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DATA SHEET
TEA1097 Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer
Product specification Supersedes data of 1998 Jun 11 File under Integrated Circuits, IC03 1999 Apr 08
Philips Semiconductors
Product specification
Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer
FEATURES Line interface * Low DC line voltage * Voltage regulator with adjustable DC voltage * Symmetrical high-impedance inputs (70 k) for dynamic, magnetic or electric microphones * Dual Tone Multi-Frequency (DTMF) input with confidence tone on earphone and/or loudspeaker * Receive amplifier for dynamic, magnetic or piezo-electric earpieces (with externally adjustable gain) * Automatic Gain Control (AGC) for true line loss compensation. Supplies * Provides a strong 3.35 V regulated supply for microcontroller or dialler * Provides filtered power supply, optimized according to line current and compatible with external voltage or current sources * Filtered 2 V power supply output for electret microphone * Compatible with a ringer mode * Power-Down (PD) logic input for power-down. Loudspeaker amplifier * Single-ended rail-to-rail output * Externally adjustable gain * Dynamic limiter to prevent distortion * Logarithmic volume control via linear potentiometer. Auxiliary interfaces * Asymmetrical high-impedance input for electret microphone. ORDERING INFORMATION TYPE NUMBER TEA1097TV TEA1097H PACKAGE NAME VSO40 QFP44 DESCRIPTION plastic very small outline package; 40 leads plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm
TEA1097
* General purpose auxiliary output for transmit and receive * Auxiliary transmit input with high signal level capability dedicated to line transmission * Auxiliary receive input with high signal level capability * Integrated multiplexer for channels selection. APPLICATIONS * Telephone answering machines * Telephones with digital handsfree * Line powered telephone sets * Cordless telephones * Fax machines. GENERAL DESCRIPTION The TEA1097 is an analog bipolar circuit dedicated for telephone applications. It includes a line interface, handset microphone and earpiece amplifiers, base microphone and loudspeaker amplifiers, some specific auxiliary Inputs/Outputs (I/Os) and an analog multiplexer to enable the right transmit and/or receive channels. The multiplexer is controlled by a logic circuitry decoding four logic inputs provided by a microcontroller. Twelve different application modes have been defined and can be accessed by selecting the right logic inputs. This IC can be supplied by the line and/or by the mains if available (in a cordless telephone or a telephone answering machine for example). It provides a 3.35 V supply for a microcontroller or dialler and a 2 V filtered voltage supply for electret microphones. The IC is designed to facilitate the use of the loudspeaker amplifier during ringing phase.
VERSION SOT158-1 SOT307-2
1999 Apr 08
2
Philips Semiconductors
Product specification
Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer
TEA1097
QUICK REFERENCE DATA Iline = 15 mA; RSLPE = 20 ; Zline = 600 ; f = 1 kHz; Tamb = 25 C; AGC pin connected to LN; PD = HIGH; HFC = LOW; AUXC = LOW; MUTT = HIGH; MUTR = HIGH; measured according to test circuits; unless otherwise specified. SYMBOL Iline PARAMETER line current operating range CONDITIONS normal operation TEA1097H TEA1097TV VSLPE VBB VDD stabilized voltage between SLPE and GND (Vref) regulated supply voltage for internal circuitry regulated supply voltage on pin VDD external voltage supply allowed on pin ESI external current supply allowed on pin ESI current available on pin VBB speech mode handsfree mode; HFC = HIGH IBB(pd) Gv(MIC-LN) Gv(IR-RECO) Gv(QR) Gv(TXIN-TXOUT) Gv(TXAUX-LN) Gv(HFRX-LSAO) Gv(trx) current consumption on VBB during power-down phase voltage gain from pin MIC+/MIC- to LN voltage gain from pin IR (referenced to LN) to RECO gain voltage range between pins RECO and QR voltage gain from pin TXIN to TXOUT VTXIN = 3 mV (RMS); RGATX = 30.1 k; note 1 PD = LOW VMIC = 5 mV (RMS) VIR = 15 mV (RMS) Iline = 15 mA Iline = 70 mA Iline = 15 mA Iline = 70 mA VBB > 3.35 V + 0.25 V (typ.) otherwise VESI(ext) IESI(ext) IBB 11 11 3.4 5.7 2.75 4.9 3.1 - - - - - - 43.3 28.7 -3 13.15 11.5 25.5 5.45 - - - 3.7 6.1 3.0 5.3 3.35 140 130 11 4.0 6.5 3.25 5.7 3.6 mA mA mA V V V V V V V mA mA mA A dB dB dB dB dB dB dB MIN. TYP. MAX. UNIT
with reduced performance 1
VBB - 0.25 - - - 11 9.5 460 44.3 29.7 - 14.85 12.5 28 6.45 6 140 - - - 45.3 30.7 +15 16.55 13.5 30.5 7.45
voltage gain from pin TXAUX to LN VTXAUX = 0.1 V (RMS); note 1 voltage gain from pin HFRX to LSAO gain control range for transmit and receive amplifiers affected by the AGC; with respect to Iline = 15 mA VHFRX = 20 mV (RMS); RGALS = 255 k; note 1 Iline = 70 mA; on Gv(MIC-LN), Gv(IR-RECO) and Gv(IR-AUXO)
Note 1. When the channel is enabled according to Table 1.
1999 Apr 08
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Philips Semiconductors
Product specification
Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer
BLOCK DIAGRAM
handbook, full pagewidth
TEA1097
REG LN 19 (15) 20 (16) STARTER
SLPE 18 (14) (10) 13 (9) 12 VBB ESI VDD MICS
LINE CURRENT DETECTION LOW VOLTAGE BEHAVIOUR
(19) 23 SWITCH D6 SUPPLY MANAGEMENT (20) 24
AGC
22 (18)
AGC POWER-DOWN CURRENT SOURCES (38) 40 PD
GND
17 (13)
Tail currents for preamps
TXAUX 5 (43) (37) 39 DTMF 34 (32) ANALOG MULTIPLEXER CONTROL (39) 1 (40) 2 (41) 3 HFC MUTT MUTR AUXC
ATT.
TEA1097TV
MIC+ 33 (31) MIC- 32 (30) TXIN 30 (28)
(27) 29
GATX
(26) 28 (29) 31
TXOUT GNDTX
STAB
25 (21)
TAIL CURRENTS VOLUME CONTROL (23) 27 (1) 7 VOL HFRX
GALS LSAO
14 (11) 16 (12)
DLC
11 (8)
DYNAMIC LIMITER
(36) 38 AUXO 6 (44)
HFTX
(17) 21
IR
RECO GARX QR
37 (35) 36 (34) 35 (33) (42) 4 RAUX ATT.
MGL392
The pin numbers given in parenthesis refer to the TEA1097H.
Fig.1 Block diagram.
