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TLV3501 TLV3502
SBOS321D - MARCH 2005 - REVISED JULY 2005
4.5ns Rail-to-Rail, High-Speed Comparator in Microsize Packages
FEATURES
D D D D D D D
HIGH SPEED: 4.5ns RAIL-TO-RAIL I/O SUPPLY VOLTAGE: +2.7V to +5.5V PUSH-PULL CMOS OUTPUT STAGE SHUTDOWN (TLV3501 only) MICRO PACKAGES: SOT23-6 (single) SOT23-8 (dual) LOW SUPPLY CURRENT: 3.2mA
DESCRIPTION
The TLV350x family of push-pull output comparators feature a fast 4.5ns propagation delay and operation from +2.7V to +5.5V. Beyond-the-rails input common-mode range makes it an ideal choice for low-voltage applications. The rail-to-rail output directly drives either CMOS or TTL logic. Microsize packages provide options for portable and space-restricted applications. The single (TLV3501) is available in SOT23-6 and SO-8 packages. The dual (TLV3502) comes in the SOT23-8 and SO-8 packages.
APPLICATIONS
Propagation Delay (ns)
D D D D D
PROPAGATION DELAY vs OVERDRIVE VOLTAGE 9 8 Rise 7 6 Fall 5 4 3 0 20 40 60 80 100 Overdrive Voltage (mV) VCM = 1V VS = 5V CLOAD = 17pF
AUTOMATIC TEST EQUIPMENT WIRELESS BASE STATIONS THRESHOLD DETECTOR ZERO-CROSSING DETECTOR WINDOW COMPARATOR
TLV350x RELATED PRODUCTS
FEATURES Precision Ultra-Fast, Low-Power Comparator Differential Output Comparator High-Speed Op Amp, 16-Bit Accurate, 150MHz High-Speed Op Amp, Rail-to-Rail, 38MHz High-Speed Op Amp with Shutdown, 250MHz PRODUCT TLC3016 TL712 OPA300 OPA350 OPA357
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Copyright 2005, Texas Instruments Incorporated
www.ti.com
TLV3501 TLV3502
www.ti.com SBOS321D - MARCH 2005 - REVISED JULY 2005
ABSOLUTE MAXIMUM RATINGS(1)
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +5.5V Signal Input Terminals, Voltage(2) . . . . . (V-) - 0.3V to (V+) + 0.3V Signal Input Terminals, Current(2) . . . . . . . . . . . . . . . . . . . . . 10mA Output Short Circuit(3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74mA Operating Temperature . . . . . . . . . . . . . . . . . . . . . -40C to +125C Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . -65C to +150C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150C Lead Temperature (soldering, 10s) . . . . . . . . . . . . . . . . . . . . +300C ESD Rating (Human Body Model) . . . . . . . . . . . . . . . . . . . . 3000V Charged-Device Model (CDM) . . . . . . . . . . . . . . . . . . . . . . . . . 500V (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. (2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.3V beyond the supply rails should be current limited to 10mA or less. (3) Short-circuit to ground, one comparator per package.
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
PRODUCT TLV3501 TLV3501 TLV3502 TLV3502 PACKAGE-LEAD SOT23-6 SO-8 SOT23-8 SO-8 PACKAGE DESIGNATOR DBV D DCN D PACKAGE MARKING NXA TLV3501A NXC TLV3502A
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com.
PIN CONFIGURATIONS
TLV3501 TLV3501 NXA NC(2) 6 5 4 SOT23-6(1) SO-8 SOT23-8, SO-8 SHDN OUT +IN +IN 3 V+ V- 4 5 NC(2) 3 6 OUT +IN B -IN B 3 B 4 5 V- 6 OUT B -IN 1 2 8 7 SHDN V+ -IN V- +IN A -IN A 1 A 2 7 OUT A 8 V+ 1 2 TLV3502
(1) Pin 1 of the SOT23-6 is determined by orienting the package marking as indicated on the diagram. (2) NC indicates no internal connection.
2
TLV3501 TLV3502
www.ti.com SBOS321D - MARCH 2005 - REVISED JULY 2005
ELECTRICAL CHARACTERISTICS
Boldface limits apply over the specified temperature range, TA = -40C to +125C.
