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MMBT8099LT1
Preferred Device
Amplifier Transistor
NPN Silicon
MAXIMUM RATINGS
Rating Collector-Emitter Voltage Collector-Base Voltage Emitter-Base Voltage Collector Current - Continuous Symbol VCEO VCBO VEBO IC Value 80 80 6.0 500 Unit Vdc Vdc Vdc mAdc 1 BASE 2 EMITTER COLLECTOR 3
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THERMAL CHARACTERISTICS
Characteristic Total Device Dissipation FR-5 Board (Note 1.) TA = 25C Derate above 25C Thermal Resistance - Junction-to-Ambient (Note 1.) Total Device Dissipation Alumina Substrate (Note 2.) TA = 25C Derate above 25C Thermal Resistance - Junction-to-Ambient (Note 2.) Junction and Storage Temperature Range Symbol PD Max 225 1.8 RJA PD 556 300 2.4 RJA TJ, Tstg 417 -55 to +150 Unit mW mW/C C/W
3 mW 1 mW/C C/W C 2 SOT-23 CASE 318 STYLE 6
1. FR-5 = 1.0 X 0.75 X 0.062 in. 2. Alumina = 0.4 X 0.3 X 0.024 in. 99.5% alumina.
MARKING DIAGRAM
KB M
KB = Specific Device Marking M = Date Code
ORDERING INFORMATION
Device MMBT8099LT1 Package SOT-23 Shipping 3000/Tape & Reel
Preferred devices are recommended choices for future use and best overall value.
(c) Semiconductor Components Industries, LLC, 2001
1
January, 2001 - Rev. 0
Publication Order Number: MMBT8099LT1/D
MMBT8099LT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic Symbol Min Max Unit
OFF CHARACTERISTICS
Collector-Emitter Breakdown Voltage (Note 3.) (IC = 10 mAdc, IB = 0) Collector-Base Breakdown Voltage (IC = 100 Adc, IE = 0) Emitter-Base Breakdown Voltage (IE = 10 Adc, IC = 0) Collector Cutoff Current (VCE = 60 Vdc, IB = 0) Collector Cutoff Current (VCB = 60 Vdc, IE = 0) (VCB = 80 Vdc, IE = 0) Emitter Cutoff Current (VEB = 6.0 Vdc, IC = 0) (VEB = 4.0 Vdc, IC = 0) V(BR)CEO 80 V(BR)CBO 80 V(BR)EBO ICES ICBO - - IEBO - - 0.1 - 0.1 - Adc 6.0 - - - 0.1 Vdc Adc Adc - Vdc Vdc
ON CHARACTERISTICS (Note 3.)
DC Current Gain (IC = 1.0 mAdc, VCE = 5.0 Vdc) (IC = 10 mAdc, VCE = 5.0 Vdc) (IC = 100 mAdc, VCE = 5.0 Vdc) Collector-Emitter Saturation Voltage (IC = 100 mAdc, IB = 5.0 mAdc) (IC = 100 mAdc, IB = 10 mAdc) Base-Emitter On Voltage (IC = 1.0 mAdc, VCE = 5.0 Vdc) (IC = 10 mAdc, VCE = 5.0 Vdc) hFE 100 100 75 VCE(sat) - - VBE(on) - 0.6 - 0.8 0.4 0.3 Vdc 300 - - Vdc -
SMALL-SIGNAL CHARACTERISTICS
Current-Gain - Bandwidth Product (IC = 10 mAdc, VCE = 5.0 Vdc, f = 100 MHz) Output Capacitance (VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz) Input Capacitance (VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz) 3. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2.0%. TURN-ON TIME -1.0 V VCC +40 V RL TURN-OFF TIME +VBB VCC +40 V RL fT Cobo - Cibo - 25 6.0 pF 150 - MHz pF
5.0 ms +10 V 0 Vin tr = 3.0 ns 5.0 mF
100 RB
