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DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
PC2795GV
GENERAL PURPOSE L-BAND DOWN CONVERTER
DESCRIPTION
The PC2795GV is Silicon monolithic IC designed for L-band down converter. The package is 8-pin SSOP suitable for high-density surface mount. This IC consists of double balanced mixer, local oscillator, local oscillation buffer amplifier, IF buffer amplifier, and voltage regulator.
FEATURES
* * * * Wide band operation Supply voltage Low distortion fRF = 0.95 to 2.15 GHz 5V IM3 = 55 dBc
Packaged in 8-pin SSOP suitable for high-density mounting
ORDERING INFORMATION
PART NUMBER PACKAGE 8-pin plastic SSOP (175 mil) PACKAGE STYLE Embossed tape 8 mm wide. 1 k/REEL Pin 1 indicates pull-out direction of tape
PC2795GV-E1
For evaluation sample order, please contact your local NEC office. (Part number for sample order: PC2795GV)
INTERNAL BLOCK DIAGRAM
8 7 6 5
PIN CONFIGURATION (Top View)
1 OSC Buffer OSC REG1 IF Buffer REG2 2 3 4
8 7 6 5
1. RF input 2. GND 3. Vcc 4. IF out 5. OSC Base 2 6. OSC Collector 1 7. OSC Collector 2 8. OSC Base 1
MIX
1
2
3
4
Caution: Electro-static sensitive devices
The information in this document is subject to change without notice.
Document No. P11734EJ2V0DS00 (2nd edition) Date Published June 1998 N CP(K) Printed in Japan
(c)
1996
PC2795GV
PIN EXPLANATIONS
Pin NO. 1 RF IN Pin Volt (V, TYP.) 2.1
Symbol
Explanation RF signal input pin. Double balanced mixer with Tr.1 and Tr. 2.
Equivalent Circuit
Vcc
IF Lo Buffer
2
GND
0.0
Ground pin.
1
3
VCC
5.0
Power supply pin.
4
IF OUT
2.3
IF output pin. This pin is assigned for the emitter follower output with low impedance.
Vcc
4
5
OSC Base 2
2.8
Base pin of oscillator with balanced amplifier. Connected to LC resonator through cuppling capacitor.
6
OSC Collector 1
5.0
Collector pin of oscillator with balanced amplifier. Assemble LC resonator with 5 pin through capacitor to oscillate with active feedback loop. Loads should be connected to this pin.
8
6
7
5
7
OSC Collector 2
5.0
Collector pin of oscillator with balanced amplifier. Assemble LC resonator with 8 pin through capacitor to oscillate with active feedback loop. Loads should be connected to this pin.
8
OSC Base 1
2.8
Base pin of oscillator with balanced amplifier. Connected to LC resonator through cuppling capacitor.
2
PC2795GV
ABSOLUTE MAXIMUM RATINGS (TA = 25 C, unless otherwise specified)
PARAMETER Supply Voltage Power Dissipation Operating Ambient Temperature Storage Temperature SYMBOL VCC PD TA Tstg TA = 85 C
*1
TEST CONDITION
RATINGS 6.0 250 -40 to +85 -55 to +150
UNIT V mW C C
*1 Mounted on 50 x 50 x 1.6 mm double epoxy glass board. RECOMMENDED OPERATING RANGE
PARAMETER Supply Voltage Operating Ambient Temperature SYMBOL VCC TA MIN. 4.5 -40 TYP. 5.0 +25 MAX. 5.5 +85 UNIT V C
ELECTRICAL CHARACTERISTICS (TA = 25 C, VCC = 5 V; *1)
PARAMETER Circuit Current Lower Input Frequency Upper Input Frequency Conversion Gain 1 SYMBOL ICC fRF1 fRF2 CG1 MIN. 25.5 2.15 8.0 TYP. 35.0 11.0 MAX. 48.0 0.95 14.0 UNIT mA GHZ GHZ dB fRF = 950 MHz, PRF = -30 dBm, fIF = 402 MHz, POSC = -10dBm Conversion Gain 2 CG2 6.5 9.5 12.5 dB fRF = 2.15 GHz, PRF = -30 dBm, fIF = 402 MHz, POSC = -10 dBm Noise Figure 1 NF1 13.5 16.0 dB fRF = 950 MHz, fIF = 402 MHz, POSC = -10 dBm Noise Figure 2 NF2 14.0 16.5 dB fRF = 2.15 GHz, fIF = 402 MHz, POSC = -10 dBm Maximum Output Power 1 PO(sat) 1 2.0 5.0 dBm fRF = 950 MHz, PRF = 0 dBm, fIF = 402 MHz, POSC = -10 dBm Maximum Output Power 2 PO(sat) 2 0.0 3.5 dBm fRF = 2.15 GHz, PRF = 0 dBm, fIF = 402 MHz, POSC = -10 dBm TEST CONDITIONS no input signal
*1 By measurement circuit. STANDARD CHARACTERISTICS (TA = 25 C, VCC = 5 V; *1)
PARAMETER 3rd Order Intermodulation Distortion 1 3rd Order Intermodulation Distortion 2 Oscillator Frequency fosc 1.35 2.65 GHZ IM32 55 dBc SYMBOL IM31 MIN. TYP. 55 MAX. UNIT dBc TEST CONDITIONS fRF = 950, 980 MHz, PRF = -25 dBm, fOSC = 1430 MHz, POSC = -10 dBm fRF = 2.15, 2.18 GHz, PRF = -25 dBm, fOSC = 2.63 GHz, POSC = -10 dBm
*1 By measurement circuit.
