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| ICX088AK Diagonal 4.5mm (Type 1/4) CCD Image Sensor for NTSC Color Video Cameras Description The ICX088AK is an interline CCD solid-state image sensor suitable for NTSC color digital video cameras. This chip supports DV standard SD mode, and can drive at 13.5MHz. High sensitivity, wide dynamic range and low dark current are achieved through the adoption of Super HAD CCD technology. In addition, high resolution is achieved through the adoption of Ye, Cy, Mg and G complementary color mosaic filters. This chip features a field period readout system and an electronic shutter with variable charge-storage time. The package is a 14-pin DIP (Plastic), and both top and bottom surface reference can be assured at the same time. 14 pin DIP (Plastic) Pin 1 2 V Features * Supports DV standard SD mode (13.5MHz) 2 * High resolution, high sensitivity and wide dynamic range 40 H Pin 8 * Low dark current and low smear * Excellent antiblooming characteristics Optical black position * Supply voltage: 12V (Top View) * Horizontal register drive amplitude: 2.7 to 3.6V * No voltage adjustment (Reset gate and substrate bias are not adjusted.) * Continuous variable-speed shutter * Recommended range of exit pupil distance: -20 to -100mm * Ye, Cy, Mg and G complementary color mosaic filters on chip * 14-pin high precision plastic package (both top and bottom surface reference possible) Device Structure * Interline CCD image sensor * Image size: * Total number of pixels: * Total number of effective pixels: * Chip size: * Unit cell size: * Optical black: * Number of dummy bits: * Substrate material: 12 Diagonal 4.5mm (Type 1/4) 766 (H) x 508 (V) approx. 390K pixels 724 (H) x 494 (V) approx. 360K pixels 4.60mm (H) x 3.97mm (V) 5.05m (H) x 5.55m (V) Horizontal (H) direction: Front 2 pixels, rear 40 pixels Vertical (V) direction: Front 12 pixels, rear 2 pixels Horizontal 20 Vertical 1 (even fields only) Silicon Super HAD CCD is a registered trademark of Sony Corporation. Super HAD CCD is a CCD that drastically improves sensitivity by introducing newly developed semiconductor technology by Sony Corporation into Sony's high-performance HAD (Hole-Accumulation Diode) sensor. Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. -1- E97707A99 ICX088AK VOUT GND VL V1 V2 V3 7 6 5 Cy 4 Ye G Ye Mg Ye G 3 Cy Mg Cy G Cy Mg 2 Ye G Ye Mg Ye G Vertical Register Mg Cy G Cy Mg Horizontal Register Note) 8 9 10 11 12 13 14 : Photo sensor Pin Description Pin No. Symbol 1 2 3 4 5 6 7 V4 V3 V2 V1 VL GND VOUT Description SUB CSUB GND Pin No. Symbol 8 9 10 11 12 13 14 VDD GND SUB CSUB RG H1 H2 RG VDD H2 H1 V4 1 Note) Block Diagram and Pin Configuration (Top View) Description Supply voltage GND Substrate clock Substrate bias 1 Reset gate clock Horizontal register transfer clock Horizontal register transfer clock Vertical register transfer clock Vertical register transfer clock Vertical register transfer clock Vertical register transfer clock Protective transistor bias GND Signal output 1 DC bias is generated within the CCD, so that this pin should be grounded externally through a capacitance of 0.1F. Absolute Maximum Ratings Item VDD, VOUT, RG - SUB V1, V3 - SUB Against SUB V2, V4, VL - SUB H1, H2, GND - SUB CSUB - SUB VDD, VOUT, RG, CSUB - GND Against GND V1, V2, V3, V4 - GND H1, H2 - GND Against VL V1, V3 - VL V2, V4, H1, H2, GND - VL Voltage difference between vertical clock input pins Between input clock pins Storage temperature Operating temperature 2 +24V (Max.) when clock width < 10s, clock duty factor < 0.1%. -2- H1 - H2 H1, H2 - V4 Ratings -40 to +8 -50 to +15 -50 to +0.3 -40 to +0.3 -25 to -0.3 to +18 -10 to +18 -10 to +5 -0.3 to +28 -0.3 to +15 to +15 -5 to +5 -13 to +13 -30 to +80 -10 to +60 