100 OUTPUT Vin * CS t 6.0 pF 5.0 mF 100 5.0 ms tr = 3.0 ns RB
OUTPUT
* CS t 6.0 pF
100
* Total Shunt Capacitance of Test Jig and Connectors For PNP Test Circuits, Reverse All Voltage Polarities
Figure 1. Switching Time Test Circuits
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MMBT8099LT1
f T , CURRENT-GAIN - BANDWIDTH PRODUCT (MHz) 300 200 TJ = 25C C, CAPACITANCE (pF) 5.0 V VCE = 1.0 V 100 70 50 30 20 Cibo 10 8.0 6.0 4.0 2.0 0.1 Cobo 0.2 0.5 1.0 2.0 5.0 10 20 50 100 40 TJ = 25C
1.0
2.0
3.0
5.0 7.0 10
20
30
50 70
100
IC, COLLECTOR CURRENT (mA)
VR, REVERSE VOLTAGE (VOLTS)
Figure 2. Current-Gain - Bandwidth Product
Figure 3. Capacitance
300 t, TIME (ns) 200 100 70 50 30 20 10
I C , COLLECTOR CURRENT (mA)
1.0 k 700 500
VCC = 40 V IC/IB = 10 IB1 = IB2 TJ = 25C
ts
1.0 k 700 500 300 200 100 70 50 30 20 10 1.0
tf
td @ VBE(off) = 0.5 V 10 20 30 50 70 100 IC, COLLECTOR CURRENT (mA)
tr 200
CURRENT LIMIT THERMAL LIMIT SECOND BREAKDOWN LIMIT DUTY CYCLE 10% 2.0 3.0 5.0 7.0 10 20 30 50 70 100
VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)
Figure 4. Switching Times
Figure 5. Active-Region Safe Operating Area
400 TJ = 125C h FE , DC CURRENT GAIN 200
1.0 0.8 V, VOLTAGE (VOLTS) 0.6 0.4 0.2
TJ = 25C VBE(sat) @ IC/IB = 10 VBE @ VCE = 5.0 V
25C -55C
100 80 60 40 0.2 0.3 0.5
VCE = 5.0 V
VCE(sat) @ IC/IB = 10 1.0 2.0 3.0 5.0 10 20 30 50 100 200 0 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200
IC, COLLECTOR CURRENT (mA)
IC, COLLECTOR CURRENT (mA)
Figure 6. DC Current Gain
Figure 7. "ON" Voltages
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MMBT8099LT1
VCE , COLLECTOR-EMITTER VOLTAGE (VOLTS) R qVB , TEMPERATURE COEFFICIENT (mV/ C) 2.0 1.6 1.2 0.8 0.4 IC = 20 mA IC = 50 mA IC = 100 mA TJ = 25C IC = 200 mA -1.0 -1.4 -1.8 -2.2 -2.6 -3.0
RqVB FOR VBE -55C TO 125C
0 0.02
IC = 10 mA 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20
0.2
0.5
1.0
2.0
5.0
10
20
50
100
200
IB, BASE CURRENT (mA)
IC, COLLECTOR CURRENT (mA)
Figure 8. Collector Saturation Region
1.0 0.7 0.5 0.3 0.2 0.1 0.07 0.05 0.03 0.02 0.01 1.0 2.0 5.0 10 20 50 100 200 t, TIME (ms)
Figure 9. Base-Emitter Temperature Coefficient
D = 0.5 0.2 0.1 0.05 SINGLE PULSE 0.02 0.01 P(pk) t1 SINGLE PULSE t2 DUTY CYCLE, D = t1/t2 500 1.0 k 2.0 k 5.0 k ZJC(t) = r(t) * RJC TJ(pk) - TC = P(pk) ZJC(t) ZJA(t) = r(t) * RJA TJ(pk) - TA = P(pk) ZJA(t) D CURVES APPLY FOR POWER PULSE TRAIN SHOWN READ TIME AT t1 (SEE AN469) 10 k 20 k 50 k 100 k
r(t), NORMALIZED TRANSIENT THERMAL RESISTANCE
Figure 10. Thermal Response
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MMBT8099LT1 INFORMATION FOR USING THE SOT-23 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection
0.037 0.95
interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process.