1999 Apr 08
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Philips Semiconductors
Product specification
Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer
PINNING PIN SYMBOL VSO40 MUTT MUTR AUXC RAUX TXAUX AUXO HFRX n.c. DLC ESI VBB GALS LSAO GND SLPE LN REG IR AGC VDD MICS STAB VOL TXOUT GATX TXIN GNDTX MIC- MIC+ DTMF QR GARX RECO HFTX HFC PD 1 2 3 4 5 6 7 8 to 10, 15 and 26 11 12 13 14 16 17 18 19 20 21 22 23 24 25 27 28 29 30 31 32 33 34 35 36 37 38 39 40 QFP44 39 40 41 42 43 44 1 2 to 7, 22, 24 and 25 8 9 10 11 12 13 14 15 16 17 18 19 20 21 23 26 27 28 29 30 31 32 33 34 35 36 37 38 logic input (active LOW) logic input (active LOW) logic input auxiliary receive amplifier input auxiliary transmit amplifier input auxiliary amplifier output receive input for loudspeaker amplifier not connected dynamic limiter capacitor for the loudspeaker amplifier external supply input stabilized supply for internal circuitry loudspeaker amplifier gain adjustment loudspeaker amplifier output ground reference line current sense positive line terminal line voltage regulator decoupling receive amplifier input automatic gain control/line loss compensation 3.35 V regulated voltage supply for microcontroller microphone supply output reference current adjustment loudspeaker volume adjustment base microphone amplifier output base microphone amplifier gain adjustment base microphone amplifier input ground reference for microphone amplifiers negative handset microphone amplifier input positive handset microphone amplifier input dual tone multi-frequency input earpiece amplifier output earpiece amplifier gain adjustment receive amplifier output transmit input for auxiliary receive amplifier logic input power-down input (active LOW) DESCRIPTION
TEA1097
1999 Apr 08
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Philips Semiconductors
Product specification
Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer
TEA1097
handbook, halfpage
MUTT 1 MUTR 2 AUXC 3 RAUX 4 TXAUX 5 AUXO 6 HFRX 7 n.c. 8 n.c. 9 n.c. 10
40 PD 39 HFC 38 HFTX 37 RECO 36 GARX 35 QR 34 DTMF 33 MIC+ 32 MIC- 31 GNDTX
TEA1097TV
DLC 11 ESI 12 VBB 13 GALS 14 n.c. 15 LSAO 16 GND 17 SLPE 18 LN 19 REG 20
MGL393
30 TXIN 29 GATX 28 TXOUT 27 VOL 26 n.c. 25 STAB 24 MICS 23 VDD 22 AGC 21 IR
Fig.2 Pin configuration (VSO40).
1999 Apr 08
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Philips Semiconductors
Product specification
Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer
TEA1097
43 TXAUX
35 RECO
40 MUTR
36 HFTX
37 HFC
handbook, full pagewidth
34 GARX
44 AUXO
41 AUXC
39 MUTT
42 RAUX
38 PD
HFRX 1 n.c. 2 n.c. 3 n.c 4 n.c 5 n.c 6 n.c 7 DLC 8 ESI 9 VBB 10 GALS 11
33 QR 32 DTMF 31 MIC+ 30 MIC- 29 GNDTX
TEA1097H
28 TXIN 27 GATX 26 TXOUT 25 n.c. 24 n.c. 23 VOL
STAB 21
LSAO 12
GND 13
SLPE 14
REG 16
AGC 18
VDD 19
MICS 20
n.c 22
LN 15
IR 17
FCA019
Fig.3 Pin configuration (QFP44).
FUNCTIONAL DESCRIPTION All data given in this chapter are typical values, except when otherwise specified. Supplies LINE INTERFACE AND INTERNAL SUPPLY (PINS LN, SLPE, REG AND VBB) The supply for the TEA1097 and its peripherals is obtained from the line. The IC generates a stabilized reference voltage (Vref) between pins SLPE and GND. This reference voltage is equal to 3.7 V for line currents lower than 18 mA. It than increases linearly with the line current and reaches the value of 6.1 V for line currents higher than 45 mA. For line currents below 9 mA, the internal reference voltage generating Vref is automatically adjusted to a lower value. This is the so-called low voltage area and the TEA1097 has limited performances in this area (see Section "Low voltage behaviour"). This reference voltage is temperature compensated.
The voltage between pins SLPE and REG is used by the internal regulator to generate the stabilized reference voltage and is decoupled by means of a capacitor between pins LN and REG. This capacitor converted into an equivalent inductance realizes the set impedance conversion from its DC value (RSLPE) to its AC value (done by an external impedance). The IC regulates the line voltage at pin LN and it can be calculated as follows: V LN = V ref + R SLPE x I SLPE I SLPE = I line - I where: Iline = line current Ix = current consumed on pin LN (approximately a few A) ISLPE = current flowing through the RSLPE resistor.
x
1999 Apr 08
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Philips Semiconductors
Product specification
Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer
The preferred value for RSLPE is 20 . Changing this value will affect more than the DC characteristics; it also influences the transmit gains to the line, the gain control characteristic, the sidetone level and the maximum output swing on the line. As can be seen from Fig.4, the internal circuitry is supplied by pin VBB, which is a strong supply point combined with the line interface. The line current is flowing through the RSLPE resistor and is sunk by the VBB voltage stabilizer, becoming available for a loudspeaker amplifier or any peripheral IC. Its voltage is equal to 3.0 V for line currents lower than 18 mA. It than increases linearly with the line current and reaches the value of 5.3 V for line currents greater than 45 mA. It is temperature compensated.
TEA1097
The aim of the current switch TR1 and TR2 is to reduce distortion of large AC line signals. Current ISLPE is supplied to VBB via TR1 when the voltage on SLPE is greater than VBB + 0.25 V. When the voltage on SLPE is lower than this value, the current ISLPE is shunted to GND via TR2. The reference voltage Vref can be increased by connecting an external resistor between pins REG and SLPE. For large line currents, this increase can slightly affect some dynamic performances such as maximum signal level on the line for 2% THD. The voltage on pin VBB is not affected by this external resistor. See Fig.5 for the main DC voltages.
LN handbook, full pagewidth RSLPE 20 SLPE CREG 4.7 F E1 D1 J1 R3 REG R1 TR1
TR2 GND VBB E2
TP1
D1 TN2
R2 from preamp TN1 GND GND J2
MGM298
Fig.4 Line interface principle.
1999 Apr 08
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Philips Semiconductors
Product specification
Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer
TEA1097
handbook, full pagewidth
8
FCA049
LN
voltages (V) SLPE 6 VBB
4 VDD
2
MICS
0 0 0.01 0.02 0.03 0.04 0.05 0.06 Iline (A) 0.07
Fig.5 Main DC voltages as a function of line current.
EXTERNAL SUPPLY (PINS ESI AND VBB) The TEA1097 can be supplied by the line as well as by external power sources (voltage or current sources) that must be connected to pin ESI. The IC will choose which supply to use according to the voltage it can provide. A voltage supply on ESI is efficient only if its value is greater than the working voltage of the internal VBB voltage stabilizer. Otherwise the IC continues to be line powered. The current consumed on this source is at least equal to the internal consumption. It depends on the voltage difference between the value forced on ESI and the working voltage of the internal stabilizer. The current required increases with the voltage difference to manage. The excess current compared to the internal consumption becomes then available for other purposes such as supplying a loudspeaker amplifier. The voltage source should not exceed 6 V. If the value of the external voltage source can be lower than the working voltage of the internal stabilizer, an external diode is required to avoid reverse current flowing into the external power supply. In case of current source, the voltage on VBB and ESI depends on the current available. It is internally limited to 6.6 V. The current source should not exceed 140 mA.
