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Reflective Photosensors (Photo Reflectors)
CNB2003
Reflective photosensor
1 3 C0.5 0.35 1.7 0.7 max. 0.85 1.5 0.7 max. 1.7
Non-contact point SW, object sensing Features
* Reflow-compatible reflective photosensor * Ultraminiature, thin type: 2.7 mm x 3.4 mm (height: 1.5 mm)
3.4 1.8
Unit: mm
0.15
6.10.3
Chip center
2.7
Absolute Maximum Ratings Ta = 25C
Parameter Input (Light Reverse voltage Power dissipation *1 Output (Photo Collector-emitter voltage transistor) (Base open) Emitter-collector voltage (Base open) Collector current Collector power dissipation Temperature
*2
2 0.7
4 0.5
Symbol VR IF PD VCEO VECO IC PC T opr Tstg
Rating 6 50 75 35 6 30 75 -25 to +85 -40 to +100
Unit V mA mW V V mA mW C C
1: Anode 2: Cathode 3: Emitter 4: Collector PRSMW104-003 Package (Note) Tolerance unless otherwise specified is 0.2
Color of rank
emitting diode) Forward current
Operating ambient temperature Storage temperature
Note) *1: Input power derating ratio is 1.0 mW/C at Ta 25C. *2: Output power derating ratio is 1.0 mW/C at Ta 25C.
Electrical-Optical Characteristics Ta = 25C 3C
Parameter Input Forward voltage characteristics Reverse current Output Collector-emitter cutoff current characteristics (Base open) Transfer Collector current *1 characteristics Dark current Rise time *2 Fall time *2 Symbol VF IR ICEO IC ID tr tf IF = 20 mA VR = 3 V VCE = 10 V VCC = 2 V, IF = 4 mA, RL = 100 , d = 1 mm VCC = 2 V, IF = 4 mA, RL = 100 IF = 4 mA, IC = 0.5 mA VCC = 2 V, IC = 10 mA RL = 100 120 115 0.52 Conditions Min Typ 1.2 Max 1.4 10 1.0 15.00 5.0 1.2 Unit V A A mA A V s
Collector-emitter saturation voltage VCE(sat)
Note) 1. Input and output are handled electrically. 2. This product is not designed to withstand radiation *3: Rank classification 3. *1: Output current measurement *2: Switching time method measurement circuit Rank Q
Glass plate Evaporated Al d = 1 mm
Glass plate tr: Rise time Evaporated Al tf: Fall time d = 1 mm Sig. in
IC (mA) Color
R S 0.52 to 1.94 1.45 to 5.40 4.00 to 15.00 Orange White Light blue
IF
RL
IC VCC
Sig. in 50
Sig. out
RL Sig. out
VCC
tr
tf
90% 10%
Publication date: April 2004
SHG00057BED
1
CNB2003
IF , IC Ta
Forward current IF , collector current IC (mA)
60
IF
IF V F
80 Ta = 25C
103
IC I F
VCC = 5 V Ta = 25C RL = 100 d = 1 mm
50
Collector current IC (mA)
40
IC
Forward current IF (mA)
60
102
30
40
10
20
20
1
10
0 -25
0
0 20 40 60 80 100
10 -1
0
0.4
0.8
1.2
1.6
1
10
102
103
Ambient temperature Ta (C)
Forward voltage VF (V)
Forward current IF (mA)
VF Ta
1.6 1.4
IC VCE
102
Ta = 25C
IF = 10 mA
160 140 120 100 80 60 40 20
IC Ta
VCC = 2 V IF = 4 mA RL = 100
IF = 50 mA
Forward voltage VF (V)
1.2 1.0
10 mA 1 mA
10
4 mA 2 mA
0.8 0.6 0.4 0.2 0 -40
1
1 mA
10 -1
0
40
80
10 -2 10 -1
Relative collector current IC (%)
Collector current IC (mA)
1
10
102
0 -40
0
40
80
Ambient temperature Ta (C)
Collector-emitter voltage VCE (V)
Ambient temperature Ta (C)
ICEO Ta
Collector-emitter cutoff current (Base open) ICEO (A)
103
VCE = 10 V
104
tr , tf IC
100
IC d
VCC = 2 V IF = 4 mA
Rise time tr , fall time tf (s)
102
103
RL = 1 k 500 100
Relative collector current IC (%)
80
d
10
60
102
1
40
10
10 -1
VCC = 2 V Ta = 25C : tr : tf 10 -1 1 10
20
10 -2 -40
0
40
80
120
1 10 -2
0 0 2 4 6 8 10
Ambient temperature Ta (C)
Collector current IC (mA)
Distance d (mm)
2
SHG00057BED
Caution for Safety
This product contains Gallium Arsenide (GaAs).
DANGER
GaAs powder and vapor are hazardous to human health if inhaled or ingested. Do not burn, destroy, cut, cleave off, or chemically dissolve the product. Follow related laws and ordinances for disposal. The product should be excluded form general industrial waste or household garbage.
Request for your special attention and precautions in using the technical information and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technical information described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the technical information as described in this material. (4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: * Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. * Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.
2003 SEP

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