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 HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HM200203 Issued Date : 1996.07.01 Revised Date : 2002.02.26 Page No. : 1/3
HM879
SILICON NPN EPITAXIAL TYPE TRANSISTOR
Description
For 1.5V And 3V Electronic Flash Use.
Features
* Charger-up time is about 1 mS faster than of a germanium transistor. * Small saturation voltage can bring less power dissipation and flashing times.
SOT-89
Absolute Maximum Ratings
* Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 C Junction Temperature .................................................................................... +150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Ta=25C) ....................................................................................... 1 W * Maximum Voltages and Currents (Ta=25C) BVCBO Collector to Base Voltage....................................................................................... 30 V BVCEX Collector to Emitter Voltage .................................................................................... 20 V BVCEO Collector to Emitter Voltage.................................................................................... 10 V BVEBO Emitter to Base Voltage............................................................................................ 6 V IC Collector Current............................................................................................................... 3 A IC Collector Current (Pluse) .................................................................................................. 5 A
Electrical Characteristics (Ta=25C)
Symbol BVCEO BVEBO BVCBO BVCEX ICBO IEBO *VCE(sat) *hFE fT Cob Min. 10 6 30 20 140 Typ. 0.3 210 200 30 Max. 100 100 0.4 400 Unit V V V V nA nA V MHz pF Test Condition IC=1mA IE=10uA IC=10uA IC=1mA, VBE=3V VCB=20V VBE=4V IC=3A, IB=60mA VCE=2V, IC=3A VCE=10V, IC=50mA VCB=10V, f=1MHz
*Pulse Test: Pulse Width 380us, Duty Cycle2%
HM879
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
1000 125 C 75 C
o o
Spec. No. : HM200203 Issued Date : 1996.07.01 Revised Date : 2002.02.26 Page No. : 2/3
Saturation Voltage & Collector Current
1000 VCE(sat) @ IC=50IB
25 C
o
Saturation Voltage (mV)
hFE
100
75 C
o
hFE @ VCE=2V
125 C 25 C
o
o
100 1 10 100 1000 10000
10 1 10 100 1000 10000
Collector Current-IC (mA)
Collector Current-IC (mA)
Cutoff Frequency & Collector Current
1000
Capacitance & Reverse-Biased Voltage
100
Cutoff Frequency (MHz).. .
Capacitance (pF)
100
VCE=10V
Cob 10
10
1 1 10 100 1000
1 1 10 100
Collector Current (mA)
Reverse Biased Voltage (V)
HM879
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
SOT-89 Dimension
Marking:
Spec. No. : HM200203 Issued Date : 1996.07.01 Revised Date : 2002.02.26 Page No. : 3/3
C
H
Date Code 879 HM Laser Marking
B 1 E F G A 2 3
D
Style: Pin 1.Base 2.Collector 3.Emitter
J
I
3-Lead SOT-89 Plastic Surface Mounted Package HSMC Package Code: M
*: Typical
DIM A B C D E
Inches Min. Max. 0.1732 0.1811 0.1594 0.1673 0.0591 0.0663 0.0945 0.1024 0.0141 0.0201
Millimeters Min. Max. 4.40 4.60 4.05 4.25 1.50 1.70 2.40 2.60 0.36 0.51
DIM F G H I J
Inches Min. Max. 0.0583 0.0598 0.1165 0.1197 0.0551 0.0630 0.0138 0.0161 0.0319 0.0421
Millimeters Min. Max. 1.48 1.52 2.96 3.04 1.40 1.60 0.35 0.41 0.81 1.07
Notes: 1.Dimension and tolerance based on our Spec. dated May. 05,1996.
2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
* Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
* All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
* Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
HM879
HSMC Product Specification


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