VDD SUPPLY FOR MICROCONTROLLERS (PIN VDD) The voltage on VDD supply point follows the voltage on VBB with a difference equal to 250 mV (typ.) and is internally limited to 3.35 V. This voltage is temperature compensated. This supply point can provide a current up to 3 mA (typ.). Its internal consumption stays low (a few 10 nA) as long as VDD does not exceed 1.5 V (see Fig.6). An external voltage can be connected on VDD with limited extra consumption on VDD (typically 100 A). This voltage source should not be lower than 3.5 V and higher than 6 V. VBB and VDD can supply external circuits in the limits of currents provided either from the line or from pin ESI, taking into account the internal current consumption.
1999 Apr 08
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Philips Semiconductors
Product specification
Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer
TEA1097
10 8 handbook, full pagewidth IDD (pA) 10 7
FCA050
10 6
10 5
10 4
10 3
10 2
10 1.0
1.5
2.0
2.5
VDD (V)
3.0
Fig.6 Current consumption on VDD.
SUPPLY FOR MICROPHONE (PINS MICS AND GNDTX) The MICS output can be used as a supply for an electret microphone. Its voltage is equal to 2 V; it can source current up to 1 mA and has an output impedance equal to 200 . LOW VOLTAGE BEHAVIOUR For line currents below 9 mA, the reference voltage is automatically adjusted to a lower value; the VBB voltage follows the SLPE voltage with 250 mV difference. The excess current available for other purposes than DC biasing of the IC becomes small. In this low voltage area, the IC has limited performances. When the VBB voltage reaches 2.7 V, the VBB detector of the receive dynamic limiter on pin LSAO acts continuously, discharging the capacitor at pin DLC. In the DC condition, the loudspeaker is automatically disabled below this voltage.
When VBB becomes lower than 2.5 V, the TEA1097 is forced in a low voltage mode whatever the levels on the logic inputs are. It is a speech mode with reduced performances only enabling the microphone channel (between the MIC inputs and LN) and the earpiece amplifier. These two channels are able to deliver signals for line currents as small as 3 mA. The HFC input is tied to GND sinking a current equal to 300 A (typ.). POWER-DOWN MODE (PINS PD AND AUXC) To reduce current consumption during dialling or register recall (flash), the TEA1097 is provided with a power-down input (PD). When the voltage on pins PD and AUXC is LOW, the current consumption from VBB and VDD is reduced to 460 A (typ.). Therefore a capacitor of 470 F connected to pin VBB is sufficient to power the TEA1097 during pulse dialling or flash. The PD input has a pull-up structure, while AUXC has a pull-down structure. In this mode, the capacitor CREG is internally disconnected.
1999 Apr 08
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Philips Semiconductors
Product specification
Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer
RINGER MODE (PINS ESI, VBB, AUXC AND PD) The TEA1097 is designed to be activated during the ringing phase. The loudspeaker amplifier can be used for the melody signal. The IC must be powered by an external supply on pin ESI, while applying a HIGH level on the logic input AUXC and a LOW level on the PD input. Only the HFRX input and the LSAO output are activated, in order to limit the current consumption. Some dynamic limiting is provided to prevent VBB from being discharged below 2.7 V. Transmit channels (pins MIC+, MIC-, DTMF, TXAUX and LN) HANDSET MICROPHONE AMPLIFIER (PINS MIC+, MIC- AND LN) The TEA1097 has symmetrical microphone inputs. The input impedance between MIC+ and MIC- is 70 k (typ.). The voltage gain between pins MIC+, MIC- and LN is set to 44.3 dB. Without limitation from the output, the microphone input stage can accommodate signals up to 18 mV (RMS) at room temperature for 2% of THD. The microphone inputs are biased at one diode voltage. Automatic gain control is provided for line loss compensation. DTMF AMPLIFIER (PINS DTMF, LN AND RECO) The TEA1097 has an asymmetrical DTMF input. The input impedance between pin DTMF and GND is 20 k (typ.). The voltage gain between pins DTMF and LN is set to 25.35 dB. Without limitation from the output, the input stage can accommodate signals up to 180 mV (RMS) at room temperature for 2% of THD. When the DTMF amplifier is enabled, dialling tones may be sent on the line. These tones can be heard in the earpiece or in the loudspeaker at a low level. This is called the confidence tone. The voltage attenuation between pins DTMF and RECO is typically equal to -16.5 dB. The DC biasing of this input is 0 V. The automatic gain control has no effect on these channels.
TEA1097
AUXILIARY TRANSMIT AMPLIFIER (PINS TXAUX AND LN) The TEA1097 has an asymmetrical auxiliary input TXAUX. The input impedance between pins TXAUX and GND is 20 k (typ.). The voltage gain between pins TXAUX and LN is set to 12.5 dB. Without limitation from the output, the input stage can accommodate signals up to 1.2 V (RMS) at room temperature for 2% of THD. The TXAUX input is biased at two diodes voltage. Automatic gain control is provided for line loss compensation. MICROPHONE MONITORING ON TXOUT (PINS MIC+, MIC- AND TXOUT) The voltage gain between the microphone inputs MIC+, MIC- and the output TXOUT is set to 49.8 dB. This channel gives an image of the signal sent on the line while speaking in the handset microphone. Using external circuitry, this signal can be used for several purposes such as sending dynamic limiting or anti-howling in a listening-in application. The TXOUT output is biased at two diodes voltage. The automatic gain control has no effect on these channels. Receive channels (pins IR, RAUX, RECO, GARX and QR) RX AMPLIFIER (PINS IR AND RECO) The receive amplifier has one input IR which is referred to the line. The input impedance between pins IR and LN is 20 k (typ.) and the DC biasing between these pins is equal to one diode voltage. The gain between pins IR (referenced to LN) and RECO is typically equal to 29.7 dB. Without limitation from the output, the input stage can accommodate signals up to 50 mV (RMS) at room temperature for 2% of THD. This receive amplifier has a rail-to-rail output RECO, which is designed for use with high-ohmic (real) loads (larger than 5 k). This output is biased at two diodes voltage. Automatic gain control is provided for line loss compensation.
1999 Apr 08
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Philips Semiconductors
Product specification
Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer
EARPIECE AMPLIFIER (PINS GARX AND QR) The earpiece amplifier is an operational amplifier having its output (QR) and its inverting input (GARX) available. Its input signal comes, via a decoupling capacitor, from the receive RECO output. It is used in combination with two resistors to get the required gain or attenuation compared to the receive gain. It can be chosen between -3 and +15 dB. Two external capacitors CGAR (connected between pins GARX and QR) and CGARS (connected between pins GARX and GND) ensure stability. The CGAR capacitor provides a first-order low-pass filter. The cut-off frequency corresponds to the time constant CGAR x Re2. The relationship CGARS 10 x CGAR must be fulfilled. The earpiece amplifier has a rail-to-rail output QR, biased at two diodes voltage. It is designed for use with low-ohmic (real) loads (150 ) or capacitive loads (100 nF in series with 100 ). When the amplifier is turned off, the signal present on the earpiece is equal to the ratio between the load on QR and Re1 + Re2 AUXILIARY RECEIVE AMPLIFIER (PINS RAUX AND RECO) The auxiliary receive amplifier has an asymmetrical input RAUX; it uses the RECO output. Its input impedance between pins RAUX and GND is typically equal to 20 k. The voltage gain between pins RAUX and RECO is equal to -2.4 dB. Without any limitation from the output, the input stage can accommodate signals up to 0.95 V (RMS) at room temperature for 2% of THD. This auxiliary amplifier has a rail-to-rail output RECO, which is designed for use with high ohmic (real) loads (larger than 5 k). This output is biased at two diodes voltage. The automatic gain control has no effect on this channel. Auxiliary amplifiers using AUXO (pins MIC+, MIC-, HFTX, IR and AUXO) The TEA1097 has an auxiliary output AUXO, biased at two diodes voltage. This output stage is a rail-to-rail one, designed for use with high-ohmic (real) loads (larger than 5 k). The AUXO output amplifier is used in three different channels, two transmit channels and one receive channel.