At TA = +25C and VS = +2.7V to +5.5V, unless otherwise noted. TLV3501, TLV3502 PARAMETER OFFSET VOLTAGE Input Offset Voltage(1) vs Temperature vs Power Supply Input Hysteresis INPUT BIAS CURRENT Input Bias Current Input Offset Current(2) INPUT VOLTAGE RANGE Common-Mode Voltage Range Common-Mode Rejection INPUT IMPEDANCE Common-Mode Differential SWITCHING CHARACTERISTICS Propagation Delay Time(3) T(pd) VIN = 100mV, Overdrive = 20mV VIN = 100mV, Overdrive = 20mV VIN = 100mV, Overdrive = 5mV VIN = 100mV, Overdrive = 5mV VIN = 100mV, Overdrive = 20mV Overdrive = 50mV, VS = 5V CONDITION VOS dVOS/dT PSRR VCM = 0V, IO = 0mA TA = -40C to +125C VS = 2.7V to 5.5V MIN TYP 1 5 100 6 2 2 (V-) - 0.2V 57 55 MAX 6.5 400 UNITS mV V/C V/V mV pA pA V dB dB pF pF 6.4 7 10 12 ns ns ns ns ns MHz ns ns mV ns ns V V pA A V V mA C C C C/W C/W C/W
IB IOS VCM CMRR
VCM = VCC/2 VCM = VCC/2
10 10 (V+) + 0.2V
VCM = -0.2V to (V+) + 0.2V VCM = -0.2V to (V+) + 0.2V
70
1013 2 1013 4 4.5 7.5 0.5 80 1.5 1.5 30 30 100 (V+) - 1.7V (V+) - 0.9V 2 2 VS IQ VS = 5V, VO = High -40 -40 -65 qJA 200 200 150 +2.7 2.2 to 5.5 3.2 +5.5 5 +125 +125 +150 50
Propagation Delay Skew(4) Maximum Toggle Frequency Rise Time(5) Fall Time(5) OUTPUT Voltage Output from Rail SHUTDOWN tOFF tON VL (comparator is enabled)(6) VH (comparator is disabled)(6) Input Bias Current of Shutdown Pin IQSD (quiescent current in shutdown) POWER SUPPLY Specified Voltage Operating Voltage Range Quiescent Current TEMPERATURE RANGE Specified Range Operating Range Storage Range Thermal Resistance SOT23-5 SOT23-8 SO-8
t(SKEW) fMAX tR tF VOH,V OL
IOUT = 1mA
(1) VOS is defined as the average of the positive and the negative switching thresholds. (2) The difference between IB+ and IB-. (3) Propagation delay cannot be accurately measured with low overdrive on automatic test equipment. This parameter is ensured by characterization and testing at 100mV overdrive. (4) The difference between the propagation delay going high and the propagation delay going low. (5) Measured between 10% of VS and 90% of VS. (6) When the shutdown pin is within 0.9V of the most positive supply, the part is disabled. When it is more than 1.7V below the most positive supply, the part is enabled.
3
TLV3501 TLV3502
www.ti.com SBOS321D - MARCH 2005 - REVISED JULY 2005
TYPICAL CHARACTERISTICS
At TA = +25C, VS = +5V, and Input Overdrive = 100mV, unless otherwise noted.
