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 E2D0082-17-45
Semiconductor MSM9836-XXX
Semiconductor Built-in Mask ROM Voice Synthesis IC
This version: Jan. 1998 MSM9836-XXX Previous version: May. 1997
in im el Pr y ar
GENERAL DESCRIPTION
The MSM9836 is a PCM voice synthesis IC with built-in 3-Mbit mask ROM, D/A converter, and low-pass filter (LPF). The MSM9836 is specifically designed for applications that use a microcontroller. For this reason, functional support for standalone mode and RC oscillation has been omitted from the MSM9805, and the ROM capacity and the number of phrases have been increased. The following table lists the functional differences between the MSM9836 and the MSM9805.
MSM9836 ROM Capacity Interface Oscillation Maximum Number of Phrases Status Signal 3 Mbits Microcontroller Ceramic 127 NAR/BUSY simultaneous output
MSM9805 2 Mbits Microcontroller/Standalone Ceramic/RC 63 Only NAR output when operating in microcontroller interface mode
FEATURES
* 8-bit OKI nonlinear PCM method * Sampling frequency : (Can be set for each phrase) * ROM capacity : * Maximum playback time : 4.0 kHz/5.3 kHz/6.4 kHz/8.0 kHz/10.6 kHz/12.8 kHz/ 16.0 kHz 3 Mbits 97.7 sec (fSAM = 4.0 kHz) 73.7 sec (fSAM = 5.3 kHz) 61.0 sec (fSAM = 6.4 kHz) : 4.096 MHz
* Master clock frequency (Ceramic oscillation/external clock input) * Edit ROM function * Maximum number of phrases : 127 * Built-in current mode 10-bit D/A converter * Built-in low-pass filter * Power supply voltage : +2.0 to +5.5 V * Package : 24-pin plastic SOP (SOP24-P-430-1.27-K) (Product name: MSM9836-XXXGS-K) xxx indicates code number.
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Semiconductor
BLOCK DIAGRAM
I6 I5 I4 I3 I2 I1 I0
Address Controller
7
19-Bit Multiplexer
3-Mbit ROM (Including 17 Kbits of Edit ROM & Address ROM) 8
DATA Controller TEST ST NAR BUSY 19-Bit Address Counter I/O Interface PCM Synthesizer
10
XT XT Crystal Circuit Timing Controller
10-Bit DAC & LPF
MSM9836-XXX
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EXTCK
RESET
VDD
GND
VREF
AOUT
Semiconductor
MSM9836-XXX
PIN CONFIGURATION (TOP VIEW)
VDD XT XT NC TEST BUSY EXTCK ST NC 1 2 3 4 5 6 7 8 9 24 AOUT 23 VREF 22 GND 21 NC 20 NAR 19 NC 18 I6 17 RESET 16 NC 15 I5 14 I4 13 I3
I0 10 I1 11 I2 12
NC : No connection 24-Pin Plastic SOP
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MSM9836-XXX
PIN DESCRIPTIONS
Pin Symbol Type Description The IC enters the standby state if this pin is set to "L" level. At this time, oscillation stops and AOUT output becomes GND level, then the IC returns to the initial state. 17 RESET I This IC has a built-in power-on reset circuit. To operate power-on reset correctly, apply the power within 1 ms up to VDD. If the power cannot be applied within 1ms, apply a RESET pulse during power-on. This pin has an internal pull-up resistor. Signal output pin that indicates whether the 7-bit LATCH (see Block Diagram) is idle. 20 7 NAR EXTCK O I NAR at "H" level indicates that the LATCH is empty and ST input is enabled. Ceramic oscillator input/external clock input switching pin. Set to "H" level if ceramic oscillation is used. Set to "L" level if external clock is used. Volume setting pin. If this pin is set to GND level, the maximum current is forced in, 23 VREF I and if set to VDD level, the minimum current is forced in. This pin has a built-in pull-down resistor of approx. 10 kW. Voice output pin. 24 22 1 2 AOUT GND VDD XT O -- -- I The voice signals are output as current changes. A "L" level signal is output through this pin in standby state. Ground pin. Power supply pin. Insert a bypass capacitor of 0.1 mF or more between this pin and the GND pin. Ceramic oscillator connection pin when ceramic oscillation is selected. Input from this pin if external clock is used. Ceramic oscillator connection pin when ceramic oscillation is selected. 3 5 8
10-15, 18
XT TEST ST I0 - I6 BUSY
O I I I O
Leave this pin open if external clock is used. A "L" level signal is output through this pin in standby state. Normally leave this pin open. This pin is used only for testing the internal circuit. Voice synthesis starts at fall of ST, and addresses I0 to I6 are fetched at rise of ST. Input ST when NAR, the status signal, is at "H" level. This pin has internal pull-up resistor. Phrase input pins corresponding to playback sound. This pin is at "H" level upon power-on. A "L" level signal is output through this pin for the time during which voice is being played.