TEA1097
AUXILIARY AMPLIFIERS USING THE MICROPHONE INPUTS (PINS MIC+, MIC- AND AUXO) The auxiliary transmit amplifier using the microphone MIC+ and MIC- inputs has a gain of 25.5 dB referenced to AUXO. Without limitation from the output, the input stage can accommodate signals up to 16 mV (RMS) at room temperature for 2% of THD. The automatic gain control has no effect on this channel. AUXILIARY AMPLIFIERS USING HFTX (PINS HFTX AND AUXO) The auxiliary transmit amplifier using the HFTX input has a gain of 15.2 dB referenced to AUXO. The automatic gain control has no effect on this channel. RX AMPLIFIER USING IR (PINS IR AND AUXO) The auxiliary receive amplifier uses pin IR as input. The input is referenced to pin LN and the DC biasing between these two pins is one diode voltage. The voltage gain between the input IR (referenced to LN) and the output AUXO is typically equal to 32.8 dB, which compensates typically the attenuation provided by the anti-sidetone network. Automatic gain control is provided for line loss compensation. Automatic gain control (pin AGC) The TEA1097 performs automatic line loss compensation, which fits well with the true line attenuation. The automatic gain control varies the gain of some transmit and receive amplifiers in accordance with the DC line current. The control range is 6.45 dB for Gv(MIC-LN), Gv(IR-RECO) and Gv(IR-AUXO) and 6.8 dB for Gv(TXAUX-LN), which corresponds approximately to a line length of 5.5 km for a 0.5 mm twisted-pair copper cable. To enable this gain control, the pin AGC must be shorted to pin LN. The start current for compensation corresponds to a line current equal to typically 23 mA and the stop current to 57 mA. The start current can be increased by connecting an external resistor between pins AGC and LN. It can be increased to 40 mA (using a resistor typically equal to 80 k). The start and stop current will be maintained in a ratio equal to 2.5. By leaving the AGC pin open-circuit, the gain control is disabled and no line loss compensation is performed.
1999 Apr 08
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Philips Semiconductors
Product specification
Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer
Base microphone channel (pins TXIN, GATX, TXOUT and GNDTX) see Fig.7 The TEA1097 has an asymmetrical base microphone input TXIN with an input resistance of 20 k. The DC biasing of the input is 0 V. The output TXOUT is biased at two diodes voltage and has a current capability equal to 20 A (RMS). The gain of the microphone amplifier (from pins TXIN to TXOUT) can be adjusted from 0 to 31 dB to suit specific application requirements.
TEA1097
The gain is proportional to the value of RGATX and equals 14.85 dB with RGATX = 30.1 k. Without limitation from the output, the microphone input stage can accommodate signals up to 18 mV (RMS) at room temperature for 2% of THD. A capacitor can be connected in parallel with RGATX to provide a 1st-order low-pass filter.
handbook, full pagewidth
VBB
GATX
29 (27)
RGATX CGATX
RMIC CMIC 30 TXIN (28) V I I V TXOUT 28 (26)
GNDTX
31 (29)
MGL395
The pin numbers given in parenthesis refer to the TEA1097H.
Fig.7 Base microphone channel.
1999 Apr 08
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Philips Semiconductors
Product specification
Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer
Loudspeaker channel
TEA1097
handbook, full pagewidth
RGALS
to logic 14 GALS (11) VBB 16 LSAO (12) V I I V HFRX 7 (1)
CGALS CLSAO
11 DLC (8) CDLC
DYNAMIC LIMITER
VOLUME CONTROL
VOL 27 (23) R VOL
MGL394
The pin numbers given in parenthesis refer to the TEA1097H.
Fig.8 Loudspeaker channel.
LOUDSPEAKER AMPLIFIER: PINS HFRX, GALS AND LSAO The TEA1097 has an asymmetrical input for the loudspeaker amplifier with an input resistance of 20 k between pins HFRX and GND. It is biased at two diodes voltage. The input stage can accommodate signals up to 580 mV (RMS) at room temperature for 2% of THD. The rail-to-rail output stage is designed to power a loudspeaker down to 8 connected as a single-ended load (between pins LSAO and GND). When the circuit is externally supplied, the maximum output power is equal to 280 mW (typ.) for 6 V applied to pin ESI. The gain of the loudspeaker amplifier can be adjusted from 0 to 35 dB to suit specific application requirements. The gain from HFRX to LSAO is proportional to the value of RGALS and equals 28 dB with RGALS = 255 k. A capacitor connected in parallel with RGALS is recommended and provides a first-order low-pass filter. VOLUME CONTROL (PIN VOL) The loudspeaker amplifier gain can be adjusted with the potentiometer RVOL. A linear potentiometer can be used to obtain logarithmic control of the gain at the loudspeaker amplifier. Each 1.9 k increase of RVOL results in a gain loss of 3 dB.
DYNAMIC LIMITER (PIN DLC) The dynamic limiter of the TEA1097 prevents clipping of the loudspeaker output stage and protects the operation of the circuit when the supply voltage at VBB falls below 2.7 V. Hard clipping of the loudspeaker output stage is prevented by rapidly reducing the gain when the output stage starts to saturate. The time in which gain reduction is effected (clipping attack time) is approximately a few milliseconds. The circuit stays in the reduced gain mode until the peaks of the loudspeaker signals no longer cause saturation. The gain of the loudspeaker amplifier then returns to its normal value within the clipping release time (typically 100 ms). Both attack and release times are proportional to the value of the capacitor CDLC. The total harmonic distortion of the loudspeaker output stage, in reduced gain mode, stays below 1% up to 10 dB (min.) of input voltage overdrive [providing VHFRX is below 580 mV (RMS)]. When the supply voltage drops below an internal threshold voltage of 2.7 V, the gain of the loudspeaker amplifier is rapidly reduced (approximately 1 ms). When the supply voltage exceeds 2.7 V, the gain of the loudspeaker amplifier is increased again. By forcing a level lower than 0.2 V on pin DLC, the loudspeaker amplifier is muted.
