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| Transistor 2SC4606 Silicon NPN epitaxial planar type For low-frequency driver amplification Complementary to 2SA1762 6.90.1 2.50.1 (1.0) (1.5) (1.0) 3.50.1 2.00.2 2.40.2 Unit: mm s q q Features High collector to emitter voltage VCEO. Optimum for the driver stage of a low-frequency and 25 to 30W output amplifier. M type package allowing easy automatic and manual insertion as well as stand-alone fixing to the printed circuit board. (0.4) (1.5) R 0.9 R 0.7 1.00.1 q (0.85) 1.250.05 0.450.05 0.550.1 s Absolute Maximum Ratings Parameter Collector to base voltage Collector to emitter voltage Emitter to base voltage Peak collector current Collector current Collector power dissipation Junction temperature Storage temperature * (Ta=25C) Ratings 80 80 5 1 0.5 1 150 -55 ~ +150 1cm2 Unit V V V A A W C C 1:Base 2:Collector 3:Emitter 3 (2.5) Symbol VCBO VCEO VEBO ICP IC PC* Tj Tstg 2 (2.5) 1 M-A1 Package Printed circuit board: Copper foil area of thickness of 1.7mm for the collector portion or more, and the board s Electrical Characteristics Parameter Collector cutoff current Collector to base voltage Collector to emitter voltage Emitter to base voltage Forward current transfer ratio Collector to emitter saturation voltage Base to emitter saturation voltage Transition frequency Collector output capacitance (Ta=25C) Symbol ICBO VCBO VCEO VEBO hFE1 hFE2 VCE(sat) VBE(sat) fT Cob *1 Conditions VCB = 20V, IE = 0 IC = 10A, IE = 0 IC = 100A, IB = 0 IE = 10A, IC = 0 VCE = 10V, IC = 150mA*2 VCE = 5V, IC = 500mA*2 IC = 300mA, IB = 30mA*2 IC = 300mA, IB = 30mA*2 VCB = 10V, IE = -50mA, f = 200MHz VCB = 10V, IE = 0, f = 1MHz min typ max 0.1 Unit A V V V 80 80 5 130 50 100 0.2 0.85 120 11 *2 330 0.4 1.2 MHz 20 pF Pulse measurement *1h FE1 Rank classification R 130 ~ 220 S 185 ~ 330 Rank hFE1 4.10.2 4.50.1 V V 469 Transistor PC -- Ta 1.4 2SC4606 IC -- VCE 1.2 Ta=25C 1.0 IB=10mA 1.0 1.2 VCE=10V Ta=25C IC -- I B Collector power dissipation PC (W) 1.2 Printed circut board: Copper foil area of 1cm2 or more, and the board thickness of 1.7mm for the collector portion. Collector current IC (A) 1.0 0.8 Collector current IC (A) 9mA 8mA 7mA 6mA 5mA 0.8 0.8 0.6 4mA 3mA 0.6 0.6 0.4 2mA 0.2 1mA 0.4 0.4 0.2 0.2 0 0 20 40 60 80 100 120 140 160 0 0 2 4 6 8 10 0 0 2 4 6 8 10 Ambient temperature Ta (C) Collector to emitter voltage VCE (V) Base current IB (mA) VCE(sat) -- IC Collector to emitter saturation voltage VCE(sat) (V) 10 3 1 0.3 Ta=75C 0.1 0.03 0.01 0.003 0.001 1 3 10 30 100 300 1000 25C -25C VBE(sat) -- IC Base to emitter saturation voltage VBE(sat) (V) IC/IB=10 100 30 10 3 25C 1 75C 0.3 0.1 0.03 0.01 1 3 10 30 100 300 1000 Ta=-25C IC/IB=10 300 hFE -- IC VCE=10V Forward current transfer ratio hFE 250 Ta=75C 25C 150 -25C 200 100 50 0 1 3 10 30 100 300 1000 Collector current IC (mA) Collector current IC (mA) Collector current IC (mA) fT -- IE 200 Cob -- VCB Collector output capacitance Cob (pF) VCB=10V Ta=25C 50 IE=0 f=1MHz Ta=25C 40 103 104 ICBO -- Ta VCB=20V Transition frequency fT (MHz) 160 120 30 ICBO (Ta) ICBO (Ta=25C) 102 80 20 10 10 40 0 -1 0 -3 -10 -30 -100 1 3 10 30 100 1 0 60 120 180 Emitter current IE (mA) Collector to base voltage VCB (V) Ambient temperature Ta (C) 470 Transistor ICEO -- Ta 105 VCE=10V 2SC4606 Area of safe operation (ASO) 10 3 Single pulse Ta=25C Collector current IC (A) 104 1 0.3 ICP IC t=10ms ICEO (Ta) ICEO (Ta=25C) 103 DC 0.1 0.03 0.01 0.003 t=1s 102 10 1 0 20 40 60 80 100 120 140 0.001 0.1 0.3 1 3 10 30 100 Ambient temperature Ta (C) Collector to emitter voltage VCE (V) 471 Request for your special attention and precautions in using the technical information and semiconductors described in this material (1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the product or technologies as described in this material. (4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: * Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. * Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd. 2002 JUL |
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