View UPC8139GR-7JH_10444.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

PRELIMINARY DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
PC8139GR-7JH
Single Chip Transceiver Silicon MMIC for PHS
DESCRIPTION
The PC8139GR-7JH is a silicon microwave monolithic IC (SiMMIC) developed as a transceiver for Personal Handyphone System (PHS). This IC is a highly integrated single chip, suitable for PHS, including a quadrature modulator, up converter, and AGC circuit for adjusting the output level in the transmitter block, a 2nd down converter and RSSI circuit in the receiver block, and a transistor for 2nd VCO. This low power IC employs NEC's proprietary bipolar process NESATTM IV (fT = 20 GHz) and also has a built-in power save function, which contributes to lowering power consumption of the RF block. This IC is packaged in a small, thin 30 pin plastic TSSOP (225 mil).
FEATURES
* Low voltage operation, low current consumption VCC = 2.7 to 4.0 V, ICC = 32.5 mA at transmitter, ICC = 4.8 mA at receiver, 3.2 mA/@VCC = 3 V at 2nd VCO block * LPF is installed to suppress leakage of transmitter's local (L01) harmonics. Spurious within transmission band (LO1 x 7, 8): -55 dBc (MAX.) * On-chip AGC circuit for adjusting the output level: GCR = 20 dB (MIN.) /@fRFout = 1906.55 MHz * High-performance Output level: PRFout = -13 dBm (TYP.) /@fRFout = 1906.55 MHz, VI/Q = 500 mVP-P (Differential phase) Error vector magnitude: EVM = 1.0% rms (TYP.) Adjacent channel leak power: Padj = -68 dBc (TYP.) /@f = 600 kHz RSSI output dynamic range: 83 dB * CR phase shifter is adopted.
APPLICATION
* Digital cordless telephone: PHS * PHS application equipment: PDA, PC card, etc.
ORDERING INFORMATION
Part Number Package 30-pin plastic TSSOP (225 mil) Supplying Form Embossed tape 16 mm-wide. Pin 1 is in pull-out direction. 2.5 kp/reel
PC8139GR-7JH-E1
Remark
To order evaluation samples, contact your local NEC sales office. (Part Number for sample order:
PC8139GR-7JH)
Caution This product is an electrostatic sensitive device.
The information in this document is subject to change without notice.
Document No. P13117EJ1V0DS00 (1st edition) Date Published December 1998 N CP(K) Printed in Japan
(c)
1998
PC8139GR-7JH
SYSTEM APPLICATION EXAMPLE
[PHS]
PC8112
1895.15 to 1917.95 MHz or (1906.5511.4 MHz) MAIN ANT 1651.2 to 1674.0 MHz or 1646.7 to 1669.5 MHz SW 1662.0 to 1684.8 MHz or 1635.9 to 1658.7 MHz SW 2SC5006 1st LO PLL1 PLL2 2nd LO ATT LNA BPF 1st MIX 243.95 MHz or 248.45 MHz SAW 10.8 MHz 2nd MIX BPF To DEMOD. RSSI 233.15 MHz or 259.25 MHz RSSI OUT
AGC 0 (CR) PA BPF LPF 90
I
Q
PC8139GR-7JH
QUADRATURE MODULATOR IC SERIES PRODUCT LIST
Part Number Function ICC (mA) 15 /@2.7 V 28 /@3.0 V fLO1in (MHz) 100 to 300 fMODout (MHz) 50 to 150 Up Converter fRFout (MHz) External Phase Shifter Type F/F Application Field Package
PC8101GR PC8104GR
150-MHz quadrature modulator RF up converter + IF quadrature modulator
CT-2, etc. Various digital communications Various digital communications PDC800 MHz, etc. PHS
20 pin SSOP (225 mil)
100 to 400
900 to 1900
Multiplier + F/F
PC8105GR
400-MHz quadrature modulator
16 /@3.0 V 24 /@3.0 V 36 /@3.0 V
100 to 400
External
Multiplier + F/F Multiplier + F/F Multiplier + F/F
16 pin SSOP (225 mil) 20 pin SSOP (225 mil)
PC8110GR PC8125GR
1-GHz direct quadrature modulator On-chip AGC function RF up converter + IF quadrature modulator On-chip local PreMIX 1-GHz direct quadrature modulator LO x 2 frequency input type IF quadrature modulator + RF up converter On-chip AGC function RF up converter + IF quadrature modulator
800 to 1000
Direct modulation 1800 to 2000
220 to 270
PC8126GR PC8126K PC8129GR
35 /@3.0 V
915 to 960
Direct modulation
Multiplier + F/F
PDC800 MHz, etc.
28 pin QFN 20 pin SSOP (225 mil) 28 pin QFN
28 /@3.0V
200 to 800
100 to 400
800 to 1900
F/F
GSM, DCS1800, etc. PDC800 M/1.5 G
PC8158K
28 /@3.0 V
100 to 300
800 to 1500
CR
For an outline of the quadrature modulator IC series, see the application note "Usage of PC8101, 8104, 8105, 8125, and 8129" (document number P13251E).
2
Preliminary Data Sheet
PC8139GR-7JH
INTERNAL BLOCK DIAGRAM AND PIN CONNECTIONS (Top View)
I Ib Q Qb VCC1 GND1 VCC2 VCOout GND2 VCO-E VCO-B VCO-C VCC3 IFout RSSIout
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 2nd VCO LO Buff. LO Buff. 90 Phase shifter (CR) IQ Mix. Adder
Up Con.
30 29
TX MIXout VCC6 TX MIX-LOin GND5 TX MIX-LOinb VCC5 VPS (TX) /VAGC VPS (RX) 2nd MIXin 2nd MIXinb
Note
LPF AGC 28 27 26 25 24 23 2nd Mix 22 21 20 19 18 17 RSSI 16
2nd MIXout VCC4 GND3 IFin2 IFin1
2nd IF Amp
Note Pin 21 was specified to function as the GND4 in the initial design sample, however in subsequent design samples and commercial products it functions as the 2nd MIXinb.
Preliminary Data Sheet
3
PC8139GR-7JH
ABSOLUTE MAXIMUM RATINGS
Parameter Power supply voltage Symbol VCC Condition Pins 5, 7, 12, 13, 19, 25, 29, 30 TA = +25C Pin 23, Pin 24, TA = +25C TA = +80C
Note
Rating 4.5
Unit V
Power save pin voltage Power dissipation Operating ambient temperature Storage temperature Pin current of Pin 8 Pin current of Pin 10 Collector to base voltage in VCO Collector to emitter voltage in VCO Emitter to base voltage in VCO
VPS PD TA Tstg I8 pin I10 pin VCBO VCEO VEBO
4.5 TBD -30 to +80 -55 to +150 4 4
V mW C C mA mA V V V
Pin 12 Pin 11 Pin 12 Pin 10 Pin 10 Pin 11
4.5 4.5 3.0
Note When mounted on 50 x 50 x 1.6 mm double sided copper clad epoxy glass board
RECOMMENDED OPERATING RANGE
Parameter Power supply voltage Symbol VCC Condition Pins 5, 7, 12, 13, 19, 25, 29, 30 Pin 23, Pin 24 MIN. 2.7 TYP. 3.0 MAX. 4.0 Unit V
Power save pin voltage Operating ambient temperature TX up converter output frequency TX up converter LO input frequency TX up converter input frequency IQ-MOD output frequency 2nd VCO oscillating frequency (IQ-MOD LO, 2nd MIX LO input frequency) 2nd MIX input frequency 2nd MIX output frequency 2nd IF amplifier input frequency 2nd IF amplifier output frequency I/Q input frequency
VPS TA fTX * MIXout fTX * MIX-LOin fTX * MIXin fMODout f2ndVCO (fMOD * LOin, f2ndMIX-LOin) f2ndMIXin f2ndMIXout f2ndIFin f2ndIFout fI/Qin
0 -30 1800
- +25 - - -
VCC +80 2000 1800 270
V C MHz MHz MHz
PTX * MIX-LOin = -10 dBm
1500 220
8 8
10.8 10.8
12 12
MHz MHz
VI/Qin = 600 mVP-P (MAX.), Double phase
DC
-
10
MHz
TX up converter LO input level 2nd MIX input level 2nd IF amplifier input level I/Q input amplitude
PTX * MIX-LOin P2ndMIXin P2ndIFin VI/Qin Double phase input I/Q (DC) = Ib/Qb (DC) = VCC/2
-15 -90 23 -
-10 - - 500
-5 -10 108 600
dBm dBm dB VEMF mVP-P
4
Preliminary Data Sheet
PC8139GR-7JH
ELECTRICAL SPECIFICATIONS (1)
TA = +25C, VCC = 3.0 V, unless otherwise specified, VPS-TX/VAGC = 3.0 V, VPS-RX = 3.0 V (high), I/Q (DC) = Ib/Qb (DC) = VCC/2 = 1.5 V, VI/Qin = 500 mVP-P (double phase input) , fI/Qin = 24 kHz, /4DQPSK modulated wave input Transmission rate: 384 kbps, Filter roll-off rate : = 0.5, MOD pattern: all zero, fMOD
* LOin
= 233.15 MHz,
PMODLOin = -7 dBm, fTX * MIX-LOin = 1673.4 MHz, PTX * MIX-LOin = -10 dBm, fTX * MIXout = 1906.55 MHz + fI/Qin
Parameter Total characteristics Total circuit current (TX + RX + VCO) ICC (TOTAL) No signal input 33 40.5 49 mA Symbol Condition MIN. TYP. MAX. Unit
Transmitter block total characteristics (quadrature modulator + up converter + AGC circuit) Total circuit current (TX) Dark current at power save (TX) ICC (TX-TOTAL) ICC (PS) TX-TOTAL No signal input VPS 0.5 V (Low), No signal input 27 - 32.5 0.1 39.5 5 mA
A
Transmitter block (quadrature modulator + up converter + AGC circuit) Total output level Local carrier leak Image rejection (side-band leak) I/Q 3rd order inter-modulation distortion AGC circuit gain control range Error vector magnitude (vector error) Adjacent channel leak power PTX * MIXout LOL ImR IM3 (I/Q) VAGC = 3 V 1 V MOD pattern: PN 9 VAGC = 3.0 V fMODin * LOin + fTX * MIX-LOin -17 - - - -13 -40 -40 -50 - -30 -30 -30 dBm dBc dBc dBc
GCR EVM Padj
20 - -
35 1.0 -68
- 5 -60
dB %rms dBc
f = 600 kHz, MOD pattern: PN 9
fMOD * LOin = 259.25 MHz fMOD * LOin x 7, fMOD * LOin x 7 (Image) fMOD * LOin = 233.15 MHz fMOD * LOin x 8, fMOD * LOin x 8 (Image) VPS-TX = 0 V 3 V VPS-TX = 3 V 0 V Value between Pins I/Ib and Q/Qb Value of each pin when VI = VIb = VQ = VQb
Spurious within transmission band 1
Pout (7 MOD LO)
-
-65
-55
dBc
Spurious within transmission band 2
Pout (8 MOD LO)
-
-65
-55
dBc
Power saving response time I/Q input impedance
Rise time Fall time
TPS-TX (Rise) TPS-TX (Fall) ZI/Q
- - -