Unit Remarks V V V V V V V V V V V V V C C 2 ICX088AK Bias Conditions Item Supply voltage Protective transistor bias Substrate clock Reset gate clock Symbol VDD VL SUB RG Min. 11.64 Typ. 12.0 1 2 2 Max. 12.36 Unit V Remarks 1 VL setting is the VVL voltage of the vertical transfer clock waveform, or the same power supply as the VL power supply for the V driver should be used. 2 Do not apply a DC bias to the substrate clock and reset gate clock pins, because a DC bias is generated within the CCD. DC Characteristics Item Supply current Symbol IDD Min. Typ. 5.0 Max. Unit mA Remarks Clock Voltage Conditions Item Readout clock voltage Symbol VVT VVH1, VVH2 VVH3, VVH4 VVL1, VVL2, VVL3, VVL4 VV Vertical transfer clock voltage VVH3 - VVH VVH4 - VVH VVHH VVHL VVLH VVLL Horizontal transfer clock voltage Reset gate clock voltage VH VHL VRG VRGLH - VRGLL VRGL - VRGLm Substrate clock voltage VSUB 17.3 18.5 2.7 -0.05 2.7 3.3 0 3.3 Min. 11.64 -0.05 -0.2 -6.85 5.95 -0.25 -0.25 Typ. 12.0 0 0 -6.5 6.5 Max. 12.36 0.05 0.05 -6.15 6.9 0.1 0.1 0.3 0.3 0.3 0.3 3.6 0.05 3.6 0.4 0.5 19.3 Unit V V V V V V V V V V V V V V V V V Waveform diagram 1 2 2 2 2 2 2 2 2 2 2 3 3 4 4 4 5 Low-level coupling Low-level coupling High-level coupling High-level coupling Low-level coupling Low-level coupling VVL = (VVL3 + VVL4)/2 VV = VVHn - VVLn (n = 1 to 4) VVH = (VVH1 + VVH2)/2 Remarks -3- ICX088AK Clock Equivalent Circuit Constant Item Capacitance between vertical transfer clock and GND Symbol CV1, CV3 CV2, CV4 CV12, CV34 Capacitance between vertical transfer clocks CV23, CV41 CV13 CV24 Capacitance between horizontal transfer clock and GND Capacitance between horizontal transfer clocks Capacitance between reset gate clock and GND Capacitance between substrate clock and GND Vertical transfer clock series resistor Vertical transfer clock ground resistor Horizontal transfer clock series resistor Horizontal transfer clock ground resistor CH1, CH2 CHH CRG CSUB R1, R2, R3, R4 RGND RH RH2 Min. Typ. 680 470 330 270 82 75 47 47 5 180 82 15 12 30 Max. Unit Remarks pF pF pF pF pF pF pF pF pF pF k V1 CV12 V2 R1 R2 RH H1 RH H2 CHH CV23 CV13 CH1 CH2 RH2 CV1 CV41 CV24 CV2 CV4 RGND CV3 R4 CV34 R3 V4 V3 Vertical transfer clock equivalent circuit Horizontal transfer clock equivalent circuit -4- ICX088AK Drive Clock Waveform Conditions (1) Readout clock waveform 100% 90% II II M M 2 tf 0V VVT 10% 0% tr twh (2) Vertical transfer clock waveform V1 V3 VVH1 VVHH VVH VVHL VVHH VVHH VVHL VVHL VVH3 VVHH VVHL VVH VVL1 VVLH VVL3 VVLL VVL VVLH VVL VVLL V2 VVHH VVHH V4 VVHH VVHH VVH VVHL VVH VVH2 VVHL VVHL VVH4 VVHL VVL2 VVLH VVLH VVLL VVL VVL4 VVLL VVL VVH = (VVH1 + VVH2)/2 VVL = (VVL3 + VVL4)/2 VV = VVHn - VVLn (n = 1 to 4) -5- ICX088AK (3) Horizontal transfer clock waveform tr H2 90% VCR VH 10% H1 two VH 2 twh tf twl VHL Cross-point voltage for the H1 rising side of the horizontal transfer clocks H1 and H2 waveforms is VCR. The overlap period for twh and twl of horizontal transfer clocks H1 and H2 is two. (4) Reset gate clock waveform tr twh tf RG waveform VRGH twl VRG Point A VRGLH VRGLL VRGLm VRGL VRGLH is the maximum value and VRGLL is the minimum value of the coupling waveform during the period from Point A in the above diagram until the rising edge of RG. In addition, VRGL is the average value of VRGLH and VRGLL. VRGL = (VRGLH + VRGLL) /2 Assuming VRGH is the minimum value during the interval twh, then: VRG = VRGH - VRGL. Negative overshoot level during the falling edge of RG is VRGLm. (5) Substrate clock waveform 100% 90% M VSUB 10% 0% M 2 tf VSUB (A bias generated within the CCD) tr twh -6- ICX088AK Clock Switching Characteristics Item Readout clock Vertical transfer clock Horizontal transfer clock Symbol VT V1, V2, V3, V4 H1 H2 twh twl tr tf Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. 