1999 Apr 08
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Philips Semiconductors
Product specification
Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer
Logic inputs Table 1 Selection of transmit and receive channels for 12 different application modes LOGIC INPUTS FEATURES PD 0 0 1 1 1 HFC X X 0 0 0 MUTT X X 0 0 1 MUTR X X 0 1 1 AUXC 1 0 0 0 0 DTMF to LN; DTMF to RECO; QR and MICS are active MIC to AUXO; RAUX to RECO; QR and MICS are active HFRX to LSAO ringer mode
TEA1097
APPLICATION EXAMPLES
flash, DC dialling DTMF dialling in handset cordless intercom with corded handset
MIC to LN; IR to RECO; handset conversation IR to AUXO; MIC to TXOUT; QR and MICS are active TXAUX to LN and IR to AUXO conversation using auxiliary I/O; cordless: digital handsfree in mobile answering machine: play and record messages; listen the recorded message on the loudspeaker DTMF dialling in handsfree or group listening modes answering machine: play and record messages while listening in the loudspeaker cordless intercom with base
1
0
1
0
1
1 1
1 1
0 0
1 0
1 1
RAUX to RECO and HFRX to LSAO listening on the loudspeaker TXAUX to LN; IR to AUXO; RAUX to RECO; HFRX to LSAO
1
1
0
0
0
DTMF to LN; DTMF to RECO; HFRX to LSAO; QR and MICS are active TXAUX to LN; IR to AUXO; IR to RECO and HFRX to LSAO TXIN to TXOUT; HFTX to AUXO; RAUX to RECO; HFRX to LSAO and MICS is active TXIN to TXOUT; TXAUX to LN; IR to RECO; IR to AUXO; HFRX to LSAO; MICS is active MIC to LN; IR to RECO; IR to AUXO; HFRX to LSAO; MIC to TXOUT; QR and MICS are active
1
1
1
0
1
1
1
0
1
0
1
1
1
1
0
digital handsfree conversation handset conversation with group-listening
1
1
1
0
0
1999 Apr 08
15
Philips Semiconductors
Product specification
Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer
TEA1097
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134); DC levels are referenced to GND. SYMBOL VLN PARAMETER positive continuous line voltage repetitive line voltage during switch-on or line interruption VESI Ii(ESI) Vn(max) positive continuous voltage on pin ESI input current at pin ESI maximum voltage on pins REG, SLPE, IR and AGC on all other pins except VDD Iline maximum line current for TEA1097H TEA1097TV Ptot total power dissipation TEA1097TV TEA1097H Tstg Tamb IC storage temperature operating ambient temperature Tamb = 75 C - - -40 -25 400 720 +125 +75 mW mW C C - - 140 130 mA mA -0.4 -0.4 VLN + 0.4 VBB + 0.4 V V CONDITIONS MIN. -0.4 -0.4 -0.4 - MAX. +12 +13.2 +6 140 V V V mA UNIT
THERMAL CHARACTERISTICS SYMBOL Rth(j-a) TEA1097TV TEA1097H PARAMETER thermal resistance from junction to ambient CONDITIONS in free air 115 63 K/W K/W VALUE UNIT
1999 Apr 08
16
Philips Semiconductors
Product specification
Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer
TEA1097
handbook, full pagewidth
160 Iline (mA)
FCA026
120
(1) (2) (3) (4)
80
(5) (6)
40
0 3.5
5.5
7.5
9.5
11.5
VSLPE (V)
13.5
LINE (1) (2) (3) (4) (5) (6) Fig.9 Safe operating area (TEA1097TV).
Tamb (C) 25 35 45 55 65 75
Ptot (mW) 800 720 640 560 480 400
1999 Apr 08
17
Philips Semiconductors
Product specification
Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer
TEA1097
handbook, full pagewidth
160
FCA025
Iline (mA) 120
(1) (2)
(3)
(4)
80
(5)
40
0 3 4 5 6 7 8 9 10 11 12 VSLPE (V) 13
LINE (1) (2) (3) (4) (5) Fig.10 Safe operating area (TEA1097H).
Tamb (C) 35 45 55 65 75
Ptot (mW) 1304 1158 1012 866 720
1999 Apr 08
18
Philips Semiconductors
Product specification
Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer
TEA1097
CHARACTERISTICS Iline = 15 mA; RSLPE = 20 ; Zline = 600 ; f = 1 kHz; Tamb = 25 C; AGC pin connected to LN; PD = HIGH; HFC = LOW; AUXC = LOW; MUTT = HIGH; MUTR = HIGH; measured according to test circuits; DC levels are referenced to GND; unless otherwise specified. SYMBOL Supplies LINE INTERFACE AND INTERNAL SUPPLY (PINS LN, SLPE, REG AND VBB) VSLPE VBB Iline VSLPE(T) VBB(T) IBB stabilized voltage between SLPE Iline = 15 mA and GND (Vref) Iline = 70 mA regulated supply voltage for internal circuitry line current for voltage increase stabilized voltage variation with temperature referenced to 25 C regulated voltage variation with temperature referenced to 25 C current available on pin VBB Iline = 15 mA Iline = 70 mA start current stop current Tamb = -25 to +75 C Tamb = -25 to +75 C speech mode digital handsfree mode; HFC = HIGH VLN line voltage Iline = 1 mA Iline = 4 mA Iline = 15 mA Iline = 130 mA EXTERNAL SUPPLY (PIN ESI) VESI external voltage supply allowed on pin ESI voltage on pin ESI when supplied by a current source Ii(ESI) IESI(ext) input current on pin ESI external current supply allowed on pin ESI IESI = 140 mA except in power-down mode VESI = 3.5 V - - - - - 6.6 3.1 - 6 - - 140 V V mA mA 3.4 5.7 2.75 4.9 - - - - - - - - 3.7 - 3.7 6.1 3.0 5.3 18 45 60 30 11 9.5 1.55 2.35 4.0 8.7 4 6.5 3.25 5.7 - - - - - - - - 4.3 9.3 V V V V mA mA mV mV mA mA V V V V PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
1999 Apr 08
19
Philips Semiconductors
Product specification
Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer
SYMBOL PARAMETER CONDITIONS MIN. TYP.
TEA1097
MAX.
UNIT
SUPPLY FOR PERIPHERALS (PIN VDD) VDD regulated supply voltage on VDD VBB > 3.35 V + 0.25 V (typ.) otherwise VDD(T) regulated voltage variation with temperature referenced to 25 C current consumption on VDD Tamb = -25 to +75 C; VBB > 3.35 V + 0.25 V (typ.) in trickle mode; Iline = 0 mA; VDD = 1.5 V; VBB discharging VDD > 3.35 V IDD(o) VMICS IMICS VIL VIH Ii(pd) IBB(pd) current available for peripherals VDD = 3.35 V SUPPLY FOR MICROPHONE (PIN MICS) supply voltage for a microphone current available on MICS - - -0.4 1.8 - PD = LOW; AUXC = LOW - 2 - - - -3 460 - -1 +0.3 -6 - V mA 3.1 - - 3.35 3.6 V V mV
VBB - 0.25 - 30 -
IDD
-
15
150
nA
60 -
100 -
- -3
A mA
POWER-DOWN INPUT (PIN PD) LOW-level input voltage HIGH-level input voltage input current current consumption on VBB during power-down phase V A A VBB + 0.4 V
RINGER MODE (PINS PD, AUXC, HFRX AND LSAO) Ii(ESI) input current on pin ESI PD = LOW; AUXC = HIGH; VESI = 3.5 V PD = LOW; AUXC = HIGH; VESI = 3.5 V VHFRX = 20 mV (RMS); RGALS = 255 k - 3.1 - mA
Gv(HFRX-LSAO)
voltage gain from pin HFRX to LSAO
-
28
-
dB
Preamplifier inputs (pins MIC+, MIC-, IR, DTMF, TXIN, HFTX, HFRX, TXAUX and RAUX) Zi(MIC) input impedance differential between pins MIC+ and MIC- single-ended between pins MIC+/MIC- and GNDTX Zi(IR) Zi(DTMF) Zi(TXIN) input impedance between pins IR and LN input impedance between pins DTMF and GND input impedance between pins TXIN and GNDTX 20 - - - - - 70 35 20 20 20 - - - - - k k k k k
1999 Apr 08
Philips Semiconductors
Product specification
Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer
SYMBOL Zi(HFTX) Zi(HFRX) Zi(TXAUX) Zi(RAUX) PARAMETER input impedance between pins HFTX and GND input impedance between pins HFRX and GND input impedance between pins TXAUX and GND input impedance between pins RAUX and GND CONDITIONS MIN. - - - - 20 20 20 20 TYP. - - - -
TEA1097
MAX.
