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TSA5514 1.3 GHz bidirectional I2C-bus controlled synthesizer
Product specification File under Integrated Circuits, IC02 October 1992
Philips Semiconductors
Product specification
1.3 GHz bidirectional I2C-bus controlled synthesizer
FEATURES * Complete 1.3 GHz single chip system * Low power 5 V, 35 mA * I2C-bus programming DESCRIPTION * In-lock flag * Varicap drive disable * Low radiation * Address selection for Picture-In-Picture (PIP), DBS tuner (4 addresses) * 5-level analog-to-digital converter * 7 bus controlled ports; 3 output, 4 open collector input/output * Power-down flag APPLICATIONS * TV tuners * VCR Tuners
TSA5514
The TSA5514 is a single chip PLL frequency synthesizer designed for TV tuning systems. Control data is entered via the I2C-bus; five serial bytes are required to address the device, select the oscillator frequency, programme the seven output ports and set the charge-pump current. Four of these ports can also be used as input ports (three general purpose I/O ports, one ADC). Digital information concerning those ports can be read out of the TSA5514 on the SDA line (one status byte) during a READ operation. A flag is set when the loop is "in-lock" and is read during a READ operation. The device has 4 programmable addresses, programmed by applying a specific voltage to AS pin. The phase comparator operates at 7.8125 kHz when a 4 MHz crystal is used.
QUICK REFERENCE DATA SYMBOL Vcc Icc fr VI supply voltage supply current frequency range input voltage level 80 MHz to 150 MHz 150 MHz to 1 GHz 1 GHz to 1.3 GHz fxtal Io Tamb Tstg crystal oscillator frequency open-collector output current operating ambient temperature range IC storage temperature range 12 9 40 3.2 10 -10 -40 - - - 4.0 - - - 300 300 300 4.48 - +80 +150 mV mV mV MHz mA C C PARAMETER - - 64 MIN. 5 35 - TYP. - - 1300 MAX. V mA MHz UNIT
ORDERING INFORMATION EXTENDED TYPE NUMBER TSA5514 TSA5514T TSA5514AT Note 1. SOT102-1; 1996 December 4. 2. SOT109-1; 1996 December 4. 3. SOT 163-1; 1996 December 4. October 1992 2 PACKAGE PINS 18 16 20 PIN POSITION DIL SO SO MATERIAL plastic plastic plastic CODE SOT102(1) SOT109A(2) SOT163A(3)
Philips Semiconductors
Product specification
1.3 GHz bidirectional I2C-bus controlled synthesizer
TSA5514
October 1992
3
Fig.1 Block diagram.
Philips Semiconductors
Product specification
1.3 GHz bidirectional I2C-bus controlled synthesizer
TSA5514
Fig.2 Pin configuration for SOT102.
Fig.3 Pin configuration for SOT109.
Fig.4 Pin configuration for SOT163.
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Philips Semiconductors
Product specification
1.3 GHz bidirectional I2C-bus controlled synthesizer
PINNING PIN SYMBOL SOT102 SOT109 SOT163 PD Q1 Q2 n.c. SDA SCL P7 n.c. P6 P5 P4 AS P2 P1 P0 Vcc RFIN1 RFIN2 VEE UD 1 2 3 - 4 5 6 - 7 8 9 10 11 12 13 14 15 16 17 18 1 2 3 - 4 5 6 - 7 8 9 10 11 - - 12 13 14 15 16 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 charge-pump output crystal oscillator input 1 crystal oscillator reference voltage not connected serial data input/output serial clock input port output/input (general purpose) not connected port output/input for general purpose ADC port output/input (general purpose) port output/input (general purpose) address selection input port output port output port output voltage supply UHF/VHF signal input 1 UHF/VHF signal input 2 (decoupled) ground drive output DESCRIPTION
TSA5514
October 1992
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Philips Semiconductors
Product specification
1.3 GHz bidirectional I2C-bus controlled synthesizer
FUNCTIONAL DESCRIPTION The TSA5514 is controlled via the two-wire For programming, there is one module address (7 bits) and the R/W bit for selecting READ or WRITE mode. WRITE mode: R/W = 0 (see Table 1) After the address transmission (first byte), data bytes can be sent to the device. Four data bytes are required to fully program the TSA5514. The bus transceiver has an auto-increment facility which permits the programming of the TSA5514 within one single transmission (address + 4 data bytes). The TSA5514 can also be partially programmed on the condition that the first data byte following the address is Table 1 Write data format MSB Address Programmable divider Programmable divider Charge-pump and test bits Output ports control bits Note to Table 1 * MA1, MA0 A N14 to N0 N = N14 x 214 + N13 x 213 +... + N1 x 21 +N0 CP CP = 0 CP = 1 P7 to P0 = 1 P7 to P0 = 0 T1, T0, OS = 0 0 0 T1 = 1 T0 = 1 OS = 1 Note 1. x = don't care charge-pump current 50 A 220 A open-collector output is active outputs are in high impedance state normal operation P6 = fref, P7 = fDIV 3-state charge-pump Not valid for TSA5514T programmable address bits (see Table 4) acknowledge bit programmable divider bits 1 0 N7 1 P7 1 N14 N6 CP P6 0 N13 N5 T1 P5 0 N12 N4 T0 P4 0 N11 N3 x x MA1 N10 N2 x P2 MA0 N9 N1 x P1* LSB 0 N8 N0 OS P0* I2C-bus.