1.58 1.78 0.5 0.5 Unit Remarks s During readout During 15 25 25 28 28 5.36 5.36 11 13 51 25 25 28 28 9 9 0.01 0.01 3 0.5 12 12 9 9 0.01 0.01 3 250 ns CXD1267AN used During imaging 12 12 ns VH = 2.7V 1 s ns During tf tr - 2ns During H1 parallel-serial conversion H2 Reset gate clock RG Substrate clock SUB 2.0 2.96 0.5 s drain charge 1 The cross-point voltage (VCR) for the H1 rising side of the H1 and H2 waveforms must be at least VH/2 [V]. Item Horizontal transfer clock Symbol H1, H2 two Min. 25 Typ. 28 Max. Unit ns Remarks Spectral Sensitivity Characteristics (excludes both lens characteristics and light source characteristics) 1.0 Ye 0.8 Cy G Relative Response 0.6 0.4 Mg 0.2 0.0 400 450 500 550 Wave Length [nm] 600 650 700 -7- ICX088AK Image Sensor Characteristics Item Sensitivity Sensitivity ratio Saturation signal Smear Video signal shading Uniformity between video signal channels Dark signal Dark signal shading Flicker Y Flicker R-Y Flicker B-Y Line crawl R Line crawl G Line crawl B Line crawl W Lag Symbol S RMgG RYeCy Ysat Sm SHy Sr Sb Ydt Ydt Fy Fcr Fcb Lcr Lcg Lcb Lcw Lag Min. 390 0.93 1.15 800 0.009 0.015 20 25 10 10 2 1 2 5 5 3 3 3 3 0.5 Typ. 480 1.35 1.48 mV % % % % % mV mV % % % % % % % % Max. Unit mV Measurement method 1 2 2 3 4 5 5 6 6 7 8 9 9 9 10 10 10 10 11 (Ta = 25C) Remarks Ta = 60C Zone 0 and I Zone 0 to II' Ta = 60C Ta = 60C Zone Definition of Video Signal Shading 724 (H) 10 10 8 H 8 V 10 H 8 494 (V) Zone 0, I Zone II, II' V 10 10 lgnored region Effective pixel region Measurement System [A] CCD signal output LPF1 (3dB down 6.3MHz) [Y] Y signal output CCD C.D.S AMP SH LPF2 S H (3dB down 1MHz) [C] Chroma signal output Note) Adjust the amplifier gain so that the gain between [A] and [Y], and between [A] and [C] equals 1. -8- ICX088AK Image Sensor Characteristics Measurement Method Measurement conditions 1) In the following measurements, the device drive conditions are at the typical values of the bias and clock voltage conditions. In the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical black level (OB) is used as the reference for the signal output, which is taken as the value of Y signal output or chroma signal output of the measurement system. Color coding of this image sensor & Composition of luminance (Y) and chroma (color difference) signals As shown in the left figure, fields are read out. The charge is mixed by pairs such as A1 and A2 in the A field. (pairs such as B in the B field) As a result, the sequence of charges output as signals from the horizontal shift register (Hreg) is, for line A1, (G + Cy), (Mg + Ye), (G + Cy), and (Mg + Ye). 2) Cy G B Cy Mg Ye Mg Ye G Cy G Cy Mg Ye A1 Mg Ye A2 G Hreg Color Coding Diagram These signals are processed to form the Y signal and chroma (color difference) signal. The Y signal is formed by adding adjacent signals, and the chroma signal is formed by subtracting adjacent signals. In other words, the approximation: Y = {(G + Cy) + (Mg + Ye)} x 1/2 = 1/2 {2B + 3G +2R} is used for the Y signal, and the approximation: R - Y = {(Mg + Ye) - (G + Cy)} = {2R - G} is used for the chroma (color difference) signal. For line A2, the signals output from Hreg in sequence are (Mg + Cy), (G + Ye), (Mg + Cy), (G + Ye). The Y signal is formed from these signals as follows: Y = {(G + Ye) + (Mg + Cy)} x 1/2 = 1/2 {2B + 3G +2R} This is balanced since it is formed in the same way as for line A1. In a like manner, the chroma (color difference) signal is approximated as follows: -(B - Y) = {(G + Ye) - (Mg + Cy)} = - {2B - G} In other words, the chroma signal can be retrieved according to the sequence of lines from R - Y and -(B - Y) in alternation. This is also true for the B field. -9- ICX088AK Definition of standard imaging conditions 1) Standard imaging condition I: Use a pattern box (luminance 706cd/m2, color temperature of 3200K halogen source) as a subject. (Pattern for evaluation is not applicable.) Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter and image at F5.6. The luminous intensity to the sensor receiving surface at this point is defined as the standard sensitivity testing luminous intensity. Standard imaging condition II: Image a light source (color temperature of 3200K) with a uniformity of brightness within 2% at all angles. Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter. The luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm. Standard imaging condition III: Image a light source (color temperature of 3200K) with a uniformity of brightness within 2% at all angles. Use a testing standard lens (exit pupil distance -33mm) with CM500S (t = 1.0mm) as an IR cut filter. The luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm. Sensitivity Set to standard imaging condition I. After selecting the electronic shutter mode with a shutter speed of 1/250s, measure the Y signal (Ys) at the center of the screen and substitute the value into the following formula. S = Ys x 2. 250 [mV] 60 2) 3) 1. Sensitivity ratio Set to standard imaging condition II. Adjust the luminous intensity so that the average value of the Y signal output is 200mV, and then measure the Mg signal output (SMg [mV]) and G signal output (SG [mV]), and Ye signal output (SYe [mV]) and Cy signal output (SCy [mV]) at the center of the screen with frame readout method. Substitute the values into the following formula. RMgG = SMg/SG RYeCy = SYe/SCy 3. Saturation signal Set to standard imaging condition II. After adjusting the luminous intensity to 10 times the intensity with average value of the Y signal output, 200mV, measure the minimum value of the Y signal. Smear Set to standard imaging condition II. With the lens diaphragm at F5.6 to F8, adjust the luminous intensity to 500 times the intensity with average value of the Y signal output, 200mV. When the readout clock is stopped and the charge drain is executed by the electronic shutter at the respective H blankings, measure the maximum value YSm [mV] of the Y signal output and substitute the value into the following formula. Sm = 1 YSm 1 x x x 100 [%] (1/10V method conversion value) 10 200 500 4. 5. Video signal shading Set to standard imaging condition III. With the lens diaphragm at F5.6 to F8, adjust the luminous intensity so that the average value of the Y signal output is 200mV. Then measure the maximum (Ymax [mV]) and minimum (Ymin [mV]) values of the Y signal and substitute the values into the following formula. SHy = (Ymax - Ymin)/200 x 100 [%] 6. Uniformity between video signal channels Set to standard imaging condition II. Adjust the luminous intensity so that the average value of the Y signal output is 200mV, and then measure the maximum (Crmax, Cbmax [mV]) and minimum (Crmin, Cbmin [mV]) values of the R - Y and B - Y channels of the chroma signal and substitute the values into the following formula. Sr = | (Crmax - Crmin)/200 | x 100 [%] Sb = | (Cbmax - Cbmin)/200 | x 100 [%] - 10 - ICX088AK 7. Dark signal Measure the average value of the Y signal output (Ydt [mV]) with the device ambient temperature 60C and the device in the light-obstructed state, using the horizontal idle transfer level as a reference. Dark signal shading After measuring 7, measure the maximum (Ydmax [mV]) and minimum (Ydmin [mV]) values of the Y signal output and substitute the values into the following formula. Ydt = Ydmax - Ydmin [mV] 8. 