0.037 0.95
0.079 2.0 0.035 0.9 0.031 0.8
inches mm
SOT-23 SOT-23 POWER DISSIPATION The power dissipation of the SOT-23 is a function of the drain pad size. This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RJA, the thermal resistance from the device junction to ambient; and the operating temperature, TA. Using the values provided on the data sheet, PD can be calculated as follows:
PD = TJ(max) - TA RJA
into the equation for an ambient temperature TA of 25C, one can calculate the power dissipation of the device which in this case is 225 milliwatts.
PD = 150C - 25C = 225 milliwatts 556C/W
The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values
The 556C/W assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 225 milliwatts. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad(R). Using a board material such as Thermal Clad, the power dissipation can be doubled using the same footprint.
SOLDERING PRECAUTIONS The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. * Always preheat the device. * The delta temperature between the preheat and soldering should be 100C or less.* * When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10C. * The soldering temperature and time should not exceed 260C for more than 10 seconds. * When shifting from preheating to soldering, the maximum temperature gradient should be 5C or less. * After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device.
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MMBT8099LT1
SOLDER STENCIL GUIDELINES Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. A solder stencil is required to screen the optimum amount of solder paste onto the footprint. The stencil is made of brass or stainless steel with a typical thickness of 0.008 inches. The stencil opening size for the surface mounted package should be the same as the pad size on the printed circuit board, i.e., a 1:1 registration.
TYPICAL SOLDER HEATING PROFILE For any given circuit board, there will be a group of control settings that will give the desired heat pattern. The operator must set temperatures for several heating zones, and a figure for belt speed. Taken together, these control settings make up a heating "profile" for that particular circuit board. On machines controlled by a computer, the computer remembers these profiles from one operating session to the next. Figure 11 shows a typical heating profile for use when soldering a surface mount device to a printed circuit board. This profile will vary among soldering systems but it is a good starting point. Factors that can affect the profile include the type of soldering system in use, density and types of components on the board, type of solder used, and the type of board or substrate material being used. This profile shows temperature versus time. The line on the graph shows the actual temperature that might be experienced on the surface of a test board at or near a central solder joint. The two profiles are based on a high density and a low density board. The Vitronics SMD310 convection/infrared reflow soldering system was used to generate this profile. The type of solder used was 62/36/2 Tin Lead Silver with a melting point between 177-189C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this energy to the components. Because of this effect, the main body of a component may be up to 30 degrees cooler than the adjacent solder joints.
STEP 5 STEP 4 HEATING HEATING ZONES 3 & 6 ZONES 4 & 7 SPIKE" SOAK" 170C 160C STEP 6 STEP 7 VENT COOLING 205 TO 219C PEAK AT SOLDER JOINT
STEP 1 PREHEAT ZONE 1 RAMP" 200C
STEP 2 STEP 3 VENT HEATING SOAK" ZONES 2 & 5 RAMP"
DESIRED CURVE FOR HIGH MASS ASSEMBLIES 150C
150C
100C 100C
140C
SOLDER IS LIQUID FOR 40 TO 80 SECONDS (DEPENDING ON MASS OF ASSEMBLY)
50C
DESIRED CURVE FOR LOW MASS ASSEMBLIES
TIME (3 TO 7 MINUTES TOTAL)
TMAX
Figure 11. Typical Solder Heating Profile
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MMBT8099LT1
PACKAGE DIMENSIONS
SOT-23 TO-236AB CASE 318-08 ISSUE AF
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
A L
3 1 2
BS
V
G C D H K J
DIM A B C D G H J K L S V
INCHES MIN MAX 0.1102 0.1197 0.0472 0.0551 0.0350 0.0440 0.0150 0.0200 0.0701 0.0807 0.0005 0.0040 0.0034 0.0070 0.0140 0.0285 0.0350 0.0401 0.0830 0.1039 0.0177 0.0236
MILLIMETERS MIN MAX 2.80 3.04 1.20 1.40 0.89 1.11 0.37 0.50 1.78 2.04 0.013 0.100 0.085 0.177 0.35 0.69 0.89 1.02 2.10 2.64 0.45 0.60
STYLE 6: PIN 1. BASE 2. EMITTER 3. COLLECTOR
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MMBT8099LT1
Thermal Clad is a registered trademark of the Bergquist Company
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
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MMBT8099LT1/D

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