Output tri-stated PD and OE have a 50K pull-down resistor to ground on chip NOTES ORDERING INFORMATION PART NUMBER XRT8010IL PACKAGE TYPE 16 LEAD QUAD FLAT NO LEAD (4 mm x 4 mm, QFN) OPERATING TEMPERATURE RANGE -40C to +85C 5 ac PRELIMINARY XRT8010 350MHZ CLOCK & CRYSTAL MULTIPLIER WITH LVDS OUTPUTS REV. P1.0.0 FIGURE 4. 16-PIN QFN PACKAGE OUTLINE DRAWING AND DIMENSIONS Note: The control dimension is in millimeter. SYMBOL A A1 A2 D D1 D2 b e L INCHES MIN 0.031 0.000 0.000 0.154 0.144 0.030 0.009 MAX 0.039 0.002 0.039 0.161 0.152 0.089 0.015 MILLIMETERS MIN MAX 0.80 0.00 0.00 3.90 3.65 0.75 0.23 1.00 0.05 1.00 4.10 3.85 2.25 0.38 0.0256 BSC 0.014 0 0.030 12 0.65 BSC 0.35 0 0.75 12 6 ac XRT8010 350MHZ CLOCK & CRYSTAL MULTIPLIER WITH LVDS OUTPUTS REV. P1.0.0 PRELIMINARY NOTES NOTICE EXAR Corporation reserves the right to make changes to the products contained in this publication in order to improve design, performance or reliability. EXAR Corporation assumes no responsibility for the use of any circuits described herein, conveys no license under any patent or other right, and makes no representation that the circuits are free of patent infringement. Charts and schedules contained here in are only for illustration purposes and may vary depending upon a user's specific application. While the information in this publication has been carefully checked; no responsibility, however, is assumed for inaccuracies. EXAR Corporation does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless EXAR Corporation receives, in writing, assurances to its satisfaction that: (a) the risk of injury or damage has been minimized; (b) the user assumes all such risks; (c) potential liability of EXAR Corporation is adequately protected under the circumstances. Copyright 2002 EXAR Corporation Datasheet December 2002. 7 |
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