9. Flicker 1) Fy Set to standard imaging condition II. Adjust the luminous intensity so that the average value of the Y signal output is 200mV, and then measure the difference in the signal level between fields (Yf [mV]). Then substitute the value into the following formula. Fy = (Yf/200) x 100 [%] 2) Fcr, Fcb Set to standard imaging condition II. Adjust the luminous intensity so that the average value of the Y signal output is 200mV, insert an R and B filter, and then measure both the difference in the signal level between fields of the chroma signal (Cr, Cb) as well as the average value of the chroma signal output (CAr, CAb). Substitute the values into the following formula. Fci = (Ci/CAi) x 100 [%] (i = r, b) 10. Line crawls Set to standard imaging condition II. Adjust the luminous intensity so that the average value of the Y signal output is 200mV, and then insert a white subject and R, G, and B filters and measure the difference between Y signal lines for the same field (Ylw, Ylr, Ylg, Ylb [mV]). Substitute the values into the following formula. Lci = (Yli/200) x 100 [%] (i = w, r, g, b) 11. Lag Adjust the Y signal output value generated by strobe light to 200mV. After setting the strobe light so that it strobes with the following timing, measure the residual signal (Ylag). Substitute the value into the following formula. Lag = (Ylag/200) x 100 [%] FLD V1 Light Strobe light timing Y signal output 200mV Output Ylag (lag) - 11 - Drive Circuit 12V 20 100k 19 18 1/35V -6.5V 3.3/16V 22/16V 100 2SK523 1 2 3 7 4 5 6 CCD OUT 3.9k 17 CXD1267AN 15 14 13 12 11 16 1 22/20V 2 3 XSUB 4 XV2 5 XV1 6 XSG1 7 XV3 8 XSG2 9 V4 V3 V2 V1 VL GND ICX088 (BOTTOM VIEW) VOUT RG H1 H2 CSUB SUB GND VDD - 12 - 14 13 12 11 10 9 8 0.1 0.1 0.1 2200p 1M XV4 10 3.3/20V 0.01 H2 H1 RG ICX088AK Drive Timing Chart (Vertical Sync) FLD VD BLK HD 10 520 525 1 2 3 4 5 15 20 260 265 270 275 V1 - 13 - 494 24 6 35 24 6 135 493 V2 V3 V4 13 5 24 6 135 246 493 CCD OUT 494 OB CLP 280 ICX088AK Drive Timing Chart (Readout) ( odd field ) 72 858 0 546 70 72 0 H1 504 528 16 V1 528 552 86 8 V2 528 540 510 564 570 94 78 V3 - 14 - 528 540 510 570 564 546 504 528 528 552 V4 ( even field ) 16 32 V1 8 24 V2 V3 V4 ICX088AK Drive Timing Chart (Horizontal Sync) 0 72 H1 H2 1 5 1 30 20 6 7 10 20 39 40 10 20 30 5 717 718 724 1 10 11 Effective region Ignored region Effective OB Dummy bit Effective region Ignored region RG 8 24 0 16 56 40 48 32 V1 - 15 - -6 V2 V3 V4 SUB OB CLP -30 ICX088AK ICX088AK Notes on Handling 1) Static charge prevention CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non-chargeable gloves, clothes or material. Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensor. e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges. 2) Soldering a) Make sure the package temperature does not exceed 80C. b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a ground 30W soldering iron and solder each pin in less than 2 seconds. For repairs and remount, cool sufficiently. c) To dismount an image sensor, do not use a solder suction equipment. When using an electric desoldering tool, use a thermal controller of the zero cross On/Off type and connect it to ground. 3) Dust and dirt protection Image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and dirt. Clean glass plates with the following operation as required, and use them. a) Perform all assembly operations in a clean room (class 1000 or less). b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air is recommended.) c) Clean with a cotton bud and ethyl alcohol if the grease stained. Be careful not to scratch the glass. d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving to a room with great temperature differences. e) When a protective tape is applied before shipping, just before use remove the tape applied for electrostatic protection. Do not reuse the tape. 4) Installing (attaching) a) Remain within the following limits when