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 APM2512N
N-Channel Enhancement Mode MOSFET
Features
* * * *
25V/40A , RDS(ON)=9m(typ.) @ VGS=10V RDS(ON)=13m(typ.) @ VGS=4.5V Super High Dense Cell Design for Extremely Low RDS(ON) Reliable and Rugged TO-252 Package
Pin Description
1
2
3
G
D
S
Top View of TO-252
D
Applications
*
Power Management in Computer, Portable Equipment and Battery Powered Systems.
G
S
N-Channel MOSFET
Ordering and Marking Information
APM2512N
Lead Free Code Handling Code Temp. Range Package Code Package Code U : TO-252 Operation Junction Temp. Range C :-55 to 150 C Handling Code TR : Tape & Reel L : Lead Free Code L : Lead Free Device Blank : Original Device XXXXX - Date Code
APM2512N U :
APM2512N XXXXX
Absolute Maximum Ratings
Symbol VDSS VGSS Drain-Source Voltage Gate-Source Voltage Parameter
(TA = 25C unless otherwise noted)
Rating 25 20
Unit V
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright ANPEC Electronics Corp. Rev. A.1 - Oct., 2003 1 www.anpec.com.tw
APM2512N
Absolute Maximum Ratings (Cont.)
Symbol ID IDM PD TJ,TSTG
* RJA
(TC= 25C unless otherwise noted)
Rating 40 90 50 20 -55 to 150 50 2.5 C C/W A W Unit
Parameter Maximum Drain Current - Continuous Maximum Pulsed Drain Current ( pulse width 300s) Tc=25C Maximum Power Dissipation Tc=100C
Maximum Operating and Storage Junction Temperature Thermal Resistance - Junction to Ambient Thermal Resistance - Junction to Case
2
RJC
* Mounted on 1in pad area of PCB.
Electrical Characteristics
Symbol Static BV DSS IDSS V GS(th) IGSS R DS(ON) V SD
a b a
(TA = 25C unless otherwise noted)
APM2512N Typ. Max.
Parameter
Test Condition
Min.
Unit
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate Threshold Voltage Gate Leakage Current Drain-Source On-state Resistance Diode Forward Voltage
V GS =0V , IDS=250A V DS =20V , V GS=0V V DS =V GS , IDS=250A V GS =20V , V DS=0V V GS =10V , IDS=20A V GS =4.5V , IDS=10A ISD =10A , VGS=0V V DS =15V , IDS= 10A V GS =10V , V DD =10V , IDS=10A , V GEN =10V , R G=6 V GS =0V
25 1 1 1.5 9 13 0.9 28 3.6 8.4 10 15 35 15 1560 345 245 20 25 50 20 2 100 12 20 1.3 38
V A V nA m V
Dynamic Q g Total Gate Charge Q gs Q gd td(ON) T r td(OFF) T f C iss C oss C rss Gate-Source Charge Gate-Drain Charge Turn-on Delay Time Turn-on Rise Time Turn-off Delay Time Turn-off Fall Time Input Capacitance Output Capacitance
nC
ns
V DS =15V Reverse Transfer Capacitance Frequency=1.0MHz
pF
Notes
a b
: Pulse test ; pulse width 300s, duty cycle 2% : Guaranteed by design, not subject to production testing
2 www.anpec.com.tw
Copyright ANPEC Electronics Corp. Rev. A.1 - Oct., 2003
APM2512N
Typical Characteristics
Output Characteristics
40 35 VGS=5,6,7,8,9,10V VGS=4V 40 35
Transfer Characteristics
ID-Drain Current (A)
ID-Drain Current (A)
30 25 20 15 10 5 0 0 1 2 3 VGS=2.5V 4 5 6 7 8 9 10 VGS=3V VGS=3.5V
30 25 20 15 10 5 Tj=125 C Tj=25 C
o o
Tj=-55 C
o
0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
Threshold Voltage vs. Junction Temperature
1.8 1.6 IDS =250A 0.024 0.022
On-Resistance vs. Drain Current
RDS(ON)-On-Resistance ()
VGS(th)-Threshold Voltage (Normalized)
1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -50 -25 0 25 50 75 100 125 150
0.020 0.018 0.016 0.014 0.012 0.010 0.008 0.006 0.004 0.002 0 5 10 15 20 25 30 35 40 VGS=10V VGS=4.5V
Tj - Junction Temperature (C)
ID - Drain Current (A)
Copyright ANPEC Electronics Corp. Rev. A.1 - Oct., 2003
3
www.anpec.com.tw
APM2512N
Typical Characteristics
On-Resistance vs. Gate-to-Source Voltage
0.016 0.015 ID=20A
On-Resistance vs. Junction Temperature
1.8 1.6 VGS = 10V IDS = 20A 1.4 1.2 1.0 0.8 0.6 0.4 RON@Tj = 25C: 9m -25 0 25 50 75 100 125 150
RDS(ON)-On-Resistance ()
0.014 0.013 0.012 0.011 0.010 0.009 0.008 0.007 0.006 3 4 5 6 7 8 9 10
RDS(ON)-On-Resistance (Normalized)
0.2 -50
VGS - Gate-to-Source Voltage (V)
TJ - Junction Temperature (C)
Gate Charge
10 3000 VDS= 15 V 8 IDS = 10A 2500