TSA5514
byte 2 or byte 4. The meaning of the bits in the data bytes is given in Table 1. The first bit of the first data byte transmitted indicates whether frequency data (first bit = 0) or charge pump and port information (first bit = 1) will follow. Until an I2C-bus STOP condition is sent by the controller, additional data bytes can be entered without the need to re-address the device. This allows a smooth frequency sweep for fine tuning or AFC purpose. At power-on the ports are set to the high impedance state. The 7.8125 kHz reference frequency is obtained by dividing the output of the 4 MHz crystal oscillator by 512. Because the input of UHF/VHF signal is first divided by 8 the step size is 62.5 kHz. A 3.2 MHz crystal can offer step sizes of 50 kHz.
A A A A A
byte 1 byte 2 byte 3 byte 4 byte 5
operational amplifier output is switched off (varicap drive disable)
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Philips Semiconductors
Product specification
1.3 GHz bidirectional I2C-bus controlled synthesizer
READ mode: R/W = 1 (see Table 2) Data can be read out of the TSA5514 by setting the R/W bit to 1. After the slave address has been recognized, the TSA5514 generates an acknowledge pulse and the first data byte (status word) is transferred on the SDA line (MSB first). Data is valid on the SDA line during a high position of the SCL clock signal. A second data byte can be read out of the TSA5514 if the processor generates an acknowledge on the SDA line. End of transmission will occur if no acknowledge from the processor occurs. The TSA5514 will then release the data line to allow the processor to generate a STOP condition. When ports P4 to P7 are used as inputs, they must be programmed in their high-impedance state. The POR flag (power-on reset) is set to 1 when Vcc goes Table 2 Read data format MSB Address Status byte POR FL I2, I1, I0 A2, A1, A0 MSB is transmitted first. Address selection 1 POR 1 FL 0 I2 0 I1 0 I0 MA1 A2 MA0 A1 LSB 1 A0 A -
TSA5514
below 3 V and at power-on. It is reset when an end of data is detected by the TSA5514 (end of a READ sequence). Control of the loop is made possible with the in-lock flag FL which indicates (FL = 1) when the loop is phase-locked. The bits I2, I1 and I0 represent the status of the I/O ports P7, P5 and P4 respectively. A logic 0 indicates a LOW level and a logic 1 a HIGH level (TTL levels). A built-in 5-level ADC is available on I/O port P6. This converter can be used to feed AFC information to the controller from the IF section of the television as illustrated in the typical application circuit (Fig.8). The relationship between bits A2, A1 and A0 and the input voltage on port P6 is given in Table 3.
byte 1 byte 2
power-on reset flag. (POR = 1 on power-on) in-lock flag (FL = 1 when the loop is phase-locked) digital information for I/O ports P7, P5 and P4 respectively digital outputs of the 5-level ADC. Accuracy is 1/2 LSB (see Table 3)
The module address contains programmable address bits (MA1 and MA0) which offer the possibility of having several synthesizers (up to 4) in one system. The relationship between MA1 and MA0 and the input voltage on AS pin is given in Table 4.
