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| LMU112 DEVICES INCORPORATED 12 x 12-bit Parallel Multiplier LMU112 DEVICES INCORPORATED 12 x 12-bit Parallel Multiplier DESCRIPTION The LMU112 is a high-speed, low power 12-bit parallel multiplier built using advanced CMOS technology. The LMU112 is pin and functionally compatible with Fairchilds's MPY112K. The A and B input operands are loaded into their respective registers on the rising edge of the separate clock inputs (CLK A and CLK B). Two's complement or unsigned magnitude operands are accommodated via the operand control bit (TC) which is loaded along with the B operands. The operands are specified to be in two's complement format when TC is asserted and unsigned magnitude when TC is deasserted. Mixed mode operation is not allowed. For two's complement operands, the 17 most significant bits at the output of the asynchronous multiplier array are shifted one bit position to the left. This is done to discard the redundant copy of the sign-bit, which is in the most significant bit position, and extend the bit precision by one bit. The result is then truncated to the 16 MSB's and loaded into the output register on the rising edge of CLK B. The contents of the output register are made available via three-state buffers by asserting OE. When OE is deasserted, the outputs (R23-8) are in the high impedance state. FEATURES u u u u 25 ns Worst-Case Multiply Time Low Power CMOS Technology Replaces Fairchild MPY112K Two's Complement or Unsigned Operands u Three-State Outputs u Package Styles Available: * 48-pin PDIP * 52-pin PLCC, J-Lead LMU112 BLOCK DIAGRAM A11-0 12 CLK A CLK B A REGISTER TC B11-0 12 B REGISTER 24 FORMAT ADJUST 16 RESULT REGISTER OE 16 R23-8 Multipliers 1 08/16/2000-LDS.112-K LMU112 DEVICES INCORPORATED 12 x 12-bit Parallel Multiplier FIGURE 1A. INPUT FORMATS AIN Fractional Two's Complement (TC = 1) 11 10 9 -20 2-1 2-2 (Sign) BIN 210 2-9 2-10 2-11 11 10 9 -20 2-1 2-2 (Sign) 210 2-9 2-10 2-11 Integer Two's Complement (TC = 1) 11 10 9 -211 210 29 (Sign) 210 22 21 20 11 10 9 -211 210 29 (Sign) 210 22 21 20 Unsigned Fractional (TC = 0) 11 10 9 2-1 2-2 2-3 210 2-10 2-11 2-12 11 10 9 2-1 2-2 2-3 210 2-10 2-11 2-12 Unsigned Integer (TC = 0) 11 10 9 211 210 29 210 22 21 20 11 10 9 211 210 29 210 22 21 20 FIGURE 1B. OUTPUT FORMATS MSP Fractional Two's Complement 23 22 21 -20 2-1 2-2 (Sign) LSP 14 13 12 2-9 2-10 2-11 Integer Two's Complement 11 10 9 8 2-12 2-13 2-14 2-15 23 22 21 -222 221 220 (Sign) 14 13 12 213 212 211 Unsigned Fractional 11 10 9 8 210 29 28 27 23 22 21 2-1 2-2 2-3 14 13 12 2-10 2-11 2-12 Unsigned Integer 11 10 9 8 2-13 2-14 2-15 2-16 23 22 21 223 222 221 14 13 12 214 213 212 11 10 9 8 211 210 29 28 Multipliers 2 08/16/2000-LDS.112-K LMU112 DEVICES INCORPORATED 12 x 12-bit Parallel Multiplier MAXIMUM RATINGS Above which useful life may be impaired (Notes 1, 2, 3, 8) Storage temperature ........................................................................................................... -65C to +150C Operating ambient temperature ........................................................................................... -55C to +125C VCC supply voltage with respect to ground ............................................................................ -0.5 V to +7.0 V Input signal with respect to ground ........................................................................................ -3.0 V to +7.0 V Signal applied to high impedance output ............................................................................... -3.0 V to +7.0 V Output current into low outputs ............................................................................................................. 