OUTPUT RESPONSE FOR VARIOUS OVERDRIVE VOLTAGES (rising) VIN (V) Input Input VIN (V) 0 0
OUTPUT RESPONSE FOR VARIOUS OVERDRIVE VOLTAGES (falling)
5 4 VOUT (V) 3 2 1 0 -1 -10 0 10 20 Time (ns) 30 40 VOD = 100mV 5 VOD = 50mV VOUT (V) VOD = 20mV VOD = 5mV 4 3 2 1 0 -1 -10 0 VOD = 100mV
VOD = 50mV
VOD = 20mV VOD = 5mV
10
20 Time (ns)
30
40
PROPAGATION DELAY vs TEMPERATURE (VOD = 20mV) 5.0 Fall Propagation Delay (ns) 4.5 Rise Propagation Delay (ns) 5.0
PROPAGATION DELAY vs TEMPERATURE (VOD = 50mV)
4.5
4.0
4.0 Fall
3.5
3.5 Rise
3.0 -40 -25
0
25
50
75
100
125
3.0 -40 -25
0
25
50
75
100
125
Temperature (_ C)
Temperature (_ C)
PROPAGATION DELAY vs CAPACITIVE LOAD (VOD = 20mV) 9 8 Propagation Delay (ns) Propagation Delay (ns) 7 6 Fall 5 Rise 4 3 0 20 40 60 80 100 Capacitive Load (pF) 9 8 7 6 5
PROPAGATION DELAY vs CAPACITIVE LOAD (VOD = 50mV)
Fall 4 Rise 3 0 20 40 60 80 100 Capacitive Load (pF)
4
TLV3501 TLV3502
www.ti.com SBOS321D - MARCH 2005 - REVISED JULY 2005
TYPICAL CHARACTERISTICS (continued)
At TA = +25C, VS = +5V, and Input Overdrive = 100mV, unless otherwise noted.
PROPAGATION DELAY vs SUPPLY VOLTAGE (VCM = 1V, VOD = 20mV) 9 8 Propagation Delay (ns) 7 6 5 Fall 4 Rise 3 2 3 4 Supply Voltage (V) 5 6 50 -40 -25 Wake-Up Delay (ns) 90 110
WAKE-UP DELAY vs TEMPERATURE
70
0
25
50
75
100
125
Temperature (_ C)
RESPONSE TO 50MHz SINE WAVE (VDD = 5V, VIN = 20mVPP) VIN (mV) 10 0 -10 5 4 VOUT (V) 3 2 1 0 -1 0 20 40 60 Time (ns) 80 100 VOUT (V) VIN (mV)
RESPONSE TO 100MHz SINE WAVE (2.5V dual supply into 50 oscilloscope input)
500 0 -500 2 1 0 -1 -2 0 2 4 6 8 10 Time (ns) 12 14 16 18 20
QUIESCENT CURRENT vs SUPPLY VOLTAGE 4.0 3.8 Quiescent Current (mA) Quiescent Current (mA) 3.6 3.4 3.2 3.0 2.8 2.6 2.4 2.2 2.0 2 3 4 Supply Voltage (V) 5 6 4.0 3.8 3.6 3.4 3.2 3.0 2.8 2.6 2.4 2.2 2.0 -40 -25
QUIESCENT CURRENT vs TEMPERATURE
0
25
50
75
100
125
Temperature (_ C)
5
TLV3501 TLV3502
www.ti.com SBOS321D - MARCH 2005 - REVISED JULY 2005
TYPICAL CHARACTERISTICS (continued)
At TA = +25C, VS = +5V, and Input Overdrive = 100mV, unless otherwise noted.
QUIESCENT CURRENT vs SHUTDOWN VOLTAGE 3.5 3.0 Quiescent Current (mA) 2.5 2.0 1.5 1.0 0.5 0 0 1 2 3 4 5 Shutdown Voltage (V) 2.7V (from on to off) 2.7V (from off to on) 5V (from off to on) 5V (from on to off) Quiescent Current (mA) 20 25
QUIESCENT CURRENT vs FREQUENCY CLOAD = 50pF
CLOAD = 20pF 15
10 CLOAD = 10pF 5 CLOAD = 0.5pF 0 0 20 40 60 80 100 Frequency (MHz)
6
TLV3501 TLV3502
www.ti.com SBOS321D - MARCH 2005 - REVISED JULY 2005
APPLICATIONS INFORMATION
The TLV3501 and TLV3502 both feature high-speed response and includes 6mV of internal hysteresis for improved noise immunity with an input common-mode range that extends 0.2V beyond the power-supply rails.
input. Figure 2 shows a typical topology used to introduce 25mV of additional hysteresis, for a total of 31mV hysteresis when operating from a single 5V supply. Total hysteresis is approximated by Equation 1:
V HYST +
( V)) R 1 ) 6mV R1 ) R 2
(1)
SHUTDOWN
A shutdown pin allows the device to go into idle when it is not in use. When the shutdown pin is high, the device draws about 2A and the output goes to high impedance. When the shutdown pin is low, the TLV3501 is active. When the TLV3501 shutdown feature is not used, simply connect the shutdown pin to the most negative supply, as shown in Figure 1. It takes about 100ns to come out of shutdown mode. The TLV3502 does not have the shutdown feature.