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Philips Semiconductors
Product specification
1.3 GHz bidirectional I2C-bus controlled synthesizer
Table 3 ADC levels VOLTAGE APPLIED ON THE PORT P6 0.6 Vcc to 13.5 V 0.45 Vcc to 0.6 Vcc 0.3 Vcc to 0.45 Vcc 0.15 Vcc to 0.3 Vcc 0 to 0.15 Vcc A2 1 0 0 0 0 A1 0 1 1 0 0
TSA5514
A0 0 1 0 1 0
Table 4
Address selection MA1 0 0 1 1 MA0 0 1 0 1 0 to 0.1 Vcc open 0.4 to 0.6 Vcc 0.9 Vcc to Vcc VOLTAGE APPLIED ON PIN AS
LIMITING VALUES In accordance with Absolute Maximum Rating System (IEC 134); all pin numbers refer to DIL18 version SYMBOL Vcc V1 V2 V4 V5 V10 V6-13 V15 V18 I6-13 I4 Tstg Tj THERMAL RESISTANCE SYMBOL Rth
j-a
PARAMETER supply voltage charge-pump output voltage crystal (Q1) input voltage serial data input/output voltage serial clock input voltage address selection input voltage P7 to P0 input/output voltage prescaler input voltage drive output voltage P7 to P0 output current (open collector) SDA output current (open collector) IC storage temperature range maximum junction temperature
MIN. -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -1 -1 -40 - 6 Vcc Vcc 6 6 6
MAX. V V V V V V V V V
UNIT
+16 +2.5 Vcc 15 5 +150 150
mA mA C C
PARAMETER from junction to ambient in free air DIL18 SO16 SO20
THERMAL RESISTANCE 80 K/W 110 K/W 80 K/W
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Philips Semiconductors
Product specification
1.3 GHz bidirectional I2C-bus controlled synthesizer
CHARACTERISTICS Vcc = 5 V; Tamb = 25 C, unless otherwise specified All pin numbers refer to DIL18 version SYMBOL Functional range Vcc Tamb f N Icc fXTAL ZI supply voltage range operating ambient temperature range input frequency divider supply current crystal oscillator frequency range input impedance (pin 2) input level VCC = 4.5 V to 5.5 V; Tamb = -10 to +80 C; see typical sensitivity curve Fig.6 12/-25 9/-28 40/-15 - - - - - -20 - 2.7 VIH = 13.5 V VIL = 0 V VIH = 13.5 V VIL = 0 V - -10 - -10 - - - 50 2 - - - - - - - - - - - - crystal series resonance resistance 150 4.5 -10 64 256 25 3.2 -480 - - - - 35 4.0 -400 5.5 +80 1300 PARAMETER CONDITIONS MIN. TYP.
TSA5514
MAX.
UNIT
V C MHz mA MHz
32767 50 4.48 -320
f = 80 to 150 MHz f = 150 to 1000 MHz f = 1000 to 1300 MHz RI CI ILO VOL IOH IOL VIL VIH IIH IIL IIH IIL VIH VIL prescaler input resistance (see Fig.7) input capacitance
300/2.6 300/2.6 300/2.6 - -
mV/dBm mV/dBm mV/dBm pF A V A A
Output ports (open collector) P0 to P2; P4 to P7 (see note 1) output leakage current LOW level output voltage VO = 13.5 V IOL = 10 mA; note 2 VOH = 5 V VOL = 0 V 10 0.7
Address selection input HIGH level input current LOW level input current 20 -
Input ports P4, P5 and P7 LOW level input voltage HIGH level input voltage HIGH level input current LOW level input current 0.8 - 10 - V V A A A A
Input port P6 HIGH level input current LOW level input current 10 -
SCL and SDA inputs HIGH level input voltage LOW level input voltage 3.0 - 5.5 1.5 V V
October 1992
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Philips Semiconductors
Product specification
1.3 GHz bidirectional I2C-bus controlled synthesizer
TSA5514
SYMBOL
PARAMETER
CONDITIONS - -
MIN. - - - - - -
TYP.
MAX.
UNIT A A A A A V A A V nA
SCL and SDA inputs IIH IIL HIGH level input current LOW level input current VIH = 5 V; Vcc = 0 V VIH = 5 V; Vcc = 5 V VIL = 0 V; Vcc = 0 V VIL = 0 V; Vcc = 5 V Output SDA (pin 4; open collector) ILO VO IOH IOL V1 I1leak V18 V18 G output leakage current output voltage VO = 5.5 V IO = 3 mA CP = 1 CP = 0 in-lock T0 = 1 - - 10 0.4 10 10 - -
-10 -10
Charge-pump output PD (pin 1) HIGH level output current (absolute value) LOW level output current (absolute value) output voltage off-state leakage current 90 22 1.5 -5 - - 2000 220 50 - - - - - 300 75 2.5 5
Operational amplifier output UD (test mode T0 = 1) output voltage output voltage when switched-off operational amplifier current gain; I18/(I1 - I1leak) VIL = 0 V OS = 1; VIL = 2 V OS = 0; VIL = 2 V; I18 = 10 A 100 200 - mV mV
Notes to the characteristics 1. When a port is active, the collector voltage must not exceed 6 V. 2. Measured with a single open-collector port active.
