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High Voltage MegaMOSTMFETs IXTK 21N100 IXTN 21N100 VDSS = 1000 V = 21 A ID25 RDS(on) = 0.55 N-Channel, Enhancement Mode TO-264 AA (IXTK) Symbol VDSS VDGR VGS VGSM ID25 IDM PD TJ TJM T stg TL VISOL Md Weight 1.6 mm (0.063 in) from case for 10 s 50/60 Hz, RMS IISOL 1 mA t = 1 min t=1s 300 0.9/6 10 Test Conditions TJ = 25C to 150C TJ = 25C to 150C; RGS = 1 M Continuous Transient TC = 25C, Chip capability TC = 25C, pulse width limited by TJM TC = 25C Maximum Ratings IXTK IXTN 1000 1000 20 30 21 84 500 1000 1000 20 30 21 84 520 150 -55 ... +150 2500 3000 V V V V A A W C C C C V~ V~ S S D G S G D S D (TAB) miniBLOC, SOT-227 B E153432 D G S -55 ... +150 G = Gate S = Source D = Drain TAB = Drain Either Source terminal at miniBLOC can be used as Main or Kelvin Source Mounting torque Terminal connection torque 1.5/13 Nm/lb.in. 1.5/13 Nm/lb.in. 30 g Features International standard packages JEDEC TO-264, epoxy meet UL 94 V-0 flammability classification miniBLOC, (ISOTOP-compatible) with Aluminium nitride isolation Low RDS (on) HDMOSTM process Rugged polysilicon gate cell structure Low package inductance l l l l l l l l l l l l l l l Applications Symbol Test Conditions Characteristic Values (TJ = 25C, unless otherwise specified) min. typ. max. 1000 2 4.5 200 TJ = 25C TJ = 125C 500 2 0.55 V V nA A mA DC-DC converters Synchronous rectification Battery chargers Switched-mode and resonant-mode power supplies DC choppers Temperature and lighting controls VDSS VGH(th) IGSS IDSS R DS(on) VGS = 0 V, ID = 6 mA VDS = VGS, ID = 500 A VGS = 20 VDC, VDS = 0 VDS = 0.8 * VDSS VGS = 0 V Advantages Easy to mount Space savings High power density 92808I(5/97) VGS = 10 V, ID = 0.5 * ID25 Pulse test, t 300 s, duty cycle d 2 % IXYS reserves the right to change limits, test conditions, and dimensions. (c) 2000 IXYS All rights reserved 1-4 IXTK 21N100 IXTN 21N100 Symbol Test Conditions Characteristic Values (TJ = 25C, unless otherwise specified) min. typ. max. 24 8400 VGS = 0 V, VDS = 25 V, f = 1 MHz 630 110 30 VGS = 10 V, VDS = 0.5 * VDSS, ID = 0.5 * ID25 RG = 1 (External), 50 100 40 250 VGS = 10 V, VDS = 0.5 * VDSS, ID = 0.5 * ID25 60 100 TO-264 AA TO-264 AA miniBLOC, SOT-227 B miniBLOC, SOT-227 B 0.05 0.15 0.24 0.25 S pF pF pF ns ns ns Dim. TO-264 AA Outline gfs C iss C oss C rss t d(on) tr td(off) tf Q g(on) Q gs Q gd R thJC R thCK R thJC R thCK VDS = 10 V; ID = 0.5 * ID25, pulse test ns nC nC nC K/W K/W K/W K/W A A1 A2 b b1 b2 c D E e J K L L1 P Q Q1 R R1 S T Millimeter Min. Max. 4.82 2.54 2.00 1.12 2.39 2.90 0.53 25.91 19.81 5.46 0.00 0.00 20.32 2.29 3.17 6.07 8.38 3.81 1.78 6.04 1.57 5.13 2.89 2.10 1.42 2.69 3.09 0.83 26.16 19.96 BSC 0.25 0.25 20.83 2.59 3.66 6.27 8.69 4.32 2.29 6.30 1.83 Inches Min. Max. .190 .202 .100 .114 .079 .083 .044 .056 .094 .106 .114 .122 .021 .033 1.020 1.030 .780 .786 .215 BSC .000 .010 .000 .010 .800 .820 .090 .102 .125 .144 .239 .247 .330 .342 .150 .170 .070 .090 .238 .248 .062 .072 Source-Drain Diode Symbol IS ISM VSD t rr IRM Test Conditions VGS = 0 V Characteristic Values (TJ = 25C, unless otherwise specified) min. typ. max. 21 84 1.5 A A V miniBLOC, SOT-227 B Repetitive; pulse width limited by TJM IF = IS, VGS = 0 V, Pulse test, t 300 s, duty cycle d 2 % IF = IS, -di/dt = 100 A/s, VR = 100 V 1000 20 ns A M4 screws (4x) supplied Dim. A B C D E F G H J K L M N O P Q R S T U Millimeter Min. Max. 31.50 7.80 4.09 4.09 4.09 14.91 30.12 38.00 11.68 8.92 0.76 12.60 25.15 1.98 4.95 26.54 3.94 4.72 24.59 -0.05 31.88 8.20 4.29 4.29 4.29 15.11 30.30 38.23 12.22 9.60 0.84 12.85 25.42 2.13 5.97 26.90 4.42 4.85 25.07 0.1 Inches Min. Max. 1.240 0.307 0.161 0.161 0.161 0.587 1.186 1.496 0.460 0.351 0.030 0.496 0.990 0.078 0.195 1.045 0.155 0.186 0.968 -0.002 1.255 0.323 0.169 0.169 0.169 0.595 1.193 1.505 0.481 0.378 0.033 0.506 1.001 0.084 0.235 1.059 0.174 0.191 0.987 0.004 (c) 2000 IXYS All rights reserved IXYS MOSFETS and IGBTs are covered by one or more of the following U.S. patents: 4,835,592 4,881,106 5,017,508 5,049,961 5,187,117 5,486,715 4,850,072 4,931,844 5,034,796 5,063,307 5,237,481 5,381,025 2-4 IXTK 21N100 IXTN 21N100 Fig. 1 Output Characteristics 40 TJ = 25C Fig. 2 Input Admittance 40 VGS = 10V 35 30 35 30 ID - Amperes ID - Amperes 6V 25 20 15 10 5 0 5V 25 20 15 10 5 0 TJ = 25C 0 5 10 15 20 0 1 2 3 4 5 6 7 8 9 10 VDS - Volts VGS - Volts Fig. 3 RDS(on) vs. Drain Current 1.5 TJ = 25C Fig. 4 Temperature Dependence of Drain to Source Resistance 2.50 2.25 1.4 RDS(on) - Normalized RDS(on) - Normalized 2.00 1.75 1.50 1.25 1.00 0.75 ID = 12A 1.3 1.2 1.1 1.0 0.9 0 5 10 15 20 25 30 35 40 45 50 VGS = 10V VGS = 15V 0.50 -50 -25 0 25 50 75 100 125 150 ID - Amperes TJ - Degrees C Fig. 5 Drain Current vs. Case Temperature 25 20 Fig. 6 Temperature Dependence of Breakdown and Threshold Voltage 1.2 VGS(th) 1.1 BVDSS BV/VG(th) - Normalized -25 0 25 50 75 100 125 150 ID - Amperes 1.0 0.9 0.8 0.7 0.6 15 10 5 0 -50 0.5 -50 -25 0 25 50 75 100 125 150 TC - Degrees C TJ - Degrees C (c) 2000 IXYS All rights reserved 3-4 IXTK 21N100 IXTN 21N100 Fig.7 Gate Charge Characteristic Curve 10 9 8 7 VDS = 500V ID = 12A IG = 10mA Fig.8 Capacitance Curves 9000 8000 Ciss Capacitance - pF 7000 6000 5000 4000 3000 2000 1000 0 Coss Crss f = 1 MHz VDS = 25V VGS - Volts 6 5 4 3 2 1 0 0 50 100 150 200 250 300 0 5 10 15 20 Gate Charge - nCoulombs VDS - Volts Fig.9 Source Current vs. Source to Drain Voltage 40 35 30 ID - Amperes 25 20 TJ = 125C 15 TJ = 25C 10 5 0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 VSD - Volts Fig.10 Transient Thermal Impedance 1 R(th)JC - K/W D=0.5 0.1 D=0.2 D=0.1 D=0.05 0.01 D=0.02 D=0.01 Single pulse D = Duty Cycle 0.001 0.0001 0.001 0.01 0.1 1 10 Pulse Width - Seconds (c) 2000 IXYS All rights reserved 4-4 |
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