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DATA SHEET
GaAs INTEGRATED CIRCUIT
PG174TA
L-BAND PA DRIVER AMPLIFIER
DESCRIPTION
The PG174TA is L-Band PA driver amplifier developed for digital cellular telephone and PCS applications. This device feature high output power and low distortion with 2.8 V low voltage and 35 mA low current operation. It is housed in a very small 6-pin minimold package available on tape-and-reel and easy to install and contributes to miniaturizing the systems.
FEATURES
y Low operation voltage : VDD = 2.8 V : Padj1 = -60 dBc TYP. @ VDD = 2.8 V, fRF = 1 429 to 1 453 MHz, Pout = +10 dBm y Low distortion Off-chip input and output matching y Low operation current : IDD = 35 mA TYP. @ VDD = 2.8 V, fRF = 1 429 to 1 453 MHz, Pout = +10 dBm Off-chip input and output matching y 6-pin minimold package
APPLICATION
y Digital Cellular: PDC1.5G, DCS1800, PCS, etc.
ORDERING INFORMATION
Part Number Package 6-pin minimold Qty 3kp/reel. Supplying Form Carrier tape width is 8 mm.
PG174TA-E3
Remark To order evaluation samples, please contact your local NEC sales office. (Part number for sample order: PG174TA)
ABSOLUTE MAXIMUM RATINGS (TA = +25C)
Parameters Supply Voltage Input Power Total Power Dissipation Operating Ambient Temperature Storage Temperature Symbol VDD Pin Ptot TA Tstg Ratings 6.0 -10 170
Note
Unit V dBm mW C C
-30 to +90 -35 to +150
Note Mounted on a 50 x 50 x 1.6 mm double copper clad epoxy glass PWB, TA = +85C Caution The IC must be handled with care to prevent static discharge because its circuit composed of GaAs HJ-FET.
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.
Document No. P13230EJ2V0DS00 (2nd edition) Date Published January 2000 N CP(K) Printed in Japan
The mark
shows major revised points.
(c)
1998, 2000
PG174TA
PIN CONNECTION AND INTERNAL BLOCK DIAGRAM
Pin No. Connection GND GND IN VDD1 GND VDD2 & OUT
(Top View) 3 2 1
(Bottom View) 3 4 4 5 6 4 5 6 3 2 1 2 1 5 6
1 2 3 4 5 6
RECOMMENDED OPERATING CONDITIONS (TA = +25C)
Parameters Supply Voltage 1, 2 Input Power Symbol VDD1, 2 Pin MIN. +2.7 - TYP. +2.8 -22 MAX. +3.0 -20 Unit V dBm
ELECTRICAL CHARACTERISTICS (Unless otherwise specified, TA = +25C, VDD1 = VDD2 = +2.8 V, /4DQPSK modulated signal input, off-chip input and output matching)
Parameters Operating Frequency Power Gain Total Current Adjacent Channel Power Leakage 1 Adjacent Channel Power Leakage 2 Symbol f GP IDD Padj1 Padj2 Pin = -22 dBm Pin = -22 dBm Pout = +10 dBm, f = 50 kHz Pout = +10 dBm, f = 100 kHz Test Conditions MIN. 1 429 32.0 - - - TYP. - 34.0 35 -60 -65 MAX. 1 453 - 40 -55 -60 Unit MHz dB mA dBc dBc
REFERENCE CHARACTERISTICS (Unless otherwise specified, TA = +25C, VDD1 = VDD2 = +2.8 V, f = 1 429 to 1 453 MHz, off-chip input and output matching)
Parameters Input Return Loss Output Return Loss Symbol RLin RLout MIN. - - TYP. 10 10 MAX. - - Unit dB dB
2
G1D
Data Sheet P13230EJ2V0DS00
PG174TA
EVALUATION CIRCUIT VDD1 = VDD2 = +2.8 V, f = 1 429 to 1 453 MHz
VDD1 VDD2 C2 R1
C1
L2
OUT C3 4 5 6 Zo = 50
3
IN Zo = 50 L1
Using the NEC Evaluation board
Parts List C1, C2 C3 R1 L1 L2 Value 1 000 pF 2.0 pF 10 6.8 nH 3.3 nH
Data Sheet P13230EJ2V0DS00
G1D
2 1
3
PG174TA
EVALUATION BOARD (Epoxy Glass, = 4.6, 0.4 mm thickness)
VDD1
OUT
VDD2 38 mm
IN
40 mm
VDD1
OUT C3 R1 C1 L2 C2 VDD2
L1
IN
4
Data Sheet P13230EJ2V0DS00
PG174TA
TYPICAL CHARACTERISTICS
OUTPUT POWER AND ADJACENT CHANNEL POWER LEAKAGE vs. INPUT POWER @VDD = +2.8 V, f = 1 450 MHz 20
-20
15
Pout
-30
10
Padj1
-40
5
-50
Padj2 0 -60
-70
-35
-30
-25 Input Power Pin (dBm)
-20
-80 -15
Adjacent Channel Power Leakage Padj1, Padj2 (dBc)
Output Power Pout (dBm)
Data Sheet P13230EJ2V0DS00
5
PG174TA
POWER GAIN AND TOTAL CURRENT vs. INPUT POWER @VDD = -2.8 V, f = 1 450 MHz 40 40
Gp 35 35
IDD
30 -35
-25 Input Power Pin (dBm)
30 -15
6
Data Sheet P13230EJ2V0DS00
Total Current IDD (mA)
Power Gain Gp (dB)
PG174TA
PACKAGE DIMENSIONS 6 PIN MINIMOLD PACKAGE (UNIT: mm)
0.3 -0.0
+0.1
0.13 0.1
1
2.8 -0.3
+0.2
2
3
1.5 -0.1
+0.2
0 to 0.1 6 5 0.95 4 0.95 0.8 1.1-0.1
+0.2
1.9 2.9 0.2
Data Sheet P13230EJ2V0DS00
7
PG174TA
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your NEC sales representative.
Soldering Method Infrared Reflow
Soldering Conditions Package peak temperature: 235C or below Time: 30 seconds or less (at 210C) Note Count: 3, Exposure limit: None Package peak temperature: 215C or below Time: 40 seconds or less (at 200C) Note Count: 3, Exposure limit: None Soldering bath temperature: 260C or below Time: 10 seconds or less Note Count: 1, Exposure limit: None Pin temperature: 300C Time: 3 seconds or less (per side of device) Note Exposure limit: None
Recommended Condition Symbol IR35-00-3
VPS
VP15-00-3
Wave Soldering
WS60-00-1
Partial Heating
-
Note After opening the dry pack, keep it in a place below 25C and 65% RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
8
Data Sheet P13230EJ2V0DS00
PG174TA
[MEMO]
Data Sheet P13230EJ2V0DS00
9
PG174TA
[MEMO]
10
Data Sheet P13230EJ2V0DS00
PG174TA
[MEMO]
Data Sheet P13230EJ2V0DS00
11
PG174TA
Caution
The Great Care must be taken in dealing with the devices in this guide. The reason is that the material of the devices is GaAs (Gallium Arsenide), which is designated as harmful substance according to the law concerned. Keep the law concerned and so on, especially in case of removal.
* The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. * No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. * NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. * Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. * While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. * NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance.
M7 98. 8

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