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(R)
VN920 / VN920-B5 / VN920SO
SINGLE CHANNEL HIGH SIDE SOLID STATE RELAY
TYPE VN920 VN920-B5 VN920SO RDS(on) 16m IOUT 30 A VCC 36 V
CMOS COMPATIBLE INPUT s PROPORTIONAL LOAD CURRENT SENSE s SHORTED LOAD PROTECTION s UNDERVOLTAGE AND OVERVOLTAGE SHUTDOWN s OVERVOLTAGE CLAMP s THERMAL SHUTDOWN s CURRENT LIMITATION s PROTECTION AGAINST LOSS OF GROUND AND LOSS OF VCC
s s s
PENTAWATT
P2PAK
SO-16L ORDER CODES
PACKAGE TUBE PENTAWATT VN920 T&R
P2PAK SO-16L
VN920-B5 VN920SO
VN920-B513TR VN920SO13TR
VERY LOW STAND-BY POWER DISSIPATION REVERSE BATTERY PROTECTION (*)
DESCRIPTION The VN920, VN920-B5, VN920SO is a monolithic device made by using STMicroelectronics VIPower M0-3 Technology, intended for driving any kind of load with one side connected to BLOCK DIAGRAM
ground. Active VCC pin voltage clamp protects the device against low energy spikes (see ISO7637 transient compatibility table). Active current limitation combined with thermal shutdown and automatic restart protect the device against overload. The device integrates an analog current sense output which delivers a current proportional to the load current. Device automatically turns off in case of ground pin disconnection.
VCC
VCC CLAMP
OVERVOLTAGE DETECTION UNDERVOLTAGE DETECTION
GND
Power CLAMP
DRIVER INPUT LOGIC CURRENT LIMITER VDS LIMITER IOUT K OVERTEMPERATURE DETECTION CURRENT SENSE OUTPUT
(*) See application schematic at page 8
May 2003
1/23
VN920 / VN920-B5 / VN920SO
ABSOLUTE MAXIMUM RATING
Symbol VCC - VCC - IGND IOUT - IOUT IIN VCSENSE Parameter DC Supply Voltage Reverse DC Supply Voltage DC Reverse Ground Pin Current DC Output Current Reverse DC Output Current DC Input Current Current Sense Maximum Voltage Electrostatic Discharge (Human Body Model: R=1.5K; C=100pF) VESD - INPUT - CURRENT SENSE - OUTPUT - VCC Maximum Switching Energy (L=0.25mH; RL=0; Vbat=13.5V; Tjstart=150C; IL=45A) Power Dissipation TC25C Junction Operating Temperature Case Operating Temperature Storage Temperature 96.1 4000 2000 5000 5000 364 96.1 Internally limited - 40 to 150 - 55 to 150 352 8.3 V V V V mJ W C C C PENTAWATT Value P2PAK SO-16L 41 - 0.3 - 200 Internally Limited - 21 +/- 10 -3 +15 Unit V V mA A A mA V V
EMAX PTOT Tj Tc TSTG
CONNECTION DIAGRAM (TOP VIEW)
5 4 3 2 1
OUTPUT CSENSE VCC INPUT GND
VCC N.C. GND INPUT CSENSE N.C. N.C. VCC
1
16
VCC OUTPUT OUTPUT OUTPUT OUTPUT OUTPUT OUTPUT
PENTAWATT
5 4 3 2 1
OUTPUT CSENSE VCC INPUT GND
8
9
VCC
P2PAK
SO-16L
CURRENT AND VOLTAGE CONVENTIONS
IS VCC
VCC IOUT
OUTPUT I IN INPUT VIN CURRENT SENSE VSENSE GND IGND I SENSE VOUT
2/23
1
VN920 / VN920-B5 / VN920SO
THERMAL DATA
Symbol Rthj-case Rthj-lead Rthj-amb Parameter Thermal Resistance Junction-case Thermal Resistance Junction-lead Thermal Resistance Junction-ambient Max Max Max PENTAWATT 1.3 61.3 Value P2PAK 1.3 51.3 (*) SO-16L 15 65 (**) Unit C/W C/W C/W
(*) When mounted on a standard single-sided FR-4 board with 0.5cm2 of Cu (at least 35m thick). (**) When mounted on a standard single-sided FR-4 board with 0.5cm2 of Cu (at least 35m thick) connected to all VCC pins.