3
PC2795GV
TYPICAL CHARACTERISTICS
fRF vs. CG 16 14
CG - Conversion Gain - dB
fRF vs. CG 16 14
CG - Conversion Gain - dB
12 10 8 6 4 2 0
VCC = 5 V fIF = 402 MHZ PRF = -30 dBm POSC = -10 dBm
12 10 8 6 4 2 0
TA = -40 C TA = 25 C
TA = 25 C TA = -40 C TA = 85 C
TA = 85 C
VCC = 5 V fIF = 480 MHZ PRF = -30 dBm POSC = -10 dBm
0.8
2.0 1.2 1.6 fRF - Input Frequency - GHz
2.4
0.8
2.0 1.2 1.6 fRF - Input Frequency - GHz
2.4
20 18
fRF vs. NF 16 14
CG - Conversion Gain - dB
fIF vs. CG
16
NF - Noise Figure - dB
TA = -40 C
14 12 10 8 6 4 2 0 0.8
VCC = 5 V fIF = 402 MHZ POSC = -10 dBm
12 10 TA = 25 C 8 TA =-40 C 6 4 2 0
VCC = 5 V fRF = 2.15 GHZ PRF = -30 dBm POSC = -10 dBm
TA = 85 C
TA = 25 C
TA = 85 C
2.0 1.2 1.6 fRF - Input Frequency - GHz
2.4
600 300 400 500 fIF - Intermediate Frequency - MHz
POSC vs. POUT -10 50
VCC vs. ICC
Pout - Output Power - dBm
fRF = 950 MHZ fRF = 2.15 GHZ
ICC - Circuit Current - mA
40
-20
TA = 25 C
30 TA = 85 C TA = -40 C 10
-30
20
-40
VCC = 5 V PRF = -30 dBm fIF = 480 MHZ TA = 25 C
-50 -40
0 0 1 4 3 2 VCC - Supply Voltage - V 5 6
0 -10 -30 -20 POSC - Oscillator Input Power - dBm
10
4
PC2795GV
STANDARD CHARACTERISTICS
Pin vs. Pout 20 10
Pout - Output Power - dBm
Pin vs. Pout 20 10 0 950 + 980 MHz
Pout - Output Power - dBm
950 MHZ
2.15 GHZ
0 -10 -20 -30 -40 -50 -60 -70 -80 -40 -30 -20 -10
VCC = 5 V fRF1 = 950 MHZ fRF2 = 980 MHZ fOSC = 1430 MHZ POSC = -10 dBm fIF = 480 MHZ TA = 25 C
-10 -20 -30 -40 -50 -60 -70
2.15 + 2.18 GHz
0
10
-80 -40
VCC = 5 V fRF1 = 2.15 GHZ fRF2 = 2.18 GHZ fOSC = 2.63 GHZ POSC = -10 dBm fIF = 480 MHZ TA = 25 C
-30
-20
-10
0
10
Pin - Input Power - dBm
Pin - Input Power - dBm
Pin vs. Pout 20 10 0
Pout - Output Power - dBm
Pin vs. Pout 20 950 MHZ 10
Pout - Output Power - dBm
2.15 GHZ
0 -10 -20 -30 -40 -50 -60 -70
VCC = 5 V fRF1 = 2.15 GHZ fRF2 = 2.18 GHZ fOSC = 2.63 GHZ POSC = -10 dBm fIF = 480 MHZ TA = -40 C
-10 -20 -30 -40 -50 -60 -70 -80 -40 -30 -20
950 + 980 MHz
2.15 + 2.18 GHz
VCC = 5 V fRF1 = 950 MHZ fRF2 = 980 MHZ fOSC = 1430 MHZ POSC = -10 dBm fIF = 480 MHZ TA = -40 C
-10
0
10
-80 -40
-30
-20
-10
0
10
Pin - Input Power - dBm
Pin - Input Power - dBm
Pin vs. Pout 20 10 0
Pout - Output Power - dBm
Pin vs. Pout 20 950 MHZ 10
Pout - Output Power - dBm
2.15 GHZ
0 -10 -20 -30 -40 -50 -60 -70
VCC = 5 V fRF1 = 2.15 GHZ fRF2 = 2.18 GHZ fOSC = 2.63 GHZ POSC = -10 dBm fIF = 480 MHZ TA = 85 C
-10 -20 -30 -40 -50 -60 -70 -80 -40 -30 -20
950 + 980 MHz
2.15 + 2.18 GHz
VCC = 5 V fRF1 = 950 MHZ fRF2 = 980 MHZ fOSC = 1430 MHZ POSC = -10 dBm fIF = 480 MHZ TA = 85 C
-10
0
10
-80 -40
-30
-20
-10
0
10
Pin - Input Power - dBm
Pin - Input Power - dBm
5
PC2795GV
STANDARD CHARACTERISTICS (VCC = 5 V, TA = 25 C)
OSC Frequency Range* 0 RL 0 dBm 5 dB/ 2.704 GHZ RF Input Impedance (@1 pin)
-10
-20 1.349 G A* -30 2.720 G
-40
1 2
CENTER 2.000 GHZ RBW 1.0 MHZ VBW 1.0 MHZ *1 Measured at IF output pin (4 pin)
SPAN 1.600 GHZ SWP 50 ms START 900 MHZ STOP MARKER 3 GHZ Re [] Im [] -152 (1.10 pF) -54.9 (1.35 pF)
1 : 950 MHZ 41.5 2 : 2150 MHZ 11.2
OSC Input Impedance (@8 pin)
