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DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
PC2782GR
L BAND DOWN CONVERTER IC
DESCRIPTION
The PC2782GR is a Silicon monolithic IC designed for use as L band downconverter. This IC consists of a Gilbert cell mixer, two stages of LO buffering, local oscillator, external filter port, or a high output IF AGC amplifier and IF output buffer amplifier. The package is 20 pins SSOP (shrink small outline package) suitable for high-density surface mount.
FEATURES
* Broad band operation * Low distortion * Supply Voltage fRF = 0.9 to 2.1 GHz IIP3 = +4.5 dBm (fRF = 2.1 GHz) 5V * 25 dB variable gain IF AGC amplifier
* Packaged in 20 pins SSOP suitable for high-density surface mount
ORDERING INFORMATION
Part Number Package 20 pin plastic SSOP (225 mil) Package Style Embossed tape 12 mm wide. 2.5 k/REEL. Pin 1 indicates pull-out direction of tape
PC2782GR-E1
For evaluation sample order, please contact your local NEC sales office.
(Part number for sample order:
PC2782GR)
Caution electro-static sensitive devices.
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.
Document No. P11758EJ3V0DS00 (3rd edition) Date Published October 1999 N CP(K) Printed in Japan
The mark
shows major revised points
(c)
1996, 1999
PC2782GR
INTERNAL BLOCK DIAGRAM
VCC (IF) VCC (MIX) GND (MIX) RF IN GND (MIX) IF OUT VAGC IF IN GND (IF)
1 2 3 4 5 6 7 8 9
Bias CKT
20 VCC (LO) 19 VCC (LO OUT) 18 GND (LO) 17 LO OUT 16 LO (B2) 15 LO (C1) 14 LO (C2) 13 LO (B1) 12 GND (LO) 11 IF OUT
IF IN 10
2
Data Sheet P11758EJ3V0DS00
PC2782GR
Pin No. 1
Symbol VCC (IF)
Pin Volt TYP.(V) 5.00
Functions and Explanation Power supply pin of IF AGC Amp.
2
Equivalent Circuit
2
VCC (MIX)
5.00
Power supply pin of Mixer
3
GND (MIX)
0.00
Ground pin of Mixer.
4
OSC
4
RF IN
2.00
RF signal input pin.
Reg 5
5
GND (MIX)
0.00
Ground pin of Mixer.
3
6
IF OUT
1.85
Output pin of Mixer. This pin is assigned for the emitter follower output.
2 MIX 6 Reg
3
5
7
VAGC
0 to 5
Gain control pin. This pin's bias govern the AGC output level. Maximum gain at VAGC = 0 V Minimum gain at VAGC = 5 V
1
3 k 7 VAGC
9
8
IF IN
2.36
IF signal input pin of IF AGC Amp. In case of single input, this pin should be grounded through 1 000 pF capacitor.
1
VAGC
9
GND (IF)
0.00
Ground pin of IF AGC Amp.
8
10
Reg
10
IF IN
2.36
IF signal input pin of IF AGC Amp.
9
Data Sheet P11758EJ3V0DS00
3
PC2782GR
Pin No. 11
Symbol IF OUT
Pin Volt TYP.(V) 2.55
Functions and Explanation Output pin of IF AGC Amp. This pin is assigned for emitter follower push-pull output.
Equivalent Circuit
1
11
Reg
9
12
GND (LO)
0.00
Ground pin of Oscillator amplifier, Buffer amplifier, Oscillator output. Base pin of oscillator. Connected to 14 pin through capacitor. Collector pin of oscillator. Connected to 15 pin through capacitor. Oscillator frequency bandwidth is depended on this capacitor. This pin should be connected to VCC through 150 resistor. Collector pin of oscillator. Connected to 14 pin through capacitor. This pin should be connected to VCC through 150 resistor. Base pin of oscillator. Connected to 15 pin through capacitor. Assemble LC resonator between 13 pin and 16 pin through 2 pF capacitor to oscillate. Output pin of Oscillator. This pin is assigned for emitter follower output.
19 16 15 14 13
13
LO (B1)
2.30
14
LO (C2)
5.00
Reg Reg
15
LO (C1)
5.00
12 18
16
LO (B2)
2.30
17
LO OUT
3.15
18
GND (LO)
0.00
Ground pin of Oscillator amplifier, Buffer amplifier, Oscillator output.
17
Reg
19
VCC (LO)
5.00
Power supply pin of Oscillator output.