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Philips Semiconductors
Product specification
1.3 GHz bidirectional I2C-bus controlled synthesizer
TSA5514
October 1992
11
Fig.5 Typical application (DIL18).
Philips Semiconductors
Product specification
1.3 GHz bidirectional I2C-bus controlled synthesizer
TSA5514
Fig.6 Prescaler typical input sensitivity curve; Vcc = 4.5 to 5.5 V; Tamb = -10 to +80 C.
Fig.7 Prescaler Smith chart of typical input impedance; Vcc = 5 V; reference value = 50 .
October 1992
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Philips Semiconductors
Product specification
1.3 GHz bidirectional I2C-bus controlled synthesizer
FLOCK FLAG DEFINITION (FL)
TSA5514
When the FL flag is 1, the maximum frequency deviation (f) from stable frequency can be expressed as follows: f = ( K VCO K O ) x I CP x ( C1 + C2 ) ( C1 x C2 ) Where: KVCO ICP KO C1 and C2 = = = = oscillator slope (Hz/V) charge-pump current (A) 4 x 10E6 loop filter capacitors (see Fig.8)
Fig.8 Loop filter.
FLOCK FLAG APPLICATION * Kvco = 16 MHz/V (UHF band) * ICP = 220 A * C1 = 180 nF * C2 = 39 nF * f = 27.5 kHz. Table 5 Flock flag settings MIN. Time span between actual phase lock and FL-flag setting Time span between the loop losing lock and FL-flag resetting 1024 0 1152 128 MAX. s s UNIT
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Philips Semiconductors
Product specification
1.3 GHz bidirectional I2C-bus controlled synthesizer
PACKAGE OUTLINES DIP18: plastic dual in-line package; 18 leads (300 mil)
TSA5514
SOT102-1
D
seating plane
ME
A2
A
L
A1
c Z e b1 b 18 10 b2 MH wM (e 1)
pin 1 index E
1
9
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.7 0.19 A1 min. 0.51 0.020 A2 max. 3.7 0.15 b 1.40 1.14 0.055 0.044 b1 0.53 0.38 0.021 0.015 b2 1.40 1.14 0.055 0.044 c 0.32 0.23 0.013 0.009 D (1) 21.8 21.4 0.86 0.84 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.9 3.4 0.15 0.13 ME 8.25 7.80 0.32 0.31 MH 9.5 8.3 0.37 0.33 w 0.254 0.01 Z (1) max. 0.85 0.033
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT102-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 93-10-14 95-01-23
October 1992
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Philips Semiconductors
Product specification
1.3 GHz bidirectional I2C-bus controlled synthesizer
TSA5514
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A X
c y HE vMA
Z 16 9
Q A2 A1 pin 1 index Lp 1 e bp 8 wM L detail X (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 0.069 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 10.0 9.8 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.050 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 0.039 0.016 Q 0.7 0.6 0.028 0.020 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012
0.010 0.057 0.004 0.049
0.019 0.0100 0.39 0.014 0.0075 0.38
0.244 0.041 0.228
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT109-1 REFERENCES IEC 076E07S JEDEC MS-012AC EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-01-23 97-05-22
October 1992
15
Philips Semiconductors
Product specification
1.3 GHz bidirectional I2C-bus controlled synthesizer
TSA5514
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
E
A X
c y HE vMA
Z 20 11
Q A2 A1 pin 1 index Lp L 1 e bp 10 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 13.0 12.6 0.51 0.49 E (1) 7.6 7.4 0.30 0.29 e 1.27 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 Z
(1)
0.9 0.4
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.050 0.055 0.394 0.016
0.035 0.004 0.016
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT163-1 REFERENCES IEC 075E04 JEDEC MS-013AC EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-01-24 97-05-22
October 1992
16
Philips Semiconductors
Product specification
1.3 GHz bidirectional I2C-bus controlled synthesizer
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). DIP SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
TSA5514
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. WAVE SOLDERING Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
October 1992
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Philips Semiconductors
Product specification
1.3 GHz bidirectional I2C-bus controlled synthesizer
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TSA5514
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips' I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.
October 1992
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