6
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MSM9836-XXX
ABSOLUTE MAXIMUM RATINGS
(GND=0V) Parameter Power Supply Voltage Input Voltage Storage Temperature Symbol VDD VIN TSTG Condition Ta=25C -- Rating -0.3 to +7.0 -0.3 to VDD+0.3 -55 to +150 Unit V V C
RECOMMENDED OPERATING CONDITIONS
(GND=0 V) Parameter Power Supply Voltage Operating Temperature Original Oscillation Frequency Symbol VDD Top fOSC Condition -- -- When crystal is selected Min. 3.5 Range 2.0 to 5.5 -40 to +85 Typ. 4.096 Max. 4.5 Unit V C MHz
Note: The accuracy of the oscillation frequency when RC oscillation is selected depends largely on the accuracy of the external R and C.
ELECTRICAL CHARACTERISTICS
DC Characteristics (1)
(VDD=5.0 V, GND=0 V, Ta=-40 to +85C, unless otherwise specified) Parameter "H" Input Voltage "L" Input Voltage "H" Output Voltage "L" Output Voltage "H" Input Current 1 "H" Input Current 2 "L" Input Current 1 "L" Input Current 2 (*1) Dynamic Supply Current 1 (*2) Dynamic Supply Current 2 (*3) Standby Supply Current AOUT Output Current VREF Pin Pull-Down Resistance Symbol VIH VIL VOH VOL IIH1 IIH2 IIL1 IIL2 IDD1 IDD2 IDS IAOUT RVREF Condition -- -- IOH=-1 mA IOL=2 mA VIH=VDD Applies to XT pin only. VIH=VDD VIL=GND Internal pull-up resistor VREF=VDD, AOUT voltage=0V At maximum output current VREF=GND, AOUT voltage=0V Ta=-40 to +70C Ta=-40 to +85C At maximum output current VREF=VDD, AOUT voltage=0V -- Min. 4.2 -- 4.6 -- -- -- -10 -200 -- -- -- -- 6 7 Typ. -- -- -- -- -- -- -- -90 0.4 -- -- -- 9.5 10 Max. -- 0.8 -- 0.4 10 15 -- -30 1 16 10 50 15 13 Unit V V V V A A A A mA mA A A mA kW
*1 Applicable to RESET, ST *2 Dynamic supply current excluding DAC output current *3 Dynamic supply current at maximum output current 5/17
Semiconductor DC Characteristics (2)
MSM9836-XXX
(VDD=3.1 V, GND=0 V, Ta=-40 to +85C) Parameter "H" Input Voltage "L" Input Voltage "H" Output Voltage "L" Output Voltage "H" Input Current 1 "H" Input Current 2 "L" Input Current 1 "L" Input Current 2 (*1) Dynamic Supply Current 1 (*2) Dynamic Supply Current 2 (*3) Standby Supply Current AOUT Output Current VREF Pin Pull-Down Resistance Symbol VIH VIL VOH VOL IIH1 IIH2 IIL1 IIL2 IDD1 IDD2 IDS IAOUT RVREF Condition -- -- IOH=-1 mA IOL=2 mA VIH=VDD Applies to XT pin only. VIH=VDD VIL=GND Internal pull-up resistor VREF=VDD, AOUT voltage=0V At maximum output current VREF=GND, AOUT voltage=0V Ta=-40 to +70C Ta=-40 to +85C At maximum output current VREF=VDD, AOUT voltage=0V -- Min. 2.7 -- 2.6 -- -- -- -10 -100 -- -- -- -- 1.4 7 Typ. -- -- -- -- -- -- -- -30 0.15 -- -- -- 3.2 10 Max. -- 0.5 -- 0.4 10 15 -- -10 0.5 5.5 5 20 5 13 Unit V V V V A A A A mA mA A A mA kW
*1 Applicable to RESET, ST *2 Dynamic supply current excluding DAC output current *3 Dynamic supply current at maximum output current AC Characteristics
