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| (R) STPS2545CT/CG/CFP POWER SCHOTTKY RECTIFIER MAIN PRODUCT CHARACTERISTICS IF(AV) VRRM Tj (max) VF (max) 2 x 12.5 A 45 V 175 C 0.57 V A1 K A2 FEATURES AND BENEFITS VERY SMALL CONDUCTION LOSSES NEGLIGIBLE SWITCHING LOSSES EXTREMELY FAST SWITCHING LOW THERMAL RESISTANCE AVALANCHE CAPABILITY SPECIFIED s s s s s K A1 A2 K TO-220AB STPS2545CT A2 A1 D2PAK STPS2545CG DESCRIPTION Dual center tap Schottky rectifier suited for Switch Mode Power Supplies and high frequency DC to DC converters. This device is especially intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. ABSOLUTE RATINGS (limiting values, per diode) Symbol VRRM IF(RMS) IF(AV) RMS forward current Average forward current = 0.5 TO-220AB D2PAK TO-220FPAB IFSM IRRM IRSM PARM Tstg Tj dV/dt *: Surge non repetitive forward current Repetitive peak reverse current Non repetitive peak reverse current Repetitive peak avalanche power Storage temperature range Maximum operating junction temperature * Critical rate of rise of reverse voltage Parameter Repetitive peak reverse voltage A2 K A1 TO-220FPAB STPS2545CFP Value 45 30 Tc = 160C Tc = 140C Per diode Per device 12.5 25 200 1 2 4800 - 65 to + 175 175 10000 Unit V A A tp = 10 ms sinusoidal tp = 2 s square F = 1kHz tp = 100 s square tp = 1s Tj = 25C A A A W C C V/s dPtot 1 thermal runaway condition for a diode on its own heatsink < dTj Rth( j - a ) 1/6 July 2003 - Ed: 2A STPS2545CT/CG/CFP THERMAL RESISTANCES Symbol Rth (j-c) Junction to ambient Parameter TO-220AB / D PAK TO-220FPAB TO-220AB / D PAK TO-220FPAB Rth (c) TO-220AB / D2PAK TO-220FPAB When the diodes 1 and 2 are used simultaneously : Tj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c) STATIC ELECTRICAL CHARACTERISTICS (per diode) Symbol Parameter Tests Conditions IR * V F* Reverse leakage Current Forward Voltage drop Tj = 25C Tj = 125C Tj = 125C Tj = 25C Tj = 125C Pulse test : * tp = 380 s, < 2% 2 2 Value Per diode Total Coupling 1.6 4 1.1 3.5 0.6 3 Unit C/W C/W C/W Min. Typ. 9 Max. 125 25 0.57 0.84 0.72 Unit A mA V VR = VRRM IF = 12.5 A IF = 25 A IF = 25 A 0.65 0.50 To evaluate the conduction losses use the following equation : P = 0.42 x IF(AV) + 0.012 x IF2(RMS) Fig. 1: Conduction losses versus average current. Fig. 2: Average forward current versus ambient temperature (=0.5). PF(AV)(W) 10 9 8 7 6 5 4 3 2 1 0 0.0 2.5 5.0 7.5 10.0 T IF(AV)(A) 14 = 0.05 = 0.1 = 0.2 = 0.5 Rth(j-a)=Rth(j-c) TO-220AB/DPAK 12 =1 10 8 6 Rth(j-a)=50C/W 4 T 2 IF(AV)(A) =tp/T 12.5 tp 0 15.0 0 =tp/T 25 tp Tamb(C) 50 75 100 125 150 175 Fig. 3: Normalized avalanche power derating versus pulse duration. PARM(tp) PARM(1s) 1 Fig. 4: Normalized avalanche power derating versus junction temperature. PARM(tp) PARM(25C) 1.2 1 0.1 0.8 0.6 0.01 0.4 0.2 0.001 0.01 0.1 1 tp(s) 10 100 1000 Tj(C) 0 0 25 50 75 100 125 150 2/6 STPS2545CT/CG/CFP Fig. 5-1: Non repetitive surge peak forward current versus overload duration (maximum values) (TO-220AB, DPAK). IM(A) 200 180 160 140 120 100 80 TC=125C TC=25C TC=75C Fig. 5-2: Non repetitive surge peak forward current versus overload duration (maximum values) (TO-220FPAB). IM(A) 120 100 80 TC=25C 60 TC=75C 60 40 20 0 1.E-03 IM t 40 TC=125C 20 =0.5 IM t t(s) 0 1.E-02 1.E-01 1.E+00 =0.5 t(s) 1.E-02 1.E-01 1.E+00 1.E-03 Fig. 6-1: Relative variation of thermal impedance junction to case versus