UNIT k k k k
TX amplifiers; see note 1 TX HANDSET MICROPHONE AMPLIFIER (PINS MIC+, MIC- AND LN) Gv(MIC-LN) Gv(f) Gv(T) CMRR THD voltage gain from pin MIC+/MIC- VMIC = 5 mV (RMS) to LN gain variation with frequency referenced to 1 kHz gain variation with temperature referenced to 25 C common mode rejection ratio total harmonic distortion at pin LN noise output voltage at pin LN; pins MIC+/MIC- shorted through 200 gain reduction if not activated VLN = 1.4 V (RMS) Iline = 4 mA; VLN = 0.12 V (RMS) psophometrically weighted (p53 curve) HFC = LOW; MUTT = LOW; MUTR = LOW; AUXC = LOW f = 300 to 3400 Hz Tamb = -25 to +75 C 43.3 - - - - - - 44.3 0.25 0.25 80 - - -77.5 45.3 - - - 2 10 - dB dB dB dB % % dBmp
Vno(LN)
Gv(mute)
60
80
-
dB
DTMF AMPLIFIER (PINS DTMF, LN AND RECO) Gv(DTMF-LN) Gv(f) Gv(T) Gv(mute) voltage gain from pin DTMF to LN gain variation with frequency referenced to 1 kHz gain variation with temperature referenced to 25 C gain reduction if not activated VDTMF = 50 mV (RMS) f = 300 to 3400 Hz Tamb = -25 to +75 C HFC = LOW; MUTT = HIGH; MUTR = HIGH; AUXC = LOW VDTMF = 50 mV (RMS) 24.35 25.35 - - 60 0.25 0.25 80 26.35 - - - dB dB dB dB
Gv(DTMF-RECO)
voltage gain from pin DTMF to RECO
-
-16.5
-
dB
1999 Apr 08
21
Philips Semiconductors
Product specification
Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer
SYMBOL PARAMETER CONDITIONS MIN. TYP.
TEA1097
MAX.
UNIT
TX AUXILIARY AMPLIFIER USING TXAUX (PINS TXAUX AND LN) Gv(TXAUX-LN) Gv(f) Gv(T) THD VTXAUX(rms) Vno(LN) voltage gain from pin TXAUX to LN gain variation with frequency referenced to 1 kHz gain variation with temperature referenced to 25 C total harmonic distortion at LN maximum input voltage at TXAUX (RMS value) noise output voltage at pin LN; pin TXAUX shorted to GND through 200 in series with 10 F gain reduction if not activated VTXAUX = 0.1 V (RMS) f = 300 to 3400 Hz Tamb = -25 to +75 C VLN = 1.4 V (RMS) Iline = 70 mA; THD = 2% psophometrically weighted (p53 curve) 11.5 - - - - - 12.5 0.25 0.25 - 1.2 -80.5 13.5 - - 2 - - dB dB dB % V dBmp
Gv(mute)
HFC = LOW; MUTT = LOW; MUTR = LOW; AUXC = LOW
60
80
-
dB
MICROPHONE MONITORING ON TXOUT (PINS MIC+, MIC- AND TXOUT) Gv(MIC-TXOUT) Gv(f) Gv(T) voltage gain from pin MIC+/MIC- VMIC = 2 mV (RMS) to TXOUT gain variation with frequency referenced to 1 kHz gain variation with temperature referenced to 25 C f = 300 to 3400 Hz Tamb = -25 to +75 C 48.3 - - 49.8 0.1 0.35 51.3 - - dB dB dB
RX amplifiers; see note 1 RX AMPLIFIERS USING IR (PINS IR AND RECO) Gv(IR-RECO) Gv(f) Gv(T) VIR(rms)(max) VRECO(rms)(max) Vno(RECO)(rms) voltage gain from pin IR (referenced to LN) to RECO gain variation with frequency referenced to 1 kHz gain variation with temperature referenced to 25 C maximum input voltage on IR (referenced to LN) (RMS value) maximum output voltage on pin RECO (RMS value) noise output voltage at pin RECO; pin IR is an open-circuit (RMS value) gain reduction if not activated VIR = 15 mV (RMS) f = 300 to 3400 Hz Tamb = -25 to +75 C Iline = 70 mA; THD = 2% THD = 2% psophometrically weighted (p53 curve) HFC = LOW; MUTT = LOW; MUTR = LOW; AUXC = LOW 28.7 - - - 0.75 - 29.7 0.25 0.3 50 0.9 -88 30.7 - - - - - dB dB dB mV V dBVp
Gv(mute)
60
80
-
dB
1999 Apr 08
22
Philips Semiconductors
Product specification
Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer
SYMBOL Gv(RECO-QR) VQR(rms)(max) Vno(QR)(rms) PARAMETER CONDITIONS MIN. -3 sine wave drive; RL = 150 ; THD < 2% Gv(QR) = 0 dB; psophometrically weighted (p53 curve) 0.75 - - 0.9 -88 TYP.
TEA1097
MAX.
UNIT
RX EARPIECE AMPLIFIER (PINS GARX AND QR) gain voltage range between pins RECO and QR maximum output voltage on pin QR (RMS value) noise output voltage at pin QR; pin IR is an open-circuit (RMS value) +15 - - dB V dBVp
RX AMPLIFIER USING RAUX (PINS RAUX AND RECO) Gv(RAUX-RECO) Gv(f) Gv(T) VRAUX(rms)(max) Vno(RECO)(rms) voltage gain from pin RAUX to RECO gain variation with frequency referenced to 1 kHz gain variation with temperature referenced to 25 C VRAUX = 0.4 V (RMS) f = 300 to 3400 Hz Tamb = -25 to +75 C -3.7 - - - - -2.4 0.25 0.25 0.95 -100 -1.1 - - - - dB dB dB V dBVp
maximum input voltage on RAUX THD = 2% (RMS value) noise output voltage at pin RECO; pin RAUX shorted to GND through 200 in series with 10 F (RMS value) gain reduction if not activated psophometrically weighted (p53 curve)
Gv(mute)
HFC = LOW; MUTT = LOW; MUTR = LOW; AUXC = LOW
60
80
-
dB
Auxiliary amplifiers using AUXO; see note 1 TX AUXILIARY AMPLIFIER USING MIC+ AND MIC- (PINS MIC+, MIC- AND AUXO) Gv(MIC-AUXO) Gv(f) Gv(T) VMIC(rms) Vno(AUXO)(rms) voltage gain from pin MIC+/MIC- VMIC = 10 mV (RMS) to AUXO gain variation with frequency referenced to 1 kHz gain variation with temperature referenced to 25 C maximum input voltage on MIC+/MIC- (RMS value) noise output voltage at pin AUXO; pins MIC+/MIC- shorted to GNDTX through 200 in series with 10 F (RMS value) f = 300 to 3400 Hz Tamb = -25 to +75 C THD = 2% psophometrically weighted (p53 curve) 24.2 - - - - 25.5 0.1 0.3 16 -91 26.8 - - - - dB dB dB mV dBVp
1999 Apr 08
23
Philips Semiconductors
Product specification
Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer
SYMBOL PARAMETER CONDITIONS MIN. TYP.