25 mA Latchup current ............................................................................................................................... > 400 mA OPERATING CONDITIONS To meet specified electrical and switching characteristics Mode Active Operation, Commercial Active Operation, Military Temperature Range (Ambient) 0C to +70C -55C to +125C Supply Voltage 4.75 V VCC 5.25 V 4.50 V VCC 5.50 V ELECTRICAL CHARACTERISTICS Over Operating Conditions (Note 4) Symbol VOH VOL VIH VIL IIX IOZ ICC1 ICC2 Parameter Output High Voltage Output Low Voltage Input High Voltage Input Low Voltage Input Current Output Leakage Current VCC Current, Dynamic VCC Current, Quiescent (Note 3) Test Condition VCC = Min., IOH = -2.0 mA VCC = Min., IOL = 8.0 mA Min 2.4 Typ Max Unit V 0.5 2.0 0.0 VCC 0.8 20 20 10 20 1.0 V V V A A mA mA Ground VIN VCC (Note 12) Ground VOUT VCC (Note 12) (Notes 5, 6) (Note 7) Multipliers 3 08/16/2000-LDS.112-K 432109876543210987654321 432109876543210987654321 432109876543210987654321 432109876543210987654321 *DISCONTINUED SPEED GRADE Symbol Symbol 2121098765432109876543210987654321 2121098765432109876543210987654321 2121098765432109876543210987654321 2121098765432109876543210987654321 2121098765432109876543210987654321 2121098765432109876543210987654321 2121098765432109876543210987654321 2121098765432109876543210987654321 2121098765432109876543210987654321 2121098765432109876543210987654321 2121098765432109876543210987654321 2121098765432109876543210987654321 2121098765432109876543210987654321 2121098765432109876543210987654321 2121098765432109876543210987654321 2121098765432109876543210987654321 2121098765432109876543210987654321 2121098765432109876543210987654321 2121098765432109876543210987654321 2121098765432109876543210987654321 2121098765432109876543210987654321 2121098765432109876543210987654321 2121098765432109876543210987654321 2121098765432109876543210987654321 2121098765432109876543210987654321 2121098765432109876543210987654321 2121098765432109876543210987654321 2121098765432109876543210987654321 2121098765432109876543210987654321 Min 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 10987654321 210987654321 210987654321 2 Min DEVICES INCORPORATED SWITCHING WAVEFORMS MILITARY OPERATING RANGE (-55C to +125C) Notes 9, 10 (ns) COMMERCIAL OPERATING RANGE (0C to +70C) Notes 9, 10 (ns) SWITCHING CHARACTERISTICS tDIS tENA tD tH tS tPW tMC tDIS tENA tD tH tS tPW tMC INPUT CLK B CLK A R23-8 OE Parameter Parameter Three-State Output Disable Delay (Note 11) Three-State Output Enable Delay (Note 11) Output Delay Input Register Hold Time Input Register Setup Time Clock Pulse Width Clocked Multiply Time Three-State Output Disable Delay (Note 11) Three-State Output Enable Delay (Note 11) Output Delay Input Register Hold Time Input Register Setup Time Clock Pulse Width Clocked Multiply Time tS tH tDIS HIGH IMPEDANCE tMC 4 tPW tENA 12 x 12-bit Parallel Multiplier 15 20 15 15 3 3 60* 65* tPW Max Max 25 25 25 60 30 30 30 65 tD Min LMU112- 50 Min 15 20 15 15 3 3 LMU112- 55* Max Max 30 30 30 25 25 25 55 50 Multipliers LMU112 Min Min 08/16/2000-LDS.112-K 12 10 12 10 3 1 30* 25 Max Max 25 25 25 20 20 20 30 25 LMU112 DEVICES INCORPORATED 12 x 12-bit Parallel Multiplier NOTES 9. AC specifications are tested with input transition times less than 3 ns, output reference levels of 1.5 V (except tDIS test), and input levels of nominally 0 to 3.0 V. Output loading may be a resistive divider which provides for specified IOH and IOL at an output voltage of VOH min and VOL max 2. The products described by this spec- respectively. Alternatively, a diode ification include internal circuitry de- bridge with upper and lower current signed to protect the chip from damagsources of IOH and IOL respectively, ing substrate injection currents and ac- and a balancing voltage of 1.5 V may be cumulations of static charge. Neverthe- used. Parasitic capacitance is 30 pF less, conventional precautions should minimum, and may be distributed. be observed during storage, handling, and use of these circuits in order to This device has high-speed outputs caavoid exposure to excessive electrical pable of large instantaneous current stress values. pulses and fast turn-on/turn-off times. As a result, care must