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 PD -9.1668A
IRG4ZC70UD
INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST SOFT RECOVERY DIODE
Features
q q
Surface Mountable UltraFast CoPack IGBT
C
q q q q q
UltraFast IGBT optimized for high switching frequencies n-channel IGBT co-packaged with HEXFREDTM ultrafast, ultra-soft recovery antiparallel diodes for use in bridge configurations Low gate charge G Low profile low inductance SMD-10 package E(k) Separated control & Power-connections for easy paralleling Inherently coplanar pins and tab Easy solder inspection and cleaning
VCES = 600V VCE(ON)typ = 1.5V
@VGE = 15V, IC = 50A
E
Benefits
q q q q
Highest power density and efficiency available HEXFRED diodes optimized for performance with IGBTs; Minimized recovery characteristics IGBTs optimized for specific application conditions; high input impedance requires low gate drive power Low noise and interference Parameter Max.
600 100 50 400 400 50 400 20 350 140 -55 to + 150
SMD-10
Absolute Maximum Ratings
Units
V A VCES IC @ TC = 25C IC @ TC = 100C I CM ILM IF @ TC = 100C IFM VGE PD @ TC = 25C PD @ TC = 100C TJ TSTG Collector-to-Emitter Breakdown Voltage Continuous Collector Current Continuous Collector Current Pulsed Collector Current Clamped Inductive Load Current Diode Continuous Forward Current Diode Maximum Forward Current Gate-to-Emitter Voltage Maximum Power Dissipation Maximum Power Dissipation Operating Junction and Storage Temperature Range
V W C
Thermal Resistance
Parameter
RJC RJC RCS Wt Junction-to-Case - IGBT Junction-to-Case - Diode SMD-10 Case-to-Heatsink (typical), * Weight
Min.
-- -- -- --
Typ.
-- -- 0.59 6.0(0.21)
Max.
0.36 0.69 -- --
Units
C/W g (oz)
Notes: Repetitive rating: VGE = 20V; pulse width limited by maximum junction temperature (figure 20) VCC = 80%(VCES), VGE = 20V, L=10H, RG= 5.0 (figure 19)
Pulse width 80s; duty factor 0.1%. Pulse width 5.0s, single shot.
* Assumes device soldered to 3.0 oz. Cu on 3.0mm IMS/Aluminum board, mounted to flat, greased heatsink.
IRG4ZC70UD
Electrical Characteristics @ TJ = 25C (unless otherwise specified)
V(BR)CES
V(BR)CES/TJ
VCE(on)
VGE(th) VGE(th)/TJ gfe ICES VFM IGES
Parameter Min. Typ. Max. Units Collector-to-Emitter Breakdown Voltage 600 -- -- V Temperature Coeff. of Breakdown Voltage -- 0.36 -- V/C Collector-to-Emitter Saturation Voltage -- 1.49 1.9 -- 1.80 -- V -- 1.47 -- Gate Threshold Voltage 3.0 -- 6.0 Temperature Coeff. of Threshold Voltage -- -7.6 -- mV/C Forward Transconductance 34 52 -- S Zero Gate Voltage Collector Current -- -- 250 A -- -- 1.3 mA Diode Forward Voltage Drop -- 1.24 1.5 V -- 1.16 1.3 Gate-to-Emitter Leakage Current -- -- 100 nA
Conditions VGE = 0V, IC = 250A VGE = 0V, IC = 1.0mA IC = 50A VGE = 15V IC = 100A see figure 2, 5 IC = 50A, TJ = 150C VCE = VGE, IC = 250A VCE = VGE, IC = 250A VCE = 100V, IC = 50A VGE = 0V, VCE = 600V VGE = 0V, VCE = 600V, TJ = 150C IC = 50A see figure 13 IC = 50A, TJ = 150C VGE = 20V
Switching Characteristics @ TJ = 25C (unless otherwise specified)
