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| Philips Semiconductors Product specification Silicon Diffused Power Transistor BU2523DX GENERAL DESCRIPTION New generation, high-voltage, high-speed switching npn transistor with an integrated damper diode in a full plastic envelope intended for use in horizontal deflection circuits of HDTV receivers and pc monitors. QUICK REFERENCE DATA SYMBOL VCESM VCEO IC ICM Ptot VCEsat ICsat VF tf PARAMETER Collector-emitter voltage peak value Collector-emitter voltage (open base) Collector current (DC) Collector current peak value Total power dissipation Collector-emitter saturation voltage Collector saturation current Diode forward voltage Fall time CONDITIONS VBE = 0 V TYP. 5.5 0.15 MAX. 1500 800 11 29 45 5.0 2.2 0.3 UNIT V V A A W V A V s Ths 25 C IC = 5.5 A; IB = 1.1 A f = 64 kHz IF = 5.5 A ICsat = 5.5 A; f = 64 kHz PINNING - SOT399 PIN 1 2 3 base collector emitter DESCRIPTION PIN CONFIGURATION case SYMBOL c b Rbe case isolated 123 e LIMITING VALUES Limiting values in accordance with the Absolute Maximum Rating System (IEC 134) SYMBOL VCESM VCEO IC ICM IB IBM -IB(AV) -IBM Ptot Tstg Tj PARAMETER Collector-emitter voltage peak value Collector-emitter voltage (open base) Collector current (DC) Collector current peak value Base current (DC) Base current peak value Reverse base current Reverse base current peak value 1 Total power dissipation Storage temperature Junction temperature CONDITIONS VBE = 0 V MIN. -55 MAX. 1500 800 11 29 7 10 175 7 45 150 150 UNIT V V A A A A mA A W C C average over any 20 ms period Ths 25 C THERMAL RESISTANCES SYMBOL Rth j-hs Rth j-a PARAMETER Junction to heatsink Junction to ambient CONDITIONS with heatsink compound in free air TYP. 35 MAX. 2.8 UNIT K/W K/W 1 Turn-off current. September 1997 1 Rev 1.200 Philips Semiconductors Product specification Silicon Diffused Power Transistor BU2523DX ISOLATION LIMITING VALUE & CHARACTERISTIC Ths = 25 C unless otherwise specified SYMBOL Visol PARAMETER Repetitive peak voltage from all three terminals to external heatsink CONDITIONS R.H. 65 % ; clean and dustfree MIN. TYP. MAX. 2500 UNIT V Cisol Capacitance from T2 to external f = 1 MHz heatsink - 22 - pF STATIC CHARACTERISTICS Ths = 25 C unless otherwise specified SYMBOL ICES ICES IEBO BVEBO VCEOsust Rbe VCEsat VBEsat hFE hFE VF PARAMETER Collector cut-off current 2 CONDITIONS VBE = 0 V; VCE = VCESMmax VBE = 0 V; VCE = VCESMmax; Tj = 125 C VEB = 6.0 V; IC = 0 A IB = 600 mA IB = 0 A; IC = 100 mA; L = 25 mH VEB = 7.5 V IC = 5.5 A; IB = 1.1 A IC = 5.5 A; IB = 1.1 A IC = 1.0 A; VCE = 5 V IC = 5.5 A; VCE = 5 V IF = 5.5 A MIN. 80 7.5 800 5 - TYP. 130 13.5 46 12 7.5 - MAX. 1.0 2.0 170 5.0 1.0 10.8 2.2 UNIT mA mA mA V V V V V Emitter cut-off current Emitter-base breakdown voltage Collector-emitter sustaining voltage Base-emitter resistance Collector-emitter saturation voltage Base-emitter saturation voltage DC current gain Diode forward voltage DYNAMIC CHARACTERISTICS Ths = 25 C unless otherwise specified SYMBOL PARAMETER Switching times (64 kHz line deflection circuit) CONDITIONS ICsat = 5.5 A; LC = 200 H; Cfb = 4 nF; VCC = 145 V; IB(end) = 0.56 A; LB = 0.4 H; -VBB = -4 V; -IBM = 3.3 A 1.5 0.15 IF = 5.5 A; dIF/dt = 50 A/s VF = 5 V 16.5 375 2 0.3 s s V ns TYP. MAX. UNIT ts tf Vfr tfr Turn-off storage time Turn-off fall time Anti-parallel diode forward recovery voltage Anti-parallel diode forward recovery time 2 Measured with half sine-wave voltage (curve tracer). September 1997 2 Rev 1.200 Philips Semiconductors Product specification