TEA1097
MAX.
UNIT
TX AUXILIARY AMPLIFIER USING HFTX (PINS HFTX AND AUXO) Gv(HFTX-AUXO) Gv(f) Gv(T) VAUXO(rms) Vno(AUXO)(rms) voltage gain from pin HFTX to AUXO gain variation with frequency referenced to 1 kHz gain variation with temperature referenced to 25 C maximum output voltage on pin AUXO (RMS value) noise output voltage at pin AUXO; pin HFTX shorted to GND through 200 in series with 10 F (RMS value) gain reduction if not activated VHFTX = 100 mV (RMS) f = 300 to 3400 Hz Tamb = -25 to +75 C THD = 2% psophometrically weighted (p53 curve) 14.2 - - 0.8 - 15.2 0.1 0.1 0.9 -91.5 16.2 - - - - dB dB dB V dBVp
Gv(mute)
HFC = LOW; MUTT = LOW; MUTR = HIGH; AUXC = LOW
60
80
-
dB
RX AMPLIFIER USING IR (PINS IR AND AUXO) Gv(IR-AUXO) Gv(f) Gv(T) VAUXO(rms) Vno(AUXO)(rms) voltage gain from pin IR (referenced to LN) to AUXO gain variation with frequency referenced to 1 kHz gain variation with temperature referenced to 25 C maximum output voltage on AUXO (RMS value) noise output voltage at pin AUXO; pin IR is an open-circuit (RMS value) gain reduction if not activated VIR = 3 mV (RMS) f = 300 to 3400 Hz Tamb = -25 to +75 C THD = 2% psophometrically weighted (p53 curve) HFC = HIGH; MUTT = LOW; MUTR = HIGH; AUXC = HIGH 31.6 - - 0.8 - 32.8 0.1 0.3 0.9 -85 34 - - - - dB dB dB V dBVp
Gv(mute)
60
80
-
dB
Automatic Gain Control (pin AGC) Gv(trx) gain control range for transmit and receive amplifiers affected by the AGC; with respect to Iline = 15 mA highest line current for maximum gain lowest line current for maximum gain Iline = 70 mA; on Gv(MIC-LN), Gv(IR-RECO) and Gv(IR-AUXO) Iline = 70 mA; Gv(TXAUX-LN) 5.45 6.45 7.45 dB
5.8 - -
6.8 23 57
7.8 - -
dB mA mA
Istart Istop
1999 Apr 08
24
Philips Semiconductors
Product specification
Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer
SYMBOL PARAMETER CONDITIONS MIN. -0.4 1.8 - - - - 3 -2.5 TYP.
TEA1097
MAX.
UNIT
Logic inputs (pins HFC, AUXC, MUTT and MUTR) VIL VIH Ii LOW-level input voltage HIGH-level input voltage input current for pins HFC and AUXC for pins MUTT and MUTR Base microphone amplifier (pins TXIN, TXOUT and GATX); see note 1 Gv(TXIN-TXOUT) Gv Gv(f) Gv(T) Vno(TXOUT)(rms) voltage gain from pin TXIN to TXOUT voltage gain adjustment with RGATX gain variation with frequency referenced to 1 kHz gain variation with temperature referenced to 25 C noise output voltage at pin TXOUT; pin TXIN is shorted through 200 in series with 10 F to GNDTX (RMS value) gain reduction if not activated f = 300 to 3400 Hz Tamb = -25 to +75 C psophometrically weighted (p53 curve) VTXIN = 3 mV (RMS); RGATX = 30.1 k 13.15 14.85 -15 - - - - 0.1 0.15 -101 16.55 +16 - - - dB dB dB dB dBVp 6 -6 A A +0.3 V VBB + 0.4 V
Gv(mute)
HFC = HIGH; MUTT = LOW; MUTR = LOW; AUXC = LOW
60
80
-
dB
Loudspeaker amplifier (pins HFRX, LSAO, GALS and VOL); see note 1 Gv(HFRX-LSAO) Gv Gv(f) Gv(T) Gv(vol) voltage gain from pin HFRX to LSAO voltage gain adjustment with RGALS gain variation with frequency referenced to 1 kHz gain variation with temperature referenced to 25 C voltage gain variation related to RVOL = 1.9 k Iline = 70 mA; RGALS = 33 k; for 2% THD in the input stage psophometrically weighted (p53 curve) IBB = 0 mA; IDD = 1 mA Iline = 18 mA Iline = 30 mA Iline > 50 mA 1999 Apr 08 25 - - - 0.9 1.2 1.6 - - - V V V f = 300 to 3400 Hz Tamb = -25 to +75 C VHFRX = 20 mV (RMS); RGALS = 255 k 25.5 -28 - - - - 28 - 0.3 0.3 -3 580 30.5 +7 - - - - dB dB dB dB dB mV
V(HFRX)(rms)(max) maximum input voltage at pin HFRX (RMS value) Vno(LSAO)(rms) noise output voltage at pin LSAO; pin HFRX is open-circuit (RMS value) output voltage (RMS value) without external supply on pin ESI
-
-79
-
dBVp
VLSAO(rms)
Philips Semiconductors
Product specification
Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer
SYMBOL ILSAO(max) PARAMETER maximum output current at pin LSAO (peak value) CONDITIONS external supply on ESI MIN. 150 TYP. 300 -
TEA1097
MAX.