12 18
20
VCC (LO)
5.00
Power supply pin of Oscillator amplifier, Buffer amplifier.
4
Data Sheet P11758EJ3V0DS00
PC2782GR
Absolute Maximum Ratings (TA = 25 C unless otherwise specified)
Parameter Supply Votage Power dissipation Operation temperature range Storage temperature range Symbol VCC PD TA Tstg TA = 85 C
*1
Test Conditions
Rating 6.0 430 -40 to +85 -55 to +150
Unit V mW C C
*1 Mounted on 50 x 50 x 1.6 mm double copper epoxy glass board. Recommended Operating Range
Parameter Supply Voltage Operating temperature range Symbol VCC TA MIN. 4.5 -40 TYP. 5.0 +25 MAX. 5.5 +85 Unit V C
Data Sheet P11758EJ3V0DS00
5
PC2782GR
Electrical Characteristics (TA = 25 C, VCC = 5 V)
Parameter Circuit Current RF Input Frequency Range Symbol ICC RF BW MIN. 46 0.9 TYP. 66 MAX. 78 2.1 UNIT mA GHz Test Conditions No input signal PRF = -20 dBm, POSC = -10 dBm fIF = 480 MHz, -3 dB down fRF = 2.1 GHz, PRF = -20 dBm POSC = -10 dBm, -3 dB down *2
*2
IF Output Frequency Range
IF BW
150
500
MHz
*2
Mixer Section Conversion Gain CG1 7 10 13 dB fRF = 900 MHz, PRF = -30 dBm fOSC = 1 380 MHz, POSC = -10 dBm fRF = 2.1 GHz, PRF = -30 dBm fOSC = 2.58 GHz, POSC = -10 dBm fRF = 900 MHz, PRF = 0 dBm fOSC = 1 380 MHz, POSC = -10 dBm fRF = 2.1 GHz, PRF = 0 dBm fOSC = 2.58 GHz, POSC = -10 dBm fRF = 900 MHz, POSC = -10 dBm fRF = 2.1 GHz, POSC = -10 dBm
*2
Conversion Gain 2
CG2
8
11
14 - -
dB
*2
Maximum Output Power 1
PO (sat)1
+2
+5
dBm
*2
Maximum Output Power 2
PO (sat)2
+2 - -
+5
dBm
*2 *3 *3
Noise Figure 1 Noise Figure 2 IF Amp. Section IF Input Frequency Range
NF1 NF2
11.0 13.5
14.0 16.5
dB dB
IFinBW
150
-
500
MHz
PIF = -30 dBm, VAGC = 0 V -3 dB down fIF = 480 MHz, PIF = -30 dBm VAGC = 0 fIF = 480 MHz, PIF = 0 dBm VAGC = 0 V fIF = 480 MHz, PIF = -30 dBm VAGC = 0 to 5 V fIF = 480 MHz, VAGC = 0 V
*4
IF Power Gain
GIF
20
23
26 - -
dB
*4
Maximum Output Power 3
PO (sat)3 GAGC
+5
+8
dBm
*4
AGC Dynamic range
20 -
25
dB
*4 *5
Noise Figure 3
NF3
12.0
15.0
dB
*2 by measurement circuit 1 *3 by measurement circuit 2 *4 by measurement circuit 4 *5 by measurement circuit 5
6
Data Sheet P11758EJ3V0DS00
PC2782GR
Standard Characteristics (TA = 25 C, VCC = 5 V)
Reference Value Parameter Mixer Section Input Intercept Point 1 IIP31 - - - - - 1.3 0 - - - - - 2.6 dBm fRF = 900, 930 MHz, fOSC = 1 380 MHz POSC = -10 dBm *6 fRF = 2.1, 2.13 GHz, fOSC = 2.58 GHz POSC = -10 dBm *6 fRF = 900, 930 MHz, PRF = -25 dBm each fOSC = 1 380 MHz, POSC = -10 dBm *6 fRF = 2.1, 1.13 GHz, PRF = -25 dBm each fOSC = 2.58 GHz, POSC = -10 dBm *6 *7 *7 Symbol MIN. TYP. MAX. UNIT Test Conditions
Input Intercept Point 2
IIP32
+4.5
dBm
Third Intermodulation Distortion 1 Third Intermodulation Distortion 2 Oscillator Output Power Oscillator Frequency Range IF Amp. Section Output Intercept Point
IM31
50
dBc
IM32
59 -15 -
dBc
POSC fOSC
dBm GHz
OIP3
-
+15.5
-
dBm
fIF = 480, 510 MHz
*8
*6 by measurement circuit 3 *7 by application circuit example *8 by measurement circuit 6