ELECTRICAL CHARACTERISTICS (8VSymbol VCC VUSD VOV RON Vclamp Parameter Operating Supply Voltage Undervoltage Shut-down Overvoltage Shut-down On State Resistance IOUT=10A IOUT=3A; VCC=6V ICC=20mA (See note 1) Off State; VCC=13V; VIN=VOUT=0V IS Supply Current Off State; VCC=13V; VIN=VOUT=0V; Tj=25C On State; VCC=13V; VIN=5V; IOUT=0A; RSENSE=3.9K Off State Output Current Off State Output Current Off State Output Current Off State Output Current VIN=VOUT=0V VIN=0V; VOUT=3.5V VIN=VOUT=0V; Vcc=13V; Tj=125C VIN=VOUT=0V; Vcc=13V; Tj=25C 0 -75 41 48 10 10 Test Conditions Min 5.5 3 36 Typ 13 4 Max 36 5.5 16 32 55 55 25 20 5 50 0 5 3 Unit V V V m m m V A A mA A A A A
IOUT=10A; Tj=25C
Clamp Voltage
IL(off1) IL(off2) IL(off3) IL(off4)
SWITCHING (VCC=13V)
Symbol td(on) td(off) Parameter Turn-on Delay Time Turn-off Delay Time Test Conditions RL=1.3 (see figure 2) RL=1.3 (see figure 2) RL=1.3 (see figure 2) Min Typ 50 50 See relative diagram See relative diagram Max Unit s s V/s
dVOUT/dt(on) Turn-on Voltage Slope
dVOUT/dt(off) Turn-off Voltage Slope
RL=1.3 (see figure 2)
V/s
LOGIC INPUT
Symbol VIL IIL VIH IIH VI(hyst) VICL Parameter Input Low Level Low Level Input Current Input High Level High Level Input Current Input Hysteresis Voltage Input Clamp Voltage Test Conditions VIN=1.25V VIN=3.25V IIN=1mA IIN=-1mA 0.5 6 6.8 -0.7 Min 1 3.25 10 8 Typ Max 1.25 Unit V A V A V V V
Note 1: Vclamp and VOV are correlated. Typical difference is 5V.
3/23
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VN920 / VN920-B5 / VN920SO
ELECTRICAL CHARACTERISTICS (continued) CURRENT SENSE (9VVCC16V) (See Fig. 1)
Symbol K1 dK1/K1 K2 dK2/K2 K3 dK3/K3 Parameter IOUT/ISENSE Current Sense Ratio Drift IOUT/ISENSE Current Sense Ratio Drift IOUT/ISENSE Current Sense Ratio Drift Analog Sense Leakage Current Test Conditions IOUT=1A; VSENSE=0.5V; Tj= -40C...150C IOUT=1A; VSENSE=0.5V; Tj= -40C...+150C IOUT=10A; VSENSE=4V; Tj=-40C Tj=25C...150C IOUT=10A; VSENSE=4V; Tj=-40C...+150C IOUT=30A; VSENSE=4V; Tj=-40C Tj=25C...150C IOUT=30A; VSENSE=4V; Tj=-40C...+150C VCC=6...16V; IOUT=0A;VSENSE=0V; Tj=-40C...+150C Min 3300 -10 4200 4400 -8 4200 4400 -6 4900 4900 4900 4900 Typ 4400 Max 6000 +10 6000 5750 +8 5500 5250 +6 % A V V 5.5 V % % Unit
ISENSEO
0 2 4
10
VSENSE VSENSEH
RVSENSEH
tDSENSE
Max Analog Sense Output VCC=5.5V; IOUT=5A; RSENSE=10K Voltage VCC>8V; IOUT=10A; RSENSE=10K Sense Voltage in Overtemperature VCC=13V; RSENSE=3.9K conditions Analog Sense Output Impedance in VCC=13V; Tj>TTSD; Output Open Overtemperature Condition Current sense delay to 90% I SENSE (see note 2) response
400
500
s
PROTECTIONS
Symbol TTSD TR Thyst Ilim Vdemag VON Parameter Shut-down Temperature Reset Temperature Thermal Hysteresis DC Short Circuit Current Turn-off Output Clamp Voltage Output Voltage Drop Limitation VCC=13V 5V75 75
VCC-41 VCC-48 VCC-55 50
Note 2: current sense signal delay after positive input slope Note: sense pin doesn't have to be left floating.