Silicon Diffused Power Transistor BU2523DX TRANSISTOR IC DIODE ICsat + 150 v nominal adjust for ICsat t Lc IB I B end t 5 us 6.5 us D.U.T. IBend LB Cfb Rbe 16 us VCE t -VBB Fig.1. Switching times waveforms. Fig.4. Switching times test circuit. ICsat 90 % IC 100 hFE VCE = 1 V BU2523DF/X Ths = 25 C Ths = 85 C 10 % tf ts IB IBend t 10 t 1 0.01 - IBM 0.1 1 10 IC / A 100 Fig.2. Switching times definitions. Fig.5. High and low DC current gain. hFE = f (IC) VCE = 1 V I F I hFE BU2523DF/X Ths = 25 C Ths = 85 C F 100 VCE = 5 V 10% t fr V F time 10 5V V F time V fr 1 0.01 0.1 1 10 IC / A 100 Fig.3. Definition of anti-parallel diode Vfr and tfr. Fig.6. High and low DC current gain. hFE = f (IC) VCE = 5 V September 1997 3 Rev 1.200 Philips Semiconductors Product specification Silicon Diffused Power Transistor BU2523DX 10 VCEsat / V Ths = 25 C Ths = 85 C BU2523DF/X 5 ts/tf / us BU2523AF/DF/AX/DX 4 1 IC/IB = 10 IC/IB = 5 0.1 1 3 2 0.01 0.1 1 10 IC / A 100 0 0 0.5 1 1.5 IB / A 2 Fig.7. Typical collector-emitter saturation voltage. VCEsat = f (IC); parameter IC/IB Fig.10. Typical collector storage and fall time. ts = f (IB); tf = f (IB); IC = 5.5 A; Tj = 85C; f = 64 kHz Normalised Power Derating with heatsink compound VBEsat / V 1.2 BU2523DF/X Ths = 25 C Ths = 85 C IC = 6 A 120 110 100 90 80 70 60 50 40 30 20 10 0 PD% 1.1 1 0.9 0.8 IC = 4.5 A 0.7 0.6 0 1 2 3 IB / A 4 0 20 40 60 80 Ths / C 100 120 140 Fig.8. Typical base-emitter saturation voltage. VBEsat = f (IB); parameter IC Fig.11. Normalised power dissipation. PD% = 100PD/PD 25C = f (Tmb) PTOT / W 100 BU2523AF/DF/AX/DX 10 Zth / (K/W) BU2525AF Ths = 25 C Ths = 85 C 1 0.5 0.2 0.1 0.05 0.02 10 0.1 0.01 D=0 0.001 1E-06 P D tp D= tp T t T 1 0 0.5 1 IB / A 1.5 2 1E-04 1E-02 t/s 1E+00 Fig.9. Typical losses. PTOT = f (IB); IC = 5.5 A; f = 64 kHz Fig.12. Transient thermal impedance. Zth j-hs = f(t); parameter D = tp/T September 1997 4 Rev 1.200 Philips Semiconductors Product specification Silicon Diffused Power Transistor BU2523DX VCC 8 7 6 Ic(sat) (A) BU2523AF/AX LC 5 4 IBend VCL LB T.U.T. CFB 3 2 1 0 0 10 20 30 40 50 60 70 80 -VBB Fig.13. Test Circuit RBSOA. VCC = 150 V; -VBB = 1 - 5 V; LC = 1.5 mH; VCL = 1450 V; LB = 0.3 - 2 H; CFB = 0.5 - 8 nF; IB(end) = 0.55 - 1.1 A frequency (kHz) Fig.15. ICsat during normal running vs. frequency of operation for optimum performance IC / A 30 BU2523 20 Area where fails occur 10 0 100 VCE / V 1000 1500 Fig.14. Reverse bias safe operating area. Tj Tjmax September 1997 5 Rev 1.200 Philips Semiconductors Product specification Silicon Diffused Power Transistor BU2523DX MECHANICAL DATA Dimensions in mm Net Mass: 5.88 g 16.0 max 0.7 4.5 10.0 27 max 25.1 25.7 22.5 max 5.1 2.2 max 18.1 min 4.5 1.1 0.4 M 2 3.3 5.8 max 3.0 25 0.95 max 5.45 5.45 3.3 Fig.16. SOT399; The seating plane is electrically isolated from all terminals. Notes 1. Refer to mounting instructions for F-pack envelopes. 2. Epoxy meets UL94 V0 at 1/8". September 1997 6 Rev 1.200 Philips Semiconductors Product specification Silicon Diffused Power Transistor BU2523DX DEFINITIONS Data sheet status Objective specification Product specification Limiting values Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. (c) Philips Electronics N.V. 1997 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. This data sheet contains target or goal specifications for product development. This data sheet contains final product specifications. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. September 1997 7 Rev 1.200 |
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