Qg Qge Qgc td(on) tr td(off) tf Eon Eoff Ets td(on) tr td(off) tf Ets LE Cies Coes Cres t rr I rr Q rr di(rec)M/dt Min. -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Diode Peak Reverse Recovery Current -- -- Diode Reverse Recovery Charge -- -- Diode Peak Rate of Fall of Recovery -- During tb -- Parameter Total Gate Charge (turn-on) Gate - Emitter Charge (turn-on) Gate - Collector Charge (turn-on) Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Switching Loss Turn-Off Switching Loss Total Switching Loss Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Switching Loss Internal Emitter Inductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Diode Reverse Recovery Time Typ. 430 48 130 71 41 250 110 1.59 1.78 3.37 68 43 370 130 4.5 2.0 7400 730 90 90 120 7.3 11 360 780 370 220 Max. Units Conditions 640 IC = 50A 72 nC VCC = 400V see figure 8 190 VGE = 15V -- TJ = 25C -- ns IC = 50A, VCC = 480V 370 VGE = 15V, RG = 5.0 220 Energy losses include "tail" and -- diode reverse recovery. -- mJ see figures 9, 10, 18 4.7 -- TJ = 150C, see figures 11, 18 -- ns IC = 50A, VCC = 480V -- VGE = 15V, RG = 5.0 -- Energy losses include "tail" and -- mJ diode reverse recovery. -- nH -- VGE = 0V -- pF VCC = 30V see figure 7 -- = 1.0MHz 140 ns TJ = 25C see figure 180 TJ = 125C 14 IF = 50A 11 A TJ = 25C see figure 16 TJ = 125C 15 VR = 200V 550 nC TJ = 25C see figure 1200 TJ = 125C 16 di/dt = 200As -- A/s TJ = 25C see figure -- TJ = 125C 17
2
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IRG4ZC70UD
35
F or b oth:
30
LOAD CURRENT (A)
25
S q u a re w a v e : 60% of rated voltage
D uty c y c le : 50 % T J = 12 5 C T sink = 90 C G a te d riv e a s s pe c ified
P ow er D is s ipation = 27 W
20
15
I
10
Id e a l d io d es
5
0 0.1 1 10 100
f, Frequency (KHz)
Fig. 1 - Typical Load Current vs. Frequency
(Load Current = IRMS of fundamental)
1000
1000
I C , Collector-to-Emitter Current (A)
TJ = 25 C TJ = 150 C
I C , Collector-to-Emitter Current (A)
TJ = 150 C
100
100
TJ = 25 C
10
10
1 0.0
V GE = 15V 20s PULSE WIDTH
1.0 2.0 3.0 4.0 5.0
1 5.0
V CC = 50V 5s PULSE WIDTH
6.0 7.0 8.0 9.0
VCE , Collector-to-Emitter Voltage (V)
VGE , Gate-to-Emitter Voltage (V)
Fig. 2 - Typical Output Characteristics
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Fig. 3 - Typical Transfer Characteristics
3
IRG4ZC70UD
100 2.5
80
VCE , Collector-to-Emitter Voltage(V)
VGE = 15V 80 us PULSE WIDTH
Maximum DC Collector Current(A)
2.0
60
IC = 100 A
40
1.5
IC = 50 A IC = 25 A
20
0 25 50 75 100 125 150
1.0 -60 -40 -20
0
20
40
60
80 100 120 140 160
TC , Case Temperature ( C)
TJ , Junction Temperature ( C)
Fig. 4 - Maximum Collector Current vs. Case Temperature
Fig. 5 - Typical Collector-to-Emitter Voltage vs. Junction Temperature
1
Thermal Response (Z thJC )
D = 0.50 0.1 0.20 0.10 0.05 0.02 0.01 P DM SINGLE PULSE (THERMAL RESPONSE) t1 t2 Notes: 1. Duty factor D = t 1 / t2 2. Peak T = PDM x Z thJC + TC J 0.0001 0.001 0.01 0.1 1
0.01
0.001 0.00001
t1 , Rectangular Pulse Duration (sec)
Fig. 6 - Maximum Effective Transient Thermal Impedance, Junction-to-Case
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IRG4ZC70UD
14000 20
12000
VGE , Gate-to-Emitter Voltage (V)
VGE = 0V, f = 1MHz Cies = Cge + Cgc , Cce SHORTED Cres = Cgc Coes = Cce + Cgc
VCC = 400V I C = 50A
16
C, Capacitance (pF)
10000
Cies
8000
12
6000
8
4000
Coes
4
2000
Cres
1 10 100
0
0 0 100 200 300 400 500
VCE , Collector-to-Emitter Voltage (V)
QG , Total Gate Charge (nC)
Fig. 7 - Typical Capacitance vs. Collector-to-Emitter Voltage
Fig. 8 - Typical Gate Charge vs. Gate-to-Emitter Voltage
8.0
Total Switching Losses (mJ)
6.0
Total Switching Losses (mJ)
V CC V GE TJ 7.0 I C
= 480V = 15V = 25 C = 50A
100
RG = 5.0 Ohm VGE = 15V VCC = 480V
10
IC = 100 A
5.0
IC = 50 A IC = 25 A
4.0
3.0 0 10 20 30 40 50
1 -60 -40 -20
0
20
40
60
80 100 120 140 160
RG , Gate Resistance ( )
TJ , Junction Temperature C ) (
Fig. 9 - Typical Switching Losses vs. Gate Resistance
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Fig. 10 - Typical Switching Losses vs. Junction Temperature
5
IRG4ZC70UD
12
8
6
4