4/23
1
VN920 / VN920-B5 / VN920SO
Figure 1: IOUT/ISENSE versus IOUT
IOUT/I SENSE
6500
6000
max.Tj=-40C
5500
max.Tj=25...150C
5000
min.Tj=25...150C
4500
typical value
4000
min.Tj=-40C
3500
3000 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32
IOUT (A)
Figure 2: Switching Characteristics (Resistive load RL=1.3)
VOUT
80% dVOUT/dt(on) tr ISENSE 90% 10%
90% dVOUT/dt(off) tf t
INPUT
tDSENSE
t td(off)
td(on)
t
5/23
1
1
VN920 / VN920-B5 / VN920SO
TRUTH TABLE
CONDITIONS Normal operation Overtemperature Undervoltage Overvoltage INPUT L H L H L H L H L H H L H L OUTPUT L H L L L L L L L L L H H L SENSE 0 Nominal 0 VSENSEH 0 0 0 0 0 (TjTTSD) VSENSEH 0 < Nominal 0
Short circuit to GND
Short circuit to VCC Negative output voltage clamp
ELECTRICAL TRANSIENT REQUIREMENTS
ISO T/R 7637/1 Test Pulse 1 2 3a 3b 4 5 ISO T/R 7637/1 Test Pulse 1 2 3a 3b 4 5 CLASS C E I -25 V +25 V -25 V +25 V -4 V +26.5 V II -50 V +50 V -50 V +50 V -5 V +46.5 V TEST LEVELS III -75 V +75 V -100 V +75 V -6 V +66.5 V TEST LEVELS RESULTS II III C C C C C C C C C C E E IV -100 V +100 V -150 V +100 V -7 V +86.5 V Delays and Impedance 2 ms 10 0.2 ms 10 0.1 s 50 0.1 s 50 100 ms, 0.01 400 ms, 2
I C C C C C C
IV C C C C C E
CONTENTS All functions of the device are performed as designed after exposure to disturbance. One or more functions of the device is not performed as designed after exposure to disturbance and cannot be returned to proper operation without replacing the device.
6/23
1
VN920 / VN920-B5 / VN920SO
Figure 3: Waveforms
NORMAL OPERATION INPUT LOAD CURRENT SENSE
UNDERVOLTAGE VCC INPUT LOAD CURRENT SENSE
VUSD VUSDhyst
OVERVOLTAGE
VOV
VCC INPUT LOAD CURRENT SENSE
VCC > VUSD
VOVhyst
SHORT TO GROUND INPUT LOAD CURRENT LOAD VOLTAGE SENSE
SHORT TO VCC INPUT LOAD VOLTAGE LOAD CURRENT SENSE
OVERTEMPERATURE Tj INPUT LOAD CURRENT SENSE
ISENSE= VSENSEH RSENSE TTSD TR
7/23
VN920 / VN920-B5 / VN920SO
APPLICATION SCHEMATIC
+5V
Rprot INPUT
VCC
Dld C Rprot CURRENT SENSE RSENSE GND OUTPUT
VGND
RGND
DGND
GND PROTECTION REVERSE BATTERY
NETWORK
AGAINST
Solution 1: Resistor in the ground line (RGND only). This can be used with any type of load. The following is an indication on how to dimension the RGND resistor. 1) RGND 600mV / (IS(on)max). 2) RGND (-VCC) / (-IGND) where -IGND is the DC reverse ground pin current and can be found in the absolute maximum rating section of the device's datasheet. Power Dissipation in RGND (when VCC<0: during reverse battery situations) is: PD= (-VCC)2/RGND This resistor can be shared amongst several different HSD. Please note that the value of this resistor should be calculated with formula (1) where IS(on)max becomes the sum of the maximum on-state currents of the different devices. Please note that if the microprocessor ground is not common with the device ground then the RGND will produce a shift (IS(on)max * RGND) in the input thresholds and the status output values. This shift will vary depending on how many devices are ON in the case of several high side drivers sharing the same RGND. If the calculated power dissipation leads to a large resistor or several devices have to share the same resistor then the ST suggests to utilize Solution 2 (see below). Solution 2: A diode (DGND) in the ground line. A resistor (RGND=1k) should be inserted in parallel to DGND if the device will be driving an inductive load.