Capacitance
Frequency=1MHz
VGS-Gate-Source Voltage (V)
Capacitance (pF)
2000 1500 1000 500 0 Crss 0 5 10 15 20 25 Coss Ciss
6
4
2
0
0
5
10
15
20
25
30
QG - Gate Charge (nC)
VDS - Drain-to-Source Voltage (V)
Copyright ANPEC Electronics Corp. Rev. A.1 - Oct., 2003
4
www.anpec.com.tw
APM2512N
Typical Characteristics
Source-Drain Diode Forward Voltage
40 700 600
Single Pulse Power
Mounted on 1in pad o TA=25 C
2
IS-Source Current (A)
10 500
Power (W)
1.2 1.4
400 300 200 100
Tj=150 C 1
o
Tj=25 C
o
0.1 0.0
0.2
0.4
0.6
0.8
1.0
0 1E-4
1E-3
0.01
0.1
1
10
100300
VSD -Source-to-Drain Voltage (V)
Time (sec)
Normalized Thermal Transient Impedence, Junction to Ambient
2
Normalized Effective Transient Thermal Impedance
1
Duty Cycle=0.5 D=0.2 D=0.1
0.1
D=0.05 D=0.02 D=0.01
PDM t
1
t
2
0.01
SINGLE PULSE
1.Duty Cycle, D= t1/t2 2.Per Unit Base=RthJA=50 C/W 3.TJM-TA=PDMZthJA 4.Surface Mounted on 1in pad
2 o
1E-3 1E-4
1E-3
0.01
0.1
1
10
100
300
Square Wave Pulse Duration (sec)
Copyright ANPEC Electronics Corp. Rev. A.1 - Oct., 2003
5
www.anpec.com.tw
APM2512N
Packaging Information
TO-252( Reference JEDEC Registration TO-252)
E b2 L2 A C1
D H L1 L b e1 C A1
Dim A A1 b b2 C C1 D E e1 H L L1 L2
Mi ll im et er s Min . 2. 1 8 0. 8 9 0. 5 08 5. 2 07 0. 4 6 0. 4 6 5. 3 34 6. 3 5 3. 9 6 9. 3 98 0. 5 1 0. 6 4 0. 8 9 1. 0 2 2. 0 32
6
Inc he s Ma x . 2. 3 9 1. 2 7 0. 8 9 5. 4 61 0. 5 8 0. 5 8 6. 2 2 6. 7 3 5. 1 8 10 . 41 Min . 0. 0 86 0. 0 35 0. 0 20 0. 2 05 0. 0 18 0. 0 18 0. 2 10 0. 2 50 0. 1 56 0. 3 70 0. 0 20 0. 0 25 0. 0 35 0. 0 40 0. 0 80
www.anpec.com.tw
Ma x . 0. 0 94 0. 0 50 0. 0 35 0. 2 15 0. 0 23 0. 0 23 0. 2 45 0. 2 65 0. 2 04 0. 4 10
Copyright ANPEC Electronics Corp. Rev. A.1 - Oct., 2003
APM2512N
Physical Specifications
Terminal Material Lead Solderability Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb) Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
Reflow Condition
(IR/Convection or VPR Reflow)
temperature
Peak temperature
183C Pre-heat temperature
Time
Classification Reflow Profiles
Convection or IR/ Convection Average ramp-up rate(183C to Peak) 3C/second max. 120 seconds max Preheat temperature 125 25C) 60 - 150 seconds Temperature maintained above 183C Time within 5C of actual peak temperature 10 -20 seconds Peak temperature range 220 +5/-0C or 235 +5/-0C Ramp-down rate 6 C /second max. 6 minutes max. Time 25C to peak temperature VPR 10 C /second max.
60 seconds 215-219C or 235 +5/-0C 10 C /second max.
Package Reflow Conditions
pkg. thickness 2.5mm and all bgas Convection 220 +5/-0 C VPR 215-219 C IR/Convection 220 +5/-0 C pkg. thickness < 2.5mm and pkg. volume 350 mm pkg. thickness < 2.5mm and pkg. volume < 350mm Convection 235 +5/-0 C VPR 235 +5/-0 C IR/Convection 235 +5/-0 C
www.anpec.com.tw
Copyright ANPEC Electronics Corp. Rev. A.1 - Oct., 2003
7
APM2512N
Reliability test program
Test item SOLDERABILITY HOLT PCT TST Method MIL-STD-883D-2003 MIL-STD 883D-1005.7 JESD-22-B, A102 MIL-STD 883D-1011.9 Description 245C,5 SEC 1000 Hrs Bias @ 125C 168 Hrs, 100% RH, 121C -65C ~ 150C, 200 Cycles
Carrier Tape & Reel Dimensions
E Po P P1 D
t
F W
Bo
Ao
D1 T2
Ko
J C A B
T1
Application
A 330 3
B 100 2 D 1.5 +0.1
C 13 0. 5 D1
J 2 0.5 Po
T1 T2 16.4 + 0.3 2.5 0.5 -0.2 P1 2.0 0.1 Ao
W 16+ 0.3 - 0.1 Bo
P 8 0.1 Ko 2.5 0.1
E 1.75 0.1 t 0.30.05
TO-252
F 7.5 0.1
1.5 0.25 4.0 0.1
6.8 0.1 10.4 0.1
Copyright ANPEC Electronics Corp. Rev. A.1 - Oct., 2003
8
www.anpec.com.tw
APM2512N
Cover Tape Dimensions
Application TO- 252 Carrier Width 16 Cover Tape Width 13.3 Devices Per Reel 2500
Customer Service
Anpec Electronics Corp. Head Office : 5F, No. 2 Li-Hsin Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 7F, No. 137, Lane 235, Pac Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, R. O. C. Tel : 886-2-89191368 Fax : 886-2-89191369
Copyright ANPEC Electronics Corp. Rev. A.1 - Oct., 2003
9
www.anpec.com.tw


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