Data Sheet P11758EJ3V0DS00
7
PC2782GR
Typical Characteristics (VCC = 5 V, TA = 25 C)
fRF vs. CG (MIXER) 12 14 fIF vs. CG (MIXER)
CG - Conversion Gain - dB
CG - Conversion Gain - dB
fIF = 480 MHz POSC = -10 dBm 1 000 1 400 1 800 2 200 fRF - Input Frequency - MHz
10 8 6 4 2 0 800
12 10 8 6 4 2 fRF = 2.1 GHz PRF = -20 dBm 200 400 600 800 fIF - Intermediate Frequency - MHz
0
Pin vs. Pout (MIXER) 10 10
Pin vs. Pout (MIXER)
Pout - Output Power - dBm
0
Pout - Output Power - dBm
fRF = 900 MHz fOSC = 1 380 MHz POSC = -10 dBm -30 -20 -10 0 Pin - Input Power - dBm 10
0
-10
-10
-20
-20
-30
-30
-40 -40
-40 -40
fRF = 2.1 GHz fOSC = 2.58 GHz POSC = -10 dBm -30 -20 -10 0 Pin - Input Power - dBm 10
fRF vs. NF (MIXER) 20 fIF = 480 MHz POSC = -10 dBm 18 70 60
VCC vs. ICC
ICC - Circuit Current - mA
NF - Noise Figure - dB
50 40 30 20 10
16 14 12 10 8 0.6
VCC: 6 0 V
No input signal 1 2 3 4 VCC - Supply Voltage - V 5 6
0.8
1 1.2 1.4 1.6 1.8 fRF - Input Frequency - GHz
2
2.2
0
8
Data Sheet P11758EJ3V0DS00
PC2782GR
Pin vs. Pout (IFAGCAmp) 10 30 fIF vs. CG (IFAGCAmp)
Pout - Output Power - dBm
0 25 -10
Gain (dB)
20
-20
15 -30 fIF = 480 MHz VAGC = 0 V -40 -40 -30 -20 -10 0 Pin - Input Power - dBm 10 10 0 PIF = -30 dBm VAGC = 0 V 200 400 600 fIF - Intermediate Frequency - MHz
fIF vs. NF (IFAGCAmp) 20 30 25
AGCVoltage vs. Gain
fIF = 480 MHz PIF = -30 dBm
NF - Noise Figure - dB
15
IF Amp Gain (dB)
VAGC = 0 V
20 15 10 5 0 -5
10
5
0
200 400 600 800 fIF - Intermediate Frequency - MHz
1 000
0
1
2 3 4 VAGC - AGC Voltage - V
5
6
Data Sheet P11758EJ3V0DS00
9
PC2782GR
Standard Characteristics (VCC = 5 V, TA = 25 C)
IM3 (MIXER) 10 10 IM3 (MIXER)
Pout - Output Power - dBm
-10
Pout - Output Power - dBm
fRF = 900, 930 MHz fOSC = 1 380 MHz POSC = -10 dBm -30 -20 -10 0 Pin - Input Power - dBm 10
-10
-30
-30
-50
-50
-70
-70
fRF = 2.1, 2.13 GHz fOSC = 2.58 GHz POSC = -10 dBm -30 -20 -10 0 Pin - Input Power - dBm 10
-90 -40
-90 -40
Oscillator Frequency Range IM3 (IFAGCAmp) 10 0
ATTEN 10 dB RL 0 dBm 10 dB/
-10
-30
POSC - Oscillator Output Power - dBm
1.268 G
2.618 G
Pout - Output Power - dBm
-50
-50
-70
fIF = 480, 510 MHz VAGC = 0 V -30 -20 -10 0 Pin - Input Power - dBm 10
-90 -40
CENTER 2.000 GHz
RBW 1.0 MHz VBW 1.0 MHz
SPAN 1.800 GHz
SWP 50 ms
10
Data Sheet P11758EJ3V0DS00
PC2782GR
Standard Characteristics (VCC = 5 V, TA = -40 C, 85 C)
fRF vs. CG (MIXER) 12 TA = -40 C 14 fIF vs. CG (MIXER)
CG - Conversion Gain - dB
CG - Conversion Gain - dB
TA = -40 C 12 10 8 6 4 2 0 fRF = 2.1 GHz PRF = -20 dBm 0 200 400 600 800 fIF - Intermediate Frequency - MHz TA = 85 C
10 TA = 85 C 8 6 4 2 0 600 fIF = 480 MHz POSC = -10 dBm 1 000 1 400 1 800 2 200 fRF - Input Frequency - MHz
Pin vs. Pout (MIXER) 10 10
Pin vs. Pout (MIXER)
TA = -40 C
Pout - Output Power - dBm
0
Pout - Output Power - dBm
TA = -40 C TA = 85 C
0 TA = 85 C -10
-10
-20
-20
-30