be exercised in the 3. This device provides hard clamping of testing of this device. The following transient undershoot and overshoot. In- measures are recommended: put levels below ground or above VCC will be clamped beginning at -0.6 V and a. A 0.1 F ceramic capacitor should be VCC + 0.6 V. The device can withstand installed between VCC and Ground indefinite operation with inputs in the leads as close to the Device Under Test range of -0.5 V to +7.0 V. Device opera- (DUT) as possible. Similar capacitors tion will not be adversely affected, how- should be installed between device VCC ever, input current levels will be well in and the tester common, and device ground and tester common. excess of 100 mA. 4. Actual test conditions may vary from b. Ground and VCC supply planes those designated but operation is guar- must be brought directly to the DUT anteed as specified. socket or contactor fingers. 5. Supply current for a given applica- c. Input voltages should be adjusted to tion can be accurately approximated by: compensate for inductive ground and VCC noise to maintain required DUT input NCV2 F levels relative to the DUT ground pin. 4 where 10. Each parameter is shown as a minimum or maximum value. Input requirements are specified from the point of view of the external system driving the chip. Setup time, for example, is specified as a minimum since the exter6. Tested with all outputs changing ev- nal system must supply at least that ery cycle and no load, at a 5 MHz clock much time to meet the worst-case requirements of all parts. Responses from rate. the internal circuitry are specified from 7. Tested with all inputs within 0.1 V of the point of view of the device. Output VCC or Ground, no load. delay, for example, is specified as a 8. These parameters are guaranteed maximum since worst-case operation of any device always provides data within but not 100% tested. that time. N = total number of device outputs C = capacitive load per output V = supply voltage F = clock frequency 1. Maximum Ratings indicate stress specifications only. Functional operation of these products at values beyond those indicated in the Operating Conditions table is not implied. Exposure to maximum rating conditions for extended periods may affect reliability. 11. For the tENA test, the transition is measured to the 1.5 V crossing point with datasheet loads. For the tDIS test, the transition is measured to the 200mV level from the measured steady-state output voltage with 10mA loads. The balancing voltage, VTH, is set at 3.5 V for Z-to-0 and 0-to-Z tests, and set at 0 V for Zto-1 and 1-to-Z tests. 12. These parameters are only tested at the high temperature extreme, which is the worst case for leakage current. FIGURE A. OUTPUT LOADING CIRCUIT DUT S1 IOL CL IOH VTH FIGURE B. THRESHOLD LEVELS tENA OE Z 0 1.5 V 1.5 V 1.5 V tDIS 3.5V Vth VOL* 0.2 V 0 1 Z Z 1.5 V VOH* 0.2 V Z 1 0V Vth VOL* Measured VOL with IOH = -10mA and IOL = 10mA VOH* Measured VOH with IOH = -10mA and IOL = 10mA Multipliers 5 08/16/2000-LDS.112-K LMU112 DEVICES INCORPORATED 12 x 12-bit Parallel Multiplier ORDERING INFORMATION 48-pin 52-pin A10 A11 B0 B1 B2 B3 B4 B5 B6 B7 B8 VCC VCC B9 B10 B11 TC CLK B OE R23 R22 R21 R20 R19 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 CLK A GND GND R8 R9 R10 R11 R12 R13 R14 R15 R16 R17 R18 B4 B5 B6 B7 B8 VCC VCC B9 B10 B11 TC CLK B NC 8 9 10 11 12 13 14 15 16 17 18 19 NC B3 B2 B1 B0 A11 A10 A9 A8 A7 A6 A5 A4 7 6 5 4 3 2 1 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 Top View 20 34 21 22 23 24 25 26 27 28 29 30 31 32 33 NC A3 A2 A1 A0 CLK A GND GND R8 R9 R10 R11 R12 Speed Plastic DIP (P5) 0C to +70C -- COMMERCIAL SCREENING 50 ns 25 ns LMU112PC50 LMU112PC25 LMU112JC50 LMU112JC25 -55C to +125C -- COMMERCIAL SCREENING -55C to +125C -- MIL-STD-883 COMPLIANT 6 OE R23 R22 R21 R20 R19 R18 R17 R16 R15 R14 R13 NC Plastic J-Lead Chip Carrier (J5) Multipliers 08/16/2000-LDS.112-K |
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