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Power Transistors
2SC4152
Silicon NPN triple diffusion planar type
Unit: mm
0.70.1
For high breakdown voltage high-speed switching I Features
* High-speed switching * High collector to base voltage VCBO * Wide area of safe operation (ASO) * Satisfactory linearity of forward current transfer ratio hFE * Full-pack package which can be installed to the heat sink with one screw
10.00.2 5.50.2
4.20.2 2.70.2
7.50.2
16.70.3
3.10.1
4.20.2
Solder Dip (4.0)
1.40.1
1.30.2 0.5+0.2 -0.1
14.00.5
0.80.1
I Absolute Maximum Ratings TC = 25C
Parameter Collector to base voltage Collector to emitter voltage Symbol VCBO VCER VCEO Emitter to base voltage Peak collector current Collector current Collector power dissipation TC = 25C Ta = 25C Tj Tstg VEBO ICP IC PC Rating 1 400 1 400 700 5 1.0 0.3 20 2 150 -55 to +150 C C Unit V V V V A A W
2.540.3 5.080.5
123
1 : Base 2 : Collector 3 : Emitter EIAJ : SC-67 TO-220F Package
Junction temperature Storage temperature
I Electrical Characteristics TC = 25C
Parameter Collector cutoff current Emitter cutoff current Collector to emitter voltage Symbol ICBO IEBO VCER VCEO Emitter to base voltage Forward current transfer ratio Collector to emitter saturation voltage Base to emitter saturation voltage Transition frequency Collector output capacitance Turn-on time Storage time Fall time VEBO hFE VCE(sat) VBE(sat) fT Cob ton tstg tf Conditions VCB = 1 100 V, IE = 0 VEB = 4 V, IC = 0 IC = 1 mA, RBE = 100 IC = 1 mA, IB = 0 IE = 1 mA, IC = 0 VCE = 5 V, IC = 30 mA IC = 60 mA, IB = 6 mA IC = 60 mA, IB = 6 mA VCE = 10 V, IC = 30 mA, f = 1 MHz VCB = 100 V, IE = 0, f = 1 MHz IC = 0.15 A, IB1 = 15 mA, IB2 = -30 mA, VCC = 250 V 12 6 2 3 1 1 400 700 5 10 40 2 2 V V MHz pF s s s Min Typ Max 10 10 Unit A A V V V
1
2SC4152
PC T a
40 120 (1) TC=Ta (2) With a 100 x 100 x 2mm Al heat sink (3) With a 50 x 50 x 2mm Al heat sink (4) Without heat sink (PC=2W) (1) TC=25C 100 IB=5mA 4mA 3mA
Power Transistors
IC VCE
Collector to emitter saturation voltage VCE(sat) (V)
100 IC/IB=10 30 10 3 1 0.3 0.1 0.03 0.01 0.001 0.003 TC=100C 25C -25C
VCE(sat) IC
Collector power dissipation PC (W)
30
Collector current IC (A)
80
2mA 60
20
40
10
(2) (3) (4)
1mA
20
0 0 20 40 60 80 100 120 140 160
0 0 2 4 6 8 10 12
0.01 0.03
0.1
0.3
1
Ambient temperature Ta (C)
Collector to emitter voltage VCE (V)
Collector current IC (A)
VBE(sat) IC
100
hFE IC
IC/IB=10 1000 VCE=5V 1000
fT I C
VCE=10V f=1MHz TC=25C
Base to emitter saturation voltage VBE(sat) (V)
Forward current transfer ratio hFE
30
300
Transition frequency fT (MHz)
0.1 0.3 1
300
10
100 TC=100C 30
25C
100
3
30
-25C 10
1
TC=-25C 100C
10
0.3
25C
3
3
0.1 0.001 0.003
0.01 0.03
0.1
0.3
1
1 0.001 0.003 0.01 0.03
1 0.001 0.003
0.01 0.03
0.1
0.3
1
Collector current IC (A)
Collector current IC (A)
Collector current IC (A)
Cob VCB
1000 100 IE=0 f=1MHz TC=25C 30
ton, tstg, tf IC
Pulsed tw=1ms Duty cycle=1% IC/IB=5 (2IB1=-IB2) VCC=250V TC=25C
Area of safe operation (ASO)
10 3 Non repetitive pulse TC=25C
Collector output capacitance Cob (pF)
Switching time ton,tstg,tf (s)
300
10 3 tstg 1 0.3 0.1 0.03
Collector current IC (A)
1 0.3
10ms
t=1ms
100
ton
30
0.1
DC
10
tf
0.03 0.01 0.003 0.001
3
1 1 3 10 30 100
0.01 0 0.2 0.4 0.6 0.8
1
3
10
30
100
300
1000
Collector to base voltage VCB (V)
Collector current IC (A)
Collector to emitter voltage VCE (V)
2
Power Transistors
Area of safe operation, reverse bias ASO
1.6 1.4 Lcoil=200H IC/IB=10 (IB1=-IB2) TC=25C ICP
2SC4152
Reverse bias ASO measuring circuit
L coil IB1 Vin T.U.T IC
Collector current IC (A)
1.2 1.0 0.8 0.6 0.4 0.2 <1mA 0 0 200 400 600 800 1000 1200 1400 1600
-IB2
VCC
IC
tW
Vclamp
Collector to emitter voltage VCE (V)
Rth(t) t
10000 Note: Rth was measured at Ta=25C and under natural convection. (1) PT=10V x 0.2A (2W) and without heat sink (2) PT=10V x 1.0A (10W) and with a 100 x 100 x 2mm Al heat sink
Thermal resistance Rth(t) (C/W)
1000
100
(1)
10
(2)
1
0.1 10-4
10-3
10-2
10-1
1
10
102
103
104
Time t (s)
3
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(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuit examples of the products. It does not constitute the warranting of industrial property, the granting of relative rights, or the granting of any license. (3) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: * Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. * Any applications other than the standard applications intended. (4) The products and product specifications described in this material are subject to change without notice for reasons of modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, redundant design is recommended, so that such equipment may not violate relevant laws or regulations because of the function of our products. (6) When using products for which dry packing is required, observe the conditions (including shelf life and after-unpacking standby time) agreed upon when specification sheets are individually exchanged. (7) No part of this material may be reprinted or reproduced by any means without written permission from our company.
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2001 MAR

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