fRF = 900 MHz fOSC = 1 380 MHz POSC = -10 dBm -30 -20 -10 0 Pin - Input Power - dBm 10
-30
fRF = 2.1 GHz fOSC = 2.58 GHz POSC = -10 dBm -30 -20 -10 0 Pin - Input Power - dBm 10
-40 -40
-40 -40
fRF vs. NF (MIXER) 20 18 70 60
VCC vs. ICC
ICC - Circuit Current - mA
NF - Noise Figure - dB
TA = 85 C 50 40 TA = -40 C 30 20 10 No input signal VCC: 6 0 V 0 1 2 3 4 VCC - Supply Voltage - V 5 6
16 14 12 TA = 85 C 10 fIF = 480 MHz POSC = -10 dBm 8 0.6 0.8 1 1.2 1.4 1.6 1.8 fRF - Input Frequency - GHz 2 TA = -40 C
Data Sheet P11758EJ3V0DS00
11
PC2782GR
IM3 (MIXER) 10 10 IM3 (MIXER) TA = -40 C
Pout - Output Power - dBm
-10
Pout - Output Power - dBm
TA = 85 C TA = -40 C
-10
-30
-30
TA = 85 C
-50
-50
-70
fRF = 900, 930 MHz fOSC = 1 380 MHz POSC = -10 dBm -30 -20 -10 0 Pin - Input Power - dBm 10
-70
fRF = 2.1, 2.13 GHz fOSC = 2.58 GHz POSC = -10 dBm -30 -20 -10 0 Pin - Input Power - dBm 10
-90 -40
-90 -40
IM3 (IFAGCAmp) 10 10
Pin vs. Pout (IFAGCAmp)
TA = 85 C
Pout - Output Power - dBm
Pout - Output Power - dBm
0 TA = -40 C -10
-10
TA = 85 C
-30
-50
-20
-70
TA = -40 C fIF = 480,510 MHz VAGC = 0 V
-30 fIF = 480 MHz VAGC = 0 V -40 -40 -30 -20 -10 0 Pin - Input Power - dBm 10
-90 -40
-30
-20 -10 0 Pin - Input Power - dBm
10
fIF vs. CG (IFAGCAmp) 30 25 20
AGCVoltage vs. Gain fIF = 480 MHz PIF = -30 dBm
TA = 85 C 25
IF Amp Gain - dB
15 TA = -40 C 10 TA = 85 C 5 0
Gain - dB
TA = -40 C 20
15 VAGC = 0 V PIF = -30 dBm 10 0 200 400 600 fIF - Intermediate Frequency - MHz
-5 -10
0
1
2 3 4 VAGC - AGC Voltage - V
5
6
12
Data Sheet P11758EJ3V0DS00
PC2782GR
Measurement Circuit 1
OSC OUT
VCC
1 000 1 000 pF pF
1 000 pF 150 150
SG1 (50 )
1 000 pF 20 19 18 17 16 15 14 13 12 11
Bias CKT
1
2
3
4
5
6
7
8
9
10
1 000 pF
1 000 pF
RF IN
IF OUT
Measurement Circuit 2
OSC OUT
VCC
1 000 1 000 pF pF
1 000 pF 150 150
SG1 (50 )
1 000 pF 20 19 18 17 16 15 14 13 12 11
Bias CKT
1
2
3
4
5
6
7
8
9
10
1 000 pF NF METER Noise Source
1 000 pF
Data Sheet P11758EJ3V0DS00
13
PC2782GR
Measurement Circuit 3
OSC OUT
VCC
1 000 1 000 pF pF
1 000 pF 150 150 SG3 (50 )
1 000 pF 20 19 18 17 16 15 14 13 12 11
Bias CKT
1
2
3
4
5
6
7
8
9
10
1 000 pF SG1 (50 ) SG2 (50 )
1 000 pF
Spectrum Analyzer (50 )
Measurement Circuit 4
Spectrum Analyzer (50 ) 1 000 pF
20
19
18
17
16
15
14
13
12
11
Bias CKT
1
2
3
4
5
6
7
8
9
10
1 000 pF 1 000 pF 1 000 pF 1 000 pF SG1 (50 )
VCC
VAGC
14
Data Sheet P11758EJ3V0DS00
PC2782GR
Measurement Circuit 5
Spectrum Analyzer (50 ) 1 000 pF
20
19
18
17
16
15
14
13
12
11
Bias CKT
1
2
3
4
5
6
7
8
9
10
1 000 pF 1 000 pF 1 000 pF 1 000 pF SG1 (50 ) SG2 (50 )
VCC
VAGC
Measurement Circuit 6
1 000 pF NF METER 20 19 18 17 16 15 14 13 12 11
Bias CKT Noise Source
1
2
3
4
5
6
7
8
9
10
1 000 pF 1 000 pF 1 000 pF 1 000 pF
VCC
VAGC
Data Sheet P11758EJ3V0DS00
15
PC2782GR
Application Circuit Example
VT
12 k
OSC OUT CV
1 000 pF 12 k
to 15 nH
IF OUT CV
VCC * Cv: HVU316
1 000 pF
150
150
4 pF 12 k
3 pF 1.5 pF 3 pF 2 pF 2 pF
20
19
18
17
16