(VDD=5.0 V, GND=0 V, Ta=-40 to +85C) Parameter Master Clock Duty Cycle RESET Input Pulse Width RESET Input Time After Power-on ST Signal Setup Time ST Input Pulse Width The ST-ST Pulse Interval Data Setup Time Data Hold Time NAR Output Time 1 NAR Output Time 2 NAR Output Time 3 NAR Output Time 4 BUSY Output Time 1 BUSY Output Time 2 D/A Converter Change Time Standby Transition Time (at end of voice output) Silence Time Between Phrases Symbol fduty tw(RST) tD(RST) tSTP t(ST) tSS tDW tWD tSNS tNAA tNAB tNAC tSBS tBSYA tDAR, tDAF tSTB tBLN Condition -- -- -- At power-on -- Upon entering the stop code -- -- fSAM=8 kHz fSAM=8 kHz fSAM=8 kHz fSAM=8 kHz fSAM=8 kHz fSAM=8 kHz -- -- fSAM=8 kHz Min. 40 10 0 1 0.35 40 1 1 -- 350 315 350 -- 350 60 200 350 Typ. 50 -- -- -- -- -- -- -- -- 375 440 375 -- 375 64 250 375 Max. 60 -- -- -- 2000 -- -- -- 10 400 500 500 10 400 68 300 500 Unit % s s s s s s s s s s s s s ms ms s
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Semiconductor
MSM9836-XXX
TIMING DIAGRAMS
1. AC Characteristics at Power-On
VDD RESET ( I ) NAR (O) ST (I) BUSY (O) tSTP
tD(RST) tW(RST)
2. AC Characteristics in Standby Status and when the IC is Activated
I6 to I0 (I) t(ST) ST ( I ) NAR (O) BUSY (O) tDW tWD
tSNS tSBS tBSYA
AOUT (O) tDAR
tNAA Voice playback tSTB Standby transtion time tDAF
Oscillation start
D/A converter change time
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Semiconductor
3. Playback Timing
I6 to I0 (I)
1st phrase address
2nd phrase address
3rd phrase address
ST ( I ) tNAC NAR (O) BUSY (O) tNAB tBSYA
AOUT (O)
tDAR
1st phrase playback
2nd phrase playback
3rd phrase playback
tBLN Oscillation start
The pins I6 to I0 are used to enter the address of a phrase subject to voice synthesis. Voice synthesis starts by entering the ST signal during addressing.
MSM9836-XXX
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MSM9836-XXX
4. Stop Code Input Timing
I6 to I0 (I) "0000000" tSS ST ( I ) NAR (O) BUSY (O) AOUT (O) Voice stop User phrase
When I6-I0 are set to "0000000" during voice playback (during the output of "L" level at the BUSY pin), and a ST signal is input, playback stops regardless of whether NAR is at "H" or "L" level and AOUT becomes 1/2 IAOUT. Stop code becomes valid at the falling edge of ST. The stop code does not initialize internal units but only stops playback. To initialize an internal register, use the RESET pin.
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Semiconductor
MSM9836-XXX
FUNCTIONAL DESCRIPTION
1. Sampling Frequency Sampling frequencies can be set for each address of the internal ROM. The following seven frequencies can be selected when creating voice data: 4.0 kHz, 5.3 kHz, 6.4 kHz, 8.0 kHz, 10.6 kHz, 12.8 kHz, 16.0 kHz 2. Voice Playback Time As shown in Figure 1, the internal ROM consists of edit ROM area, voice data management area, test data area, and voice data area. The actual capacity for voice data is different from the indicated ROM capacity.
Edit ROM Area Voice Data Management Area Test Data Area 8 Kbits 8 Kbits 1 Kbits
Voice Data Area
Figure 1 Internal ROM (3-Mbit) Configuration Use the following expression for a rough estimate of voice playback time : Playback time = (3072 - 8 - 8 - 1) [Kbits] 1024 / 8 / (sampling frequency) [Hz] For example, if data for MSM9836 is created at an 8.0 kHz sampling rate, the playback time is (3072 - 8 - 8 - 1) [Kbits] 1024 / 8 / 8000 [Hz] = 48.8 [sec] 3. Playback Method The OKI nonlinear PCM method has been empoyed. This method is suited to the waveforms that require high accuracy around the center of an amplitude, like the amplitude of human voices. The center area has accuracy of the amplitude equivalent to a 10-bit straight PCM.