VHYST sets the value of the transition voltage required to switch the comparator output by enlarging the threshold region, thereby reducing sensitivity to noise.
VS = 5V
0.1F VIN TLV3501
2.2F
VOUT
VS R1 = 51 VREF VIN TLV3501 VREF VOUT R 2 = 10k
0.1F
2.2F
Figure 2. Adding Hysteresis to the TLV350x
Figure 1. Basic Connections for the TLV3501
INPUT OVER-VOLTAGE PROTECTION
Device inputs are protected by ESD diodes that will conduct if the input voltages exceed the power supplies by more than approximately 300mV. Momentary voltages greater than 300mV beyond the power supply can be tolerated if the input current is limited to 10mA. This limiting is easily accomplished with a small input resistor in series with the comparator, as shown in Figure 3.
OPERATING VOLTAGE
TLV3501 comparators are specified for use on a single supply from +2.7V to +5.5V (or a dual supply from 1.35V to 2.75V) over a temperature range of -40C to +125C. The device continues to function below this range, but performance is not specified.
ADDING EXTERNAL HYSTERESIS
The TLV350x has a robust performance when used with a good layout. However, comparator inputs have little noise immunity within the range of specified offset voltage (5mV). For slow moving or noisy input signals, the comparator output may display multiple switching as input signals move through the switching threshold. In such applications, the 6mV of internal hysteresis of the TLV350x might not be sufficient. In cases where greater noise immunity is desired, external hysteresis may be added by connecting a small amount of feedback to the positive
VS
R VIN TLV3501 VREF
0.1F
2.2F VOUT
Figure 3. Input Current Protection for Voltages Exceeding the Supply Voltage
7
TLV3501 TLV3502
www.ti.com SBOS321D - MARCH 2005 - REVISED JULY 2005
RELAXATION OSCILLATOR
The TLV350x can easily be configured as a simple and inexpensive relaxation oscillator. In Figure 4, the R2 network sets the trip threshold at 1/3 and 2/3 of the supply. Since this is a high-speed circuit, the resistor values are rather low in order to minimize the effect of parasitic capacitance. The positive input alternates between 1/3 of V+ and 2/3 of V+ depending on whether the output is low or high. The time to charge (or discharge) is 0.69R1C. Therefore, the period is 1.38R1C. For 62pF and 1k as shown in Figure 4, the output is calculated to be 10.9MHz. An implementation of this circuit oscillated at 9.6MHz. Parasitic capacitance and component tolerances explain the difference between theory and actual performance.
VHI VHI
TLV3502a
VIN SN74LVC1G02
TLV3502b
VOUT
VLO
V VOUT VIN
VLO VC 2/3 (V+) 1/3 (V+) t Time V+ C 62pF VS = 5V R 1 1k VOUT 1.38R1C
Figure 5. Window Comparator--Active High
VLO R2 5k V+ R2 5k VIN SN74AHC00
TLV3502b
R2 5k
t f = 10MHz
TLV3502a
VOUT
VHI V
Figure 4. Relaxation Oscillator
VIN
VOUT
HIGH-SPEED WINDOW COMPARATOR
A window comparator circuit is used to determine when a signal is between two voltages. The TLV3502 can readily be used to create a high-speed window comparator. VHI is the upper voltage threshold, and VLO is the lower voltage threshold. When VIN is between these two thresholds, the output in Figure 5 is high. Figure 6 shows a simple means of obtaining an active low output. Note that the reference levels are connected differently between Figure 5 and Figure 6. The operating voltage range of either circuit is 2.7V to 5.5V.