This small signal diode can be safely shared amongst several different HSD. Also in this case, the presence of the ground network will produce a shift (j600mV) in the input threshold and the status output values if the microprocessor ground is not common with the device ground. This shift will not vary if more than one HSD shares the same diode/resistor network.
LOAD DUMP PROTECTION
Dld is necessary (Voltage Transient Suppressor) if the load dump peak voltage exceeds VCC max DC rating. The same applies if the device will be subject to transients on the VCC line that are greater than the ones shown in the ISO T/R 7637/1 table.
C I/Os PROTECTION:
If a ground protection network is used and negative transients are present on the VCC line, the control pins will be pulled negative. ST suggests to insert a resistor (Rprot ) in line to prevent the C I/Os pins to latch-up. The value of these resistors is a compromise between the leakage current of C and the current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of C I/Os. -VCCpeak/Ilatchup Rprot (VOHC-VIH-VGND) / IIHmax Calculation example: For VCCpeak= - 100V and Ilatchup 20mA; VOHC 4.5V 5k Rprot 65k. Recommended Rprot value is 10k.
8/23
1
VN920 / VN920-B5 / VN920SO
Off State Output Current
IL(off1) (uA)
9 8 7 6 5 2.5 4 2 3 2 1 0 -50 -25 0 25 50 75 100 125 150 175 1.5 1 0.5 0 -50 -25 0 25 50 75 100 125 150 175
High Level Input Current
Iih (uA)
5 4.5
Vin=3.25V
4 3.5 3
Tc (C)
Tc (C)
Input Clamp Voltage
Vicl (V)
8 7.8
Input High Level
Vih (V)
3.6 3.4 3.2
Iin=1mA
7.6 7.4 7.2 7 6.8 6.6
3 2.8 2.6 2.4
6.4 6.2 6 -50 -25 0 25 50 75 100 125 150 175 2.2 2 -50 -25 0 25 50 75 100 125 150 175
Tc (C)
Tc (C)
Input Low Level
Vil (V)
2.6 2.4 2.2
Input Hysteresis Voltage
Vhyst (V)
1.5 1.4 1.3 1.2
2 1.8 1.6 1.4
1.1 1 0.9 0.8 0.7
1.2 1 -50 -25 0 25 50 75 100 125 150 175
0.6 0.5 -50 -25 0 25 50 75 100 125 150 175
Tc (C)
Tc (C)
9/23
1
1
VN920 / VN920-B5 / VN920SO
Overvoltage Shutdown
Vov (V)
50 48 46 44 42 40 38 36 34 32 30 -50 -25 0 25 50 75 100 125 150 175
ILIM Vs Tcase
Ilim (A)
100 90
Vcc=13V
80 70 60 50 40 30 20 10 0 -50 -25 0 25 50 75 100 125 150 175
Tc (C)
Tc (C)
Turn-on Voltage Slope
dVout/dt(on) (V/ms)
700 650 600 550 500 450 400 350
Turn-off Voltage Slope
dVout/dt(off) (V/ms)
550 500
Vcc=13V Rl=1.3Ohm
450 400 350 300 250 200 150 100
Vcc=13V Rl=1.3Ohm
300 250 -50 -25 0 25 50 75 100 125 150 175
50 0 -50 -25 0 25 50 75 100 125 150 175
Tc (C)
Tc (C)
On State Resistance Vs Tcase
Ron (mOhm)
50 45 40 35 30 25 20 15 10 5 0 -50 -25 0 25 50 75 100 125 150 175
On State Resistance Vs VCC
Ron (mOhm)
50 45
Iout=10A Vcc=8V; 36V
40 35
Tc= 150C
30 25 20
Tc= 25C
15 10
Tc= - 40C
5 0 5 10 15 20 25 30 35 40
Tc (C)
Vcc (V)
10/23
1
VN920 / VN920-B5 / VN920SO
SO-16L Maximum turn off current versus load inductance
ILMAX (A) 100
A B
10
C
1 0.01 0.1 1 L(mH) 10 100
A = Single Pulse at TJstart=150C B= Repetitive pulse at TJstart=100C C= Repetitive Pulse at TJstart=125C Conditions: VCC=13.5V Values are generated with RL=0 In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse must not exceed the temperature specified above for curves B and C. VIN, IL Demagnetization Demagnetization Demagnetization
t
11/23
VN920 / VN920-B5 / VN920SO
P2PAK Maximum turn off current versus load inductance
ILM AX (A) 100
A B C
10
1 0.01 0.1 1 L(mH)
A = Single Pulse at TJstart=150C B= Repetitive pulse at TJstart=100C C= Repetitive Pulse at TJstart=125C Conditions: VCC=13.5V Values are generated with RL=0 In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse must not exceed the temperature specified above for curves B and C. VIN, IL Demagnetization Demagnetization Demagnetization
10
100
t
12/23
VN920 / VN920-B5 / VN920SO
P2PAK THERMAL DATA
P2PAK PC Board
Layout condition of Rth and Zth measurements (PCB FR4 area= 60mm x 60mm, PCB thickness=2mm, Cu thickness=35m, Copper areas: 0.97cm2, 8cm2).