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Semiconductor 4. Edit ROM
MSM9836-XXX
With the internal edit ROM, the MSM9836 can perform continuous playback of multiple phrases with the same control as single phrase playback. For example: The phrase "Today's weather is ..." can be used to illustrate the differences between the use of the edit ROM and non-use of the edit ROM. In the case of non-use of the edit ROM, individual data must be stored in the voice data control area (see Table 1), then for playback of "Today's weather is sunny" and "Today's weather is rainy", each phrase must be addressed individually. On the other hand, the MSM9836 has edit ROM functions, which eliminate the need for an external microcontroller to provide the continuous timing necessary for voice concatenation. This means that individual phrases or words which are stored in voice data control area (see Table 2) can be concatenated in the edit ROM and assigned a single address according to their content. This feature allows for efficient use of memory for phrase storage in ROM. Table 2 shows phrases/words stored in ROM and their addresses, Table 3 shows how you can combine the phrase/word addresses (up to a maximum of 8) in the edit ROM to achieve fully concatenated phrases. The edit ROM can also perform silence playback, with no silence data required to be stored in the voice data control area. Minimum silence time ............ 32 ms Maximum silence time ........... 4064 ms Setting of silence time ............. in 32-ms steps
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Semiconductor
MSM9836-XXX
Table 1 Phrases stored in data control area (when edit ROM is not used)
Address [HEX] 01 02 03 7F Phrase Today's weather is sunny. Today's weather is rainy. Today's weather is sunny becoming cloudy, rainy in some areas.
Table 2 Phrases stored in data control area (when edit ROM is used)
Address [HEX] 01 02 03 04 05 7F Phrase Today's weather sunny rainy is
Table 3 Edit ROM Configuration
Address [HEX] 01 02 03 7F Address Assignment in Phrase ROM [01][02][05][03] "Today's weather is sunny." [01][02][05][04] "Today's weather is rainy."
Up to 8 phrases including silence can be registered into one address in the edit ROM.
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Semiconductor 5. Oscillation and Clock Input 5. 1 Ceramic oscillation Figure 2 shows an external circuit using a ceramic oscillator.
MSM9836-XXX
Pull this pin to "H" level EXTCK XT XT
C1
C2
Figure 2 External Circuit Using a Ceramic Oscillator
5. 2 External clock input Figure 3 shows a circuit for external clock input.
EXTCK XT XT Open
Pull this pin to "L" level
External oscillation circuit
Figure 3 Circuit for External Clock Input
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Semiconductor 6. Low-Pass Filter
MSM9836-XXX
In this IC, all voice outputs are through the built-in low-pass filter (LPF). Figure 4 and Table 4 show the LPF frequency characteristics and LPF cutoff frequency respectively. Only the voice output through LPF is enabled in this IC.
[dB] 20 10 0 -10 -20 -30 -40 -50 -60 -70 -80 10 100 1k 10k [Hz]
Figure 4 LPF Frequency Characteristics (fSAM=8 kHz)
Table 4 LPF Cutoff Frequency
Sampling Frequency (kHz) (fSAM) 4.0 5.3 6.4 8.0 10.6 12.8 16.0 Cutoff Frequency (kHz) (fCUT) 1.2 1.6 2.0 2.5 3.2 4.0 5.0
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Semiconductor 7. Standby Transition
MSM9836-XXX
When playback of a phrase is finished, if playback of the next phrase does not start up within tSTB (0.25 sec. typ.), the IC enters standby status and the entire operation stops.
I5-I0
ST NAR BUSY AOUT
Figure 5 Voice Playback Timing during D/A Converter Change Time If playback is attempted during D/A converter change time as shown in Figure 5, the IC exits from standby status and the output from the D/A converter begins going to the 1/2 IAOUT level. When the output reaches 1/2 IAOUT, voice playback starts.
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Semiconductor APPLICATION CIRCUIT
MSM9836-XXX
MSM9836-XXX
MSC1157 (Speaker drive amplifier)
VDD I6 I5 I4 I3 I2 I1 I0 ST RESET BUSY NAR VREF
MCU
VCC AOUT AIN SP SP EXTCK XT GND XT STBY GND VR
+ -
TEST
SEL
+ -
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Semiconductor
MSM9836-XXX
PACKAGE DIMENSIONS
(Unit : mm)
SOP24-P-430-1.27-K
Mirror finish
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 0.58 TYP.
Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
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