pulse duration (TO-220AB, D2PAK). Zth(j-c) / Rth(j-c) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 Single pulse = 0.2 = 0.1 = 0.5 Fig. 6-2: Relative variation of thermal impedance junction to case versus pulse duration (TO-220FPAB). Zth(j-c) / Rth(j-c) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 = 0.2 = 0.1 = 0.5 T 0.2 T 0.1 0.0 1.E-03 1.E-02 tP(s) 1.E-01 =tp/T tp 0.1 Single pulse tP(s) 1.E-02 1.E-01 0.0 1.E+00 =tp/T 1.E+00 tp 1.E-03 1.E+01 Fig. 7: Reverse leakage current versus reverse voltage applied (typical values). IR(mA) 1.E+02 Tj=150C Fig. 8: Junction capacitance versus reverse voltage applied (typical values). C(nF) 10.0 F=1MHz Vosc=30mV Tj=25C 1.E+01 Tj=125C 1.E+00 Tj=100C Tj=75C 1.0 1.E-01 Tj=50C 1.E-02 Tj=25C VR(V) 1.E-03 0 5 10 15 20 25 30 35 40 45 0.1 1 VR(V) 10 100 3/6 STPS2545CT/CG/CFP Fig. 9: current. IFM(A) 100 Tj=125C (Maximum values) Forward voltage drop versus forward Fig. 10: Thermal resistance junction to ambient versus copper surface under tab (epoxy printed board FR4, Cu = 35m). Rth(j-a)(C/W) 80 70 60 Tj=125C (Typical values) 50 Tj=25C (Maximum values) 10 40 30 20 VFM(V) 1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 10 0 0 5 10 15 S(cm) 20 25 30 35 40 PACKAGE MECHANICAL DATA TO-220AB REF. Min. A H2 Dia L5 C L7 L6 L2 F2 F1 L9 L4 F G1 G M E D A DIMENSIONS Millimeters Max. 4.60 1.32 2.72 0.70 0.88 1.70 1.70 5.15 2.70 10.40 14 2.95 15.75 6.60 3.93 4.40 1.23 2.40 0.49 0.61 1.14 1.14 4.95 2.40 10 13 2.65 15.25 6.20 3.50 Inches Min. 0.173 0.048 0.094 0.019 0.024 0.044 0.044 0.194 0.094 0.393 0.511 0.104 0.600 0.244 0.137 Max. 0.181 0.051 0.107 0.027 0.034 0.066 0.066 0.202 0.106 0.409 0.551 0.116 0.620 0.259 0.154 C D E F F1 F2 G G1 H2 L2 L4 L5 L6 L7 L9 M 16.4 typ. 0.645 typ. 2.6 typ. 0.102 typ. 4/6 STPS2545CT/CG/CFP PACKAGE MECHANICAL DATA D2PAK REF. A E L2 C2 DIMENSIONS Millimeters Min. Max. 4.60 2.69 0.23 0.93 1.70 0.60 1.36 9.35 10.40 5.28 15.85 1.40 1.75 3.20 Inches Min. 0.173 0.098 0.001 0.027 0.045 0.017 0.048 0.352 0.393 0.192 0.590 0.050 0.055 0.094 Max. 0.181 0.106 0.009 0.037 0.067 0.024 0.054 0.368 0.409 0.208 0.624 0.055 0.069 0.126 A A1 A2 D 4.40 2.49 0.03 0.70 1.14 0.45 1.23 8.95 10.00 4.88 15.00 1.27 1.40 2.40 L L3 A1 B2 B G A2 C R B B2 C C2 D E G L L2 L3 M R M * V2 * FLAT ZONE NO LESS THAN 2mm 0.40 typ. 0.016 typ. FOOTPRINT 16.90 10.30 1.30 5.08 3.70 8.90 5/6 STPS2545CT/CG/CFP PACKAGE MECHANICAL DATA TO-220FPAB REF. Min. A H B DIMENSIONS Millimeters Max. 4.6 2.7 2.75 0.70 1 1.70 1.70 5.20 2.7 10.4 30.6 10.6 3.6 16.4 9.30 3.20 Inches Min. 0.173 0.098 0.098 0.018 0.030 0.045 0.045 0.195 0.094 0.393 1.126 0.386 0.114 0.626 0.354 0.118 Max. 0.181 0.106 0.108 0.027 0.039 0.067 0.067 0.205 0.106 0.409 1.205 0.417 0.142 0.646 0.366 0.126 A B D E 4.4 2.5 2.5 0.45 0.75 1.15 1.15 4.95 2.4 10 28.6 9.8 2.9 15.9 9.00 3.00 Dia L6 L2 L3 L5 D F1 L4 F2 L7 F F1 F2 G G1 H L2 L3 L4 E 16 Typ. 0.63 Typ. F G1 G L5 L6 L7 Dia. Ordering type STPS2545CT STPS2545CFP STPS2545CG STPS2545CG-TR s Marking STPS2545CT STPS2545CFP STPS2545CG STPS2545CG Package TO-220AB TO-220FPAB D PAK D2PAK 2 Weight 2.20 g 2.0 g 1.48 g 1.48 g Base qty 50 50 50 1000 Delivery mode Tube Tube Tube Tape & reel EPOXY MEETS UL94,V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics (c) 2003 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 6/6 |
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