IF Output Impedance
2
2
1
1 START 900 MHz STOP 3 GHz MARKER Re [] Im [] 1 : 1350 MHz 9.22 -36.1 (3.27 pF) 26.9 (1.63 nH) 2 : 2630 MHz 31.5 START 300 MHz STOP 600 MHz MARKER Re [] Im [] 1 : 402.8 MHz 9.48 11.2 (9.40 nH) 2 : 479.5 MHz 10.4 13.4 (4.46 nH)
6
PC2795GV
MEASUREMENT CIRCUIT
OSC IN VCC
0.1 F 1 F 100 pF 150 150 100 pF
8
7
6
5
OSC Buffer
OSC
REG1 IF Buffer
REG2
MIX 1 2 3 4
100 pF
1000 pF
1 F
1000 pF
0.1 F RF IN VCC IF OUT
7
PC2795GV
APPLICATION CIRCUIT EXAMPLE
VCC
Vtune
0.1 F
12 k
L : 7 mm 0.1 F
1000 pF 150 HVU316 12 k 2 pF 3 pF 4 pF 3 pF 2 pF 8 7 6 5 150 1000 pF HVU316 12 k
OSC Buffer
OSC
REG1 IF Buffer
REG2
MIX 1 2 3 4
100 pF
1000 pF
1 F
1000 pF
0.1 F RF IN VCC IF OUT
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
8
PC2795GV
Illustration of the application circuit assembled on evaluation board
RF in
Lo in
C7
C4 C5 C6 VCC
Vtune
VCC
C4 IF out
UPC2795GV
R2 C2 C3
CV1 R2 R11 C4 C5 Vtu
C1 C3 C2
R11
R2 CV2
L
VCC
Cv1 = CV2 : HVU316 C1 : 4 pF C2 : 2 pF C3 : 3 pF C4 : 1000 pF
C5 : 0.1 F C6 : 1 F C7 : 100 pF R1 : 150 R2 : 12 k
shows short circuited strip for ground shows cutout
9
PC2795GV
PACKAGE DIMENSIONS
8 PIN PLASTIC SSOP (unit : mm)
8 5
detail of lead end
1
4 4.940.2 3.0 MAX. 3.20.1 0.870.2
1.8 MAX.
1.50.1
0.15 -0.05
+0.10
0.65 0.10.1 0.575 MAX. 0.3 +0.10 -0.05
0.50.2 0.10 M 0.15
10
3 - 3
+ 7
PC2795GV
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation). (3) Keep the track length of the ground pins as short as possible. (4) A low pass filter must be attached to VCC line. (5) A matching circuit must be externally attached to output port.
RECOMMENDED SOLDERING CONDITIONS
The following conditions (see table below) must be met when soldering this product. Please consult with our sales officers in case other soldering process is used or in case soldering is done under different conditions. For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
PC2795GV
Soldering process Infrared ray reflow Soldering conditions Peak package's surface temperature: 235 C or below, Reflow time: 30 seconds or below (210 C or higher), Number of reflow process: 3, Exposure limit VPS
Note
Symbol IR35-00-3
: None VP15-00-3
Peak package's surface temperature: 215 C or below, Reflow time: 40 seconds or below (200 C or higher), Number of reflow process: 3, Exposure limit
Note
: None WS60-00-1
Wave soldering
Solder temperature: 260C or below, Reflow time: 10 seconds or below, Number of reflow process: 1, Exposure limit
Note
: None
Partial heating method
Terminal temperature: 300 C or below, Flow time: 3 seconds or below, Note Exposure limit : None
Note Exposure limit before soldering after dry-pack package is opened. Storage conditions: 25 C and relative humidity at 65 % or less. Caution Do not apply more than single process at once, except for "Partial heating method".
11
PC2795GV
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation.
No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product.
M4 96. 5

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