15
14
13
12
11
Bias CKT
1
2
3
4
5
6
7
8
9
10
1 000 pF
1 000 pF
1 000 pF
1 000 pF
1 000 pF
RF IN
IF VAGC OUT
IF IN
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
16
Data Sheet P11758EJ3V0DS00
PC2782GR
Illustration of The Application Circuit Assembled on Evaluation Board
VCC VTU
LO OUT
LO IN
R3 C11 C12 R2
R5
R4 L CV C9 C8 C7 R1
RF IN
C13 C1
C10
C6
AGC OUT
50.0000
C5
10
C14
IF OUT
C3 C2
AGC IN
C4
upc2782
VAGC 50.0000
C1 to C5 C6, C10 C7, C9 C8 C11 to C14 R1 to R3 R4, R5 CV L
: : : : : : : : :
1 000 pF 2 pF 3 pF 1.5 pF 1 000 pF 12 k 150 HVU316 to 15 nH
: 0.5 mm
7 to 8 mm * pattern should be removed on this application
Data Sheet P11758EJ3V0DS00
17
PC2782GR
PACKAGE DIMENSIONS
20 PIN PLASTIC SSOP (225 mil) (UNIT: mm)
20 11
detail of lead end
3-3
+7
1 6.7 0.3
10
1.8 MAX. 1.5 0.1
6.4 0.2 4.4 0.1 1.0 0.2
0.5 0.2 0.65 0.22 -0.05 0.1 0.1
+0.10
0.15 0.10 M
0.15 0.575 MAX.
+0.10 -0.05
NOTE Each lead centerline is located within 0.10 mm of its true position (T.P.) at maximum material condition.
18
Data Sheet P11758EJ3V0DS00
PC2782GR
Recommended Soldering Conditions The following conditions (see table below) must be met when soldering this product. Please consult with our sales officers in case other soldering process is used or in case soldering is done under different conditions. For details of recommended soldering conditions for surface mounting, CONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). refer to information document SEMI
PC2782GR
Soldering process Infrared ray reflow Soldering conditions Peak package's surface temperature: 235 C or below, Reflow time: 30 seconds or below (210 C or higher), Note Number of reflow process: 3, Exposure limit : None Peak package's surface temperature: 215 C or below, Reflow time: 40 seconds or below (200 C or higher), Note Number of reflow process: 3, Exposure limit : None Solder temperature: 260 C or below, Reflow time: 10 seconds or below, Note Number of reflow process: 1, Exposure limit : None Terminal temperature: 300 C or below, Flow time: 3 seconds or below, Note Exposure limit : None Symbol IR35-00-3
VPS
VP15-00-3
Wave soldering
WS60-00-1
Partial heating method
Note Exposure limit before soldering after dry-pack package is opened. Storage conditions: 25 C and relative humidity at 65 % or less. Caution Do not apply more than single process at once, except for "Partial heating method".
Data Sheet P11758EJ3V0DS00
19
PC2782GR
NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation.
* The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. * No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. * NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. * Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. * While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. * NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance.
M7 98. 8

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