Rthj-amb Vs PCB copper area in open box free air condition
RTHj_amb (C/W)
55
Tj-Tamb=50C
50 45 40 35 30
0 2 4 6 8 10
PCB Cu heatsink area (cm^2)
13/23
VN920 / VN920-B5 / VN920SO
SO-16L THERMAL DATA
SO-16L PC Board
Layout condition of Rth and Zth measurements (PCB FR4 area= 41mm x 48mm, PCB thickness=2mm, Cu thickness=35m, Copper areas: 0.5cm2, 6cm2).
Rthj-amb Vs PCB copper area in open box free air condition
70 65 60 55 50 45 40
RTH j-amb (C/W)
0
1
2
3
4
5
6
7
PCB Cu heatsink area (cm^2)
14/23
1
VN920 / VN920-B5 / VN920SO
SO-16L Thermal Impedance Junction Ambient Single Pulse
ZTH (C/W) 100
0.5 cm2 6 cm2
10
1
0.1
0.01 0.0001
0.001
0.01
0.1
1
10
100
1000
Time (s)
Thermal fitting model of a single channel HSD in SO-16L Pulse calculation formula
Z TH = R TH + Z THtp ( 1 - )
where
= tp T
0.5 0.02 0.1 2.2 12 15 35 0.0015 7.00E-03 1.50E-02 0.14 1 5 6
Thermal Parameter
Area/island (cm2) R1 (C/W) R2 (C/W) R3 ( C/W) R4 (C/W) R5 (C/W) R6 (C/W) C1 (W.s/C) C2 (W.s/C) C3 (W.s/C) C4 (W.s/C) C5 (W.s/C) C6 (W.s/C)
Tj
C1
C2
C3
C4
C5
C6
R1
R2
R3
R4
R5
R6
Pd
20
T_amb
8
15/23
VN920 / VN920-B5 / VN920SO
P2PAK Thermal Impedance Junction Ambient Single Pulse
ZTH (C/W) 1000
100
0.97 cm2 6 cm2
10
1
0.1
0.01 0.0001 0.001 0.01 0.1 1 Time (s) 10 100 1000
Thermal fitting model of a single channel HSD in P2PAK
Pulse calculation formula
Z TH = R TH + Z THtp ( 1 - )
where
= tp T
0.97 0.02 0.1 0.22 4 9 37 0.0015 0.007 0.015 0.4 2 3 6
Thermal Parameter
Area/island (cm2) R1 (C/W) R2 (C/W) R3 ( C/W) R4 (C/W) R5 (C/W) R6 (C/W) C1 (W.s/C) C2 (W.s/C) C3 (W.s/C) C4 (W.s/C) C5 (W.s/C) C6 (W.s/C)
Tj
C1
C2
C3
C4
C5
C6
R1
R2
R3
R4
R5
R6
Pd
22
T_amb
5
16/23
VN920 / VN920-B5 / VN920SO
SO-16L MECHANICAL DATA
DIM. A a1 a2 b b1 C c1 D E e e3 F L M S 7.4 0.5 10.1 10.0 1.27 8.89 7.6 1.27 0.75 8 (max.) 0.291 0.020 10.5 10.65 0.35 0.23 0.5 45 (typ.) 0.397 0.393 0.050 0.350 0.300 0.050 0.029 0.413 0.419 0.1 mm. MIN. TYP MAX. 2.65 0.2 2.45 0.49 0.32 0.014 0.009 0.020 0.004 MIN. inch TYP. MAX. 0.104 0.008 0.096 0.019 0.012
17/23
VN920 / VN920-B5 / VN920SO
PENTAWATT (VERTICAL) MECHANICAL DATA
DIM. A C D D1 E F F1 G G1 H2 H3 L L1 L2 L3 L5 L6 L7 M M1 Diam. 3.65 2.6 15.1 6 4.5 4 3.85 0.144 10.05 17.85 15.75 21.4 22.5 3 15.8 6.6 0.102 0.594 0.236 0.177 0.157 0.152 2.4 1.2 0.35 0.8 1 3.2 6.6 3.4 6.8 mm. MIN. TYP MAX. 4.8 1.37 2.8 1.35 0.55 1.05 1.4 3.6 7 10.4 10.4 0.396 0.703 0.620 0.843 0.886 0.118 0.622 0.260 0.094 0.047 0.014 0.031 0.039 0.126 0.260 0.134 0.268 MIN. inch TYP. MAX. 0.189 0.054 0.110 0.053 0.022 0.041 0.055 0.142 0.276 0.409 0.409