I C , Collector-to-Emitter Current (A)
Total Switching Losses (mJ)
RG TJ VCC 10 VGE
= Ohm 5.0 = 150 C = 480V = 15V
1000
VGE = 20V T J = 125 o C
100
10
2
0 0 20 40 60 80 100
SAFE OPERATING AREA
1 1 10 100 1000
I C , Collector-to-emitter Current (A)
VCE , Collector-to-Emitter Voltage (V)
Fig. 11 - Typical Switching Losses vs. Collector-to-Emitter Current
1000
Fig. 12 - Turn-Off SOA
Instantaneous forward current - IF (A)
100
TJ = 150C TJ = 125C TJ = 25C
10
1 0.0 0.4 0.8 1.2 1.6 2.0
F orward V oltage D rop - V F M (V )
Fig. 13 - Typical Forward Voltage Drop vs. Instantaneous Forward Current
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IRG4ZC70UD
100 150
I F = 100A I F = 50A I F = 25A
120
I F = 100A I F = 50A I F = 25A
90
trr- (nC)
Irr- ( A)
60 30 V R = 2 00 V T J = 1 2 5C T J = 2 5 C 0 100
10
VR = 2 00 V T J = 1 2 5C T J = 2 5 C 1000 1 100 1000
di f /dt - (A / s)
di f /dt - (A/ s)
Fig. 14 - Typical Reverse Recovery vs. dif/dt
4000 V R = 2 00 V T J = 1 2 5C T J = 2 5 C
Fig. 15 - Typical Recovery Current vs. dif/dt
10000 VR = 2 00 V T J = 1 2 5C T J = 2 5 C
I F = 100A
3000
IF = 100A I F = 50A
I F = 50A
di (rec) M/dt- (A /s)
IF = 25A
I F = 25A
Qrr- (nC)
1000
2000
1000
0 100
100 100
1000
di f /dt - (A / s)
1000
di f /dt - (A/ s)
Fig. 16 - Typical Stored Charge vs. dif/dt
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Fig. 17 - Typical di(rec)M/dt vs. dif/dt
7
IRG4ZC70UD
Same type device as D .U.T.
90% V ge +V ge
V ce
80% of Vce
430F D .U .T.
Ic 10% V ce Ic 5% Ic td (off) tf 90% Ic
Fig. 18a - Test Circuit for Measurement of
ILM, Eon, Eoff(diode), trr, Qrr, Irr, td(on), tr, td(off), tf
E off =
Vce Ic dt
t1+5 S V ce ic dt t1
t1
t2
Fig. 18b - Test Waveforms for Circuit of Fig. 18a, Defining
Eoff, td(off), tf
G A T E V O LT A G E D .U .T . 10% + V g +V g
trr Ic
Q rr =
trr id dt Ic dt tx
tx 10% V c c Vce 10% Ic 90% Ic D U T V O LT A G E AND CURRENT Ipk Ic
10% Irr Vcc
V pk Irr
Vcc
D IO D E R E C O V E R Y W AVEFORMS td(on) tr 5% V c e t2 E on = V c e ieIc dt Vce dt t1 t2 D IO D E R E V E R S E RECOVERY ENERG Y t3 t4
E rec =
Vc Ic dt
t4 V d id dt t3
t1
Fig. 18c - Test Waveforms for Circuit of Fig. 18a,
Defining Eon, td(on), tr 8
Fig. 18d - Test Waveforms for Circuit of Fig. 18a,
Defining Erec, trr, Qrr, Irr www.irf.com
IRG4ZC70UD
V g G A T E S IG N A L D E V IC E U N D E R T E S T C U R R E N T D .U .T .
V O LT A G E IN D .U .T .
C U R R E N T IN D 1
t0
t1
t2
Figure 18e. Macro Waveforms for Figure 18a's Test Circuit
L 1000V 50V 600 0 F 100 V Vc*
D.U.T.
RL= 0 - 480V
480V 4 X IC @25C
Figure 19. Clamped Inductive Load Test Circuit
Figure 20. Pulsed Collector Current Test Circuit
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9
IRG4ZC70UD
Case Outline -- SMD-10
Dimensions are shown in millimeters
17.30 14.20
4.27 n/c
E(k) G 0.90 5.55
29.00
C
0.90 E E
Recommended footprint
WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, Tel: (310) 322 3331 EUROPEAN HEADQUARTERS: Hurst Green, Oxted, Surrey RH8 9BB, UK Tel: ++ 44 1883 732020 IR CANADA: 7321 Victoria Park Ave., Suite 201, Markham, Ontario L3R 2Z8, Tel: (905) 475 1897 IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg Tel: ++ 49 6172 96590 IR ITALY: Via Liguria 49, 10071 Borgaro, Torino Tel: ++ 39 11 451 0111 IR FAR EAST: K&H Bldg., 2F, 30-4 Nishi-Ikebukuro 3-Chome, Toshima-Ku, Tokyo Japan 171 Tel: 81 3 3983 0086 IR SOUTHEAST ASIA: 315 Outram Road, #10-02 Tan Boon Liat Building, Singapore 0316 Tel: 65 221 8371 http://www.irf.com/ Data and specifications subject to change without notice. 3/98
10
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