VHI
VLO
Time
Figure 6. Window Comparator--Active Low
8
TLV3501 TLV3502
www.ti.com SBOS321D - MARCH 2005 - REVISED JULY 2005
PCB LAYOUT
For any high-speed comparator or amplifier, proper design and printed circuit board (PCB) layout are necessary for optimal performance. Excess stray capacitance on the active input, or improper grounding, can limit the maximum performance of high-speed circuitry. Minimizing resistance from the signal source to the comparator input is necessary in order to minimize the propagation delay of the complete circuit. The source resistance along with input and stray capacitance creates an RC filter that delays voltage transitions at the input, and reduces the amplitude of high-frequency signals. The input capacitance of the TLV350x along with stray capacitance from an input pin to ground results in several picofarads of capacitance. The location and type of capacitors used for power-supply bypassing are critical to high-speed comparators. The suggested 2.2F tantalum capacitor do not need to be as close to the device as the 0.1F capacitor, and may be shared with other devices. The 2.2F capacitor buffers the power-supply line against ripple, and the 0.1F capacitor provides a charge for the comparator during highfrequency switching.
In a high-speed circuit, fast rising and falling switching transients create voltage differences across lines that would be at the same potential at DC. To reduce this effect, a ground plane is often used to reduce difference in voltage potential within the circuit board. A ground plane has the advantage of minimizing the effect of stray capacitances on the circuit board by providing a more desirable path for the current to flow. With a signal trace over a ground plane, at high-frequency the return current (in the ground plane) tends to flow right under the signal trace. Breaks in the ground plane (as simple as through-hole leads and vias) increase the inductance of the plane, making it less effective at higher frequencies. Breaks in the ground plane for necessary vias should be spaced randomly. Figure 7 shows an evaluation layout for the TLV3501 SO-8 package; Figure 8 is for the SOT23-5 package. They are shown with SMA connectors bringing signals on and off the board. RT1 and RT2 are termination resistors for +VIN and -VIN, respectively. C1 and C2 are power-supply bypass capacitors. Place the 0.1F capacitor closest to the comparator. The ground plane is not shown, but the pads that the resistors and capacitors connect to are shown. Figure 9 shows a schematic of this circuit.
-VIN
SD
RT2 RT1 DUT
C2 C1
VOUT
+VIN
GND
+VS
Figure 7. TLV3501D (SO-8) Sample Layout
9
TLV3501 TLV3502
www.ti.com SBOS321D - MARCH 2005 - REVISED JULY 2005
-VIN
SD
VOUT RT2 RT1 DUT C1 C2 GND +VIN +VS
Figure 8. TLV3501DBV (SOT23) Sample Layout
+VS
-VIN RT2 50 TLV3501 +VIN RT1 50 Shutdown
C1 100nF
C2 2.2F
VOUT
Figure 9. Schematic for Figure 7 and Figure 8
10
PACKAGE OPTION ADDENDUM
www.ti.com
26-Jul-2005
PACKAGING INFORMATION
Orderable Device TLV3501AID TLV3501AIDBVR TLV3501AIDBVT TLV3501AIDG4 TLV3501AIDR TLV3501AIDRG4 TLV3502AID TLV3502AIDCNR TLV3502AIDCNT TLV3502AIDR
(1)
Status (1) ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE
Package Type SOIC SOT-23 SOT-23 SOIC SOIC SOIC SOIC SOT23 SOT23 SOIC
Package Drawing D DBV DBV D D D D DCN DCN D
Pins Package Eco Plan (2) Qty 8 6 6 8 8 8 8 8 8 8 75 Green (RoHS & no Sb/Br)
Lead/Ball Finish CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU
MSL Peak Temp (3) Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-3-260C-168 HR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-3-260C-168 HR
3000 Green (RoHS & no Sb/Br) 250 75 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)
2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 75 Green (RoHS & no Sb/Br)
3000 Green (RoHS & no Sb/Br) 250 Green (RoHS & no Sb/Br)
2500 Green (RoHS & no Sb/Br)
The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DSP Interface Logic Power Mgmt Microcontrollers amplifier.ti.com dataconverter.ti.com dsp.ti.com interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com Applications Audio Automotive Broadband Digital Control Military Optical Networking Security Telephony Video & Imaging Wireless Mailing Address: Texas Instruments Post Office Box 655303 Dallas, Texas 75265 Copyright 2005, Texas Instruments Incorporated www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless

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