18/23
VN920 / VN920-B5 / VN920SO
P2PAK MECHANICAL DATA
DIM. A A1 A2 b c c2 D D2 E E1 e e1 L L2 L3 L5 R V2 Package Weight 0 1.40 Gr (typ) 3.20 6.60 13.70 1.25 0.90 1.55 0.40 8 10.00 8.50 3.60 7.00 14.50 1.40 1.70 2.40 mm. MIN. 4.30 2.40 0.03 0.80 0.45 1.17 8.95 8.00 10.40 TYP MAX. 4.80 2.80 0.23 1.05 0.60 1.37 9.35
P010R
19/23
VN920 / VN920-B5 / VN920SO
SO-16L TUBE SHIPMENT (no suffix) Base Q.ty Bulk Q.ty Tube length ( 0.5) A B C ( 0.1)
All dimensions are in mm.
A
C B
50 1000 532 3.5 13.8 0.6
TAPE AND REEL SHIPMENT (suffix "13TR") REEL DIMENSIONS
Base Q.ty Bulk Q.ty A (max) B (min) C ( 0.2) F G (+ 2 / -0) N (min) T (max) 1000 1000 330 1.5 13 20.2 16.4 60 22.4
TAPE DIMENSIONS
According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing W P0 ( 0.1) P D ( 0.1/-0) D1 (min) F ( 0.05) K (max) P1 ( 0.1) 16 4 12 1.5 1.5 7.5 6.5 2
End
All dimensions are in mm.
Start Top cover tape 500mm min Empty components pockets saled with cover tape. User direction of feed 500mm min No components Components No components
20/23
1
VN920 / VN920-B5 / VN920SO
PENTAWATT TUBE SHIPMENT (no suffix)
B
C
Base Q.ty Bulk Q.ty Tube length ( 0.5) A B C ( 0.1)
All dimensions are in mm.
50 1000 532 18 33.1 1
A
21/23
VN920 / VN920-B5 / VN920SO
P2PAK TUBE SHIPMENT (no suffix)
B
C
Base Q.ty Bulk Q.ty Tube length ( 0.5) A B C ( 0.1)
All dimensions are in mm.
50 1000 532 18 33.1 1
A
TAPE AND REEL SHIPMENT (suffix "13TR") REEL DIMENSIONS
Base Q.ty Bulk Q.ty A (max) B (min) C ( 0.2) F G (+ 2 / -0) N (min) T (max) 1000 1000 330 1.5 13 20.2 24.4 60 30.4
All dimensions are in mm.
TAPE DIMENSIONS
According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing W P0 ( 0.1) P D ( 0.1/-0) D1 (min) F ( 0.05) K (max) P1 ( 0.1) 24 4 16 1.5 1.5 11.5 6.5 2
End
All dimensions are in mm.
Start Top cover tape No components 500mm min Empty components pockets saled with cover tape. User direction of feed 500mm min Components No components
22/23
VN920 / VN920-B5 / VN920SO
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a trademark of STMicroelectronics (c) 2003 STMicroelectronics - Printed in ITALY- All Rights Reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A. http://www.st.com
23/23

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