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INTEGRATED CIRCUITS
DATA SHEET
TDA7000 FM radio circuit
Product specification File under Integrated Circuits, IC01 May 1992
Philips Semiconductors
Product specification
FM radio circuit
GENERAL DESCRIPTION
TDA7000
The TDA7000 is a monolithic integrated circuit for mono FM portable radios, where a minimum on peripheral components is important (small dimensions and low costs). The IC has an FLL (Frequency-Locked-Loop) system with an intermediate frequency of 70 kHz. The i.f. selectivity is obtained by active RC filters. The only function which needs alignment is the resonant circuit for the oscillator, thus selecting the reception frequency. Spurious reception is avoided by means of a mute circuit, which also eliminates too noisy input signals. Special precautions are taken to meet the radiation requirements. The TDA7000 includes the following functions: * R.F. input stage * Mixer * Local oscillator * I.F. amplifier/limiter * Phase demodulator * Mute detector * Mute switch QUICK REFERENCE DATA Supply voltage range (pin 5) Supply current at VP = 4,5 V R.F. input frequency range Sensitivity for -3 dB limiting (e.m.f. voltage) (source impedance: 75 ; mute disabled) Signal handling (e.m.f. voltage) (source impedance: 75 ) A.F. output voltage at RL = 22 k PACKAGE OUTLINE 18-lead DIL; plastic (SOT102HE); SOT102-1; 1996 July 24. EMF typ. Vo typ. 200 mV 75 mV EMF typ. 1,5 V VP IP frf 2,7 to 10 V typ. 8 mA 1,5 to 110 MHz
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Philips Semiconductors
Product specification
FM radio circuit
TDA7000
Fig.1 Block diagram.
May 1992
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Philips Semiconductors
Product specification
FM radio circuit
RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) Supply voltage (pin 5) Oscillator voltage (pin 6) Total power dissipation Storage temperature range Operating ambient temperature range VP V6-5 Tstg Tamb max.
TDA7000
12 V
VP-0,5 to VP + 0,5 V -55 to +150 C 0 to + 60 C
see derating curve Fig.2
Fig.2 Power derating curve.
D.C. CHARACTERISTICS VP = 4,5 V; Tamb = 25 C; measured in Fig.4; unless otherwise specified PARAMETER Supply voltage (pin 5) Supply current at VP = 4,5 V Oscillator current (pin 6) Voltage at pin 14 Output current at pin 2 Voltage at pin 2; RL = 22 k IP I6 V14-16 I2 V2-16 - - - - - 8 280 1,35 60 1,3 - - - - - mA A V A V SYMBOL VP MIN. 2,7 TYP. 4,5 MAX. 10 V UNIT
May 1992
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Philips Semiconductors
Product specification
FM radio circuit
TDA7000
A.C. CHARACTERISTICS VP = 4,5 V; Tamb = 25 C; measured in Fig.4 (mute switch open, enabled); frf = 96 MHz (tuned to max. signal at 5 V e.m.f.) modulated with f = 22,5 kHz; fm = 1 kHz; EMF = 0,2 mV (e.m.f. voltage at a source impedance of 75 ); r.m.s. noise voltage measured unweighted (f = 300 Hz to 20 kHz); unless otherwise specified. PARAMETER Sensitivity (see Fig.3) (e.m.f. voltage) for -3 dB limiting; muting disabled for -3 dB muting for S/N = 26 dB Signal handling (e.m.f. voltage) for THD < 10%; f = 75 kHz Signal-to-noise ratio Total harmonic distortion at f = 22,5 kHz at f = 75 kHz AM suppression of output voltage (ratio of the AM output signal referred to the FM output signal) FM signal: fm = 1 kHz; f = 75 kHz AM signal: fm = 1 kHz; m = 80% Ripple rejection (VP = 100 mV; f = 1 kHz) Oscillator voltage (r.m.s. value) at pin 6 Variation of oscillator frequency with supply voltage (VP = 1 V) Selectivity A.F.C. range Audio bandwidth at Vo = 3 dB measured with pre-emphasis (t = 50 s) A.F. output voltage (r.m.s. value) at RL = 22 k Load resistance at VP = 4,5 V at VP = 9,0 V RL RL - - - - 22 47 k k Vo(rms) - 75 - mV B - 10 - kHz fosc S+300 S-300 frf - - - - 60 45 35 300 - - - - kHz/V dB dB kHz V6-5(rms) - 250 - mV RR - 10 - dB AMS - 50 - dB THD THD - - 0,7 2,3 - - % % EMF S/N - - 200 60 - - mV dB EMF EMF EMF - - - 1,5 6 5,5 - - - V V V SYMBOL MIN. TYP. MAX. UNIT
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Philips Semiconductors
Product specification
FM radio circuit
TDA7000
Fig.3
A.F output voltage (Vo) and total harmonic distortion (THD) as a function of the e.m.f. input voltage (EMF) with a source impedance (RS) of 75 : (1) muting system enabled; (2) muting system disabled.
Conditions:
0 dB = 75 mV; frf = 96 MHz. for S + N curve: f = 22,5 kHz; fm = 1 kHz. for THD curve; f = 75 kHz; fm = 1 kHz.
Notes 1. The muting system can be disabled by feeding a current of about 20 A into pin 1. 2. The interstation noise level can be decreased by choosing a low-value capacitor at pin 3. Silent tuning can be achieved by omitting this capacitor.
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Philips Semiconductors
Product specification
FM radio circuit
TDA7000
Fig.4 Test circuit; for printed-circuit boards see Figs 5 and 6.
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Philips Semiconductors
Product specification
FM radio circuit
TDA7000
Fig.5 Track side of printed-circuit board used for the circuit of Fig.4.
Fig.6 Component side of printed-circuit board showing component layout used for the circuit of Fig.4.
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Philips Semiconductors
Product specification
FM radio circuit
PACKAGE OUTLINE DIP18: plastic dual in-line package; 18 leads (300 mil)
TDA7000
SOT102-1
D seating plane
ME
A2
A
L
A1
c Z e b1 b 18 10 b2 MH wM (e 1)
pin 1 index E
1
9
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.7 0.19 A1 min. 0.51 0.020 A2 max. 3.7 0.15 b 1.40 1.14 0.055 0.044 b1 0.53 0.38 0.021 0.015 b2 1.40 1.14 0.055 0.044 c 0.32 0.23 0.013 0.009 D (1) 21.8 21.4 0.86 0.84 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.9 3.4 0.15 0.13 ME 8.25 7.80 0.32 0.31 MH 9.5 8.3 0.37 0.33 w 0.254 0.01 Z (1) max. 0.85 0.033
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT102-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 93-10-14 95-01-23
May 1992
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Philips Semiconductors
Product specification
FM radio circuit
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA7000
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds.
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
May 1992
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