UNIT mA
Dynamic limiter (pins LSAO and DLC); see note 1 tatt attack time when VHFRX jumps from - 20 mV to 20 mV + 10 dB when VBB jumps below VBB(th) trel THD VBB(th) VDLC(th) release time total harmonic distortion at VHFRX = 20 mV + 10 dB VBB limiter threshold threshold voltage required on pin DLC to obtain mute receive condition threshold current sourced by pin DLC in mute receive condition voltage gain reduction in mute receive condition VDLC = 0.2 V VDLC = 0.2 V - - 1 100 0.1 2.7 - 5 - - 2 - ms ms ms % V
when VHFRX jumps from - 20 mV + 10 dB to 20 mV t > tatt - - -0.4
Mute Loudspeaker (pin DLC); see note 1 +0.2 V
IDLC(th) Gvrx(mute) Note
- 60
100 80
- -
A dB
1. When the channel is enabled according to Table 1.
1999 Apr 08
26
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ok, full pagewidth
1999 Apr 08 27
TEST AND APPLICATION INFORMATION
Philips Semiconductors
Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer
external supply
Zexch 600
i = 15 mA J_line Dz Vd 10 V Cemc 10 nF
Zimp 620
VIR
RSLPE 20
CREG 4.7 F DESI AGC 22 (18) LN ESI 12 (9) CVBB 470 F VBB 13 (10) 47 F VDD 23 (19) 40 PD (38) 39 HFC (37) AUXC 3 (41) MUTT 1 (39) MUTR 2 (40) CAUXO 10 F AUXO 6 (44) QR CGAR 100 pF Re1 100 k CRXE 37 (35) 7 (1) RECO 100 nF CHFRX 100 nF VHFRX GALS RGALS LSAO 255 k CGALS 150 pF CGALS 220 F RLSAO 8 Re2 100 k CGARS 1 nF RQR 150 CQR 4.7 F from controller CVDD
SLPE CIR 100 nF CMICS 4.7 F MICS MIC+ VMIC RMIC 200 MIC- CHFTX 100 nF TXOUT CGATX 100 pF RGATX 30.1 k GATX 24 (20) 33 (31) 18 (14) 21 (17)
REG 20 (16)
100 F
Cexch
100 F
Cimp
IR
19 (15)
RAUXO 10 k
32 (30) 38 (36)
HFTX
35 (33)
28 (26)
TEA1097
36 (34)
GARX
29 (27) 30 (28)
CTXIN VHFTX 100 nF CDTMF VTXIN 100 nF CTXAUX VDTMF 100 nF CRAUX VTXAUX 100 nF
TXIN
HFRX
DTMF
34 (32) 14 (11)
TXAUX
5 (43) 4 (42) 17 (13) GND
RAUX
16 (12) 31 (29) 25 (21) 27 (23) VOL RVOL 0 to 22 k 11 (8) DLC CDLC 470 nF
GNDTX STAB RSTAB 3.65 k
VRAUX
Product specification
FCA001
TEA1097
The pin numbers given in parenthesis refer to the TEA1097H.
Fig.11 Test circuit.
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Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer
handbook, full pagewidth
Rbal2 820 Rbal1 130
Cbal 220 nF RSLPE 20 Rast3 392 SLPE 18 (14) REG 20 (16) AGC 22 (18) CREG 4.7 F
external supply
Zimp 620 Dz Vd 10 V Cemc 10 nF Cimp 22 F D2 D3
DESI LN ESI 12 (9)
Rast2 3.92 k
CVBB 470 F VBB 13 (10)
CVDD 47 F VDD 23 (19)
CIR 100 nF
IR
21 (17)
19 (15)
40 PD (38) 39 HFC (37) 3 AUXC (41) 1 MUTT (39) 2 MUTR (40) C AUXO AUXO 100 nF to digital answering machine or digital handsfree CQR 4.7 F CGAR 100 pF Re2 100 k CGARS 1 nF CRXE 37 (35) 7 (1) RECO 100 nF
Rast1 130 k
from controller
CMICS 10 F MICS RMICP 1 k handset microphone Cmich 33 nF Ctx2 22 nF Ctx1 22 nF Rtx2 15 k Rtx1 15 k Rtx3 8.2 k MIC+ 33 (31) MICS 24 (20)
6 (44)
32 MIC- (30)
RMICM 1 k
35 (33)
QR
CHFTX A 100 nF B to digital handsfree from MICS Rbmics 2 k base microphone Cmicb 22 nF CTXIN 100 nF CDTMF 100 nF from digital answering machine or digital handsfree D1 D4 from digital answering machine CTXAUX 100 nF CRAUX 100 nF
TEA1097
HFTX TXOUT 38 (36) 28 (26) 29 (27) 30 (28)
36 (34)
GARX
Re1 100 k
RGATX 30.1 k GATX
HFRX
TXIN
from digital handsfree
DTMF
34 (32) 5 (43)
14 (11)
GALS RGALS 255 k LSAO CGALS 150 pF CLSAO 220 F
TXAUX
16 (12)
RAUX
4 (42) 17 (13) GND
31 (29)
25 (21)
27 (23) VOL RVOL 0 to 22 k
11 (8) DLC
MGL396
GNDTX STAB RSTAB 3.65 k
Product specification
CDLC 470 nF
TEA1097
The pin numbers given in parenthesis refer to the TEA1097H.
Fig.12 Basic application diagram.
Philips Semiconductors
Product specification
Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer
PACKAGE OUTLINES VSO40: plastic very small outline package; 40 leads
TEA1097
SOT158-1
D
E
A X
c y HE vMA
Z 40 21
Q A2 A1 pin 1 index Lp L 1 e bp 20 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.70 0.11 A1 0.3 0.1 A2 2.45 2.25 A3 0.25 bp 0.42 0.30 c 0.22 0.14 D (1) 15.6 15.2 E (2) 7.6 7.5 0.30 0.29 e 0.762 0.03 HE 12.3 11.8 0.48 0.46 L 2.25 Lp 1.7 1.5 Q 1.15 1.05 v 0.2 w 0.1 y 0.1 Z (1) 0.6 0.3
0.012 0.096 0.017 0.0087 0.61 0.010 0.004 0.089 0.012 0.0055 0.60
0.067 0.089 0.059
0.045 0.024 0.008 0.004 0.004 0.041 0.012
7o 0o
Notes 1. Plastic or metal protrusions of 0.4 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT158-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-01-24
1999 Apr 08
29
Philips Semiconductors
Product specification
Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer
TEA1097
QFP44: plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm
SOT307-2
c
y X
A 33 34 23 22 ZE
e E HE wM bp pin 1 index 44 1 bp D HD wM 11 ZD B vM B vMA 12 detail X A A2 (A 3) Lp L
A1
e
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2.10 A1 0.25 0.05 A2 1.85 1.65 A3 0.25 bp 0.40 0.20 c 0.25 0.14 D (1) 10.1 9.9 E (1) 10.1 9.9 e 0.8 HD 12.9 12.3 HE 12.9 12.3 L 1.3 Lp 0.95 0.55 v 0.15 w 0.15 y 0.1 Z D (1) Z E (1) 1.2 0.8 1.2 0.8 10 0o
o
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT307-2 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-02-04 97-08-01
1999 Apr 08
30
Philips Semiconductors
Product specification
Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed.
TEA1097
If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1999 Apr 08
31
Philips Semiconductors
Product specification
Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer
Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE BGA, SQFP PLCC(3), SO, SOJ not suitable suitable(2) suitable not recommended(3)(4) not recommended(5) suitable suitable suitable suitable suitable HLQFP, HSQFP, HSOP, HTSSOP, SMS not LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes
TEA1097
REFLOW(1)
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
1999 Apr 08
32
Philips Semiconductors
Product specification
Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer
NOTES
TEA1097
1999 Apr 08
33
Philips Semiconductors
Product specification
Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer
NOTES
TEA1097
1999 Apr 08
34
Philips Semiconductors
Product specification
Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer
NOTES
TEA1097
1999 Apr 08
35
Philips Semiconductors - a worldwide company
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For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1999
Internet: http://www.semiconductors.philips.com
SCA63
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
465002/750/03/pp36
Date of release: 1999 Apr 08
Document order number:
9397 750 05008

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