applying a static load to the package. Do not apply any load more than 0.7mm inside the outer perimeter of the glass portion, and do not apply any load or impact to limited portions. (This may cause cracks in the packege.) Cover glass 50N Plastic package Compressive strength 50N 1.2Nm Torsional strength b) If a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the bottom of the package. Therefore, for installation, use either an elastic load, such as a spring plate, or an adhesive. - 16 - ICX088AK c) The adhesive may cause the marking on the rear surface to disappear, especially in case the regulated voltage value is indicated on the rear surface. Therefore, the adhesive should not be applied to this area, and indicated values should be transferred to the other locations as a precaution. d) The notch of the package is used for directional index, and that can not be used for reference of fixing. In addition, the cover glass and seal resin may overlap with the notch of the package. e) If the lead bend repeatedly and the metal, etc., clash or rub against the package, the dust may be generated by the fragments of resin. f) Acrylate anaerobic adhesives are generally used to attach CCD image sensors. In addition, cyanoacrylate instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives. (reference) 5) Others a) Do not expose to strong light (sun rays) for long periods, color filters will be discolored. When high luminance objects are imaged with the exposure level control by electronic-iris, the luminance of the image-plane may become excessive and discolor of the color filter will possibly be accelerated. In such a case, it is advisable that taking-lens with the automatic-iris and closing of the shutter during the power-off mode should be properly arranged. For continuous using under cruel condition exceeding the normal using condition, consult our company. b) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions. c) The brown stain may be seen on the bottom or side of the package. But this does not affect the CCD characteristics. d) This package has 2 kinds of internal structure. However, their package outline, optical size, and strength are the same. Structure A Package Chip Metal plate (lead frame) Structure B Cross section of lead frame The cross section of lead frame can be seen on the side of the package for structure A. - 17 - Package Outline Unit: mm 14 pin DIP (400mil) A 0 to 9 5.0 8 D C 8 14 14 ~ 10.16 7.0 ~ 2.5 5.0 V 7 7 1 H 0.5 B' 1. "A" is the center of the effective image area. 1.0 3.35 0.15 7.0 2.5 2.6 1.27 3.5 0.3 - 18 - 2. The two points "B" of the package are the horizontal reference. The point "B'" of the package is the vertical reference. 3. The bottom "C" of the package, and the top of the cover glass "D" are the height reference. 4. The center of the effective image area relative to "B" and "B'" is (H, V) = (5.0, 5.0) 0.15mm. 5. The rotation angle of the effective image area relative to H and V is 1. ~ 1.27 M 0.3 0.46 6. The height from the bottom "C" to the effective image area is 1.41 0.10mm. The height from the top of the cover glass "D" to the effective image area is 1.94 0.15mm. 7. The tilt of the effective image area relative to the bottom "C" is less than 25m. The tilt of the effective image area relative to the top "D" of the cover glass is less than 25m. 8. The thickness of the cover glass is 0.75mm, and the refractive index is 1.5. 9. The notch of the package is used only for directional index, that must not be used for reference of fixing. 0.3 PACKAGE STRUCTURE PACKAGE MATERIAL Plastic LEAD TREATMENT GOLD PLATING LEAD MATERIAL 42 ALLOY PACKAGE WEIGHT 0.6g 0.25 1.0 1 8.9 10.0 0.1 8.9 10.0 0.1 1.7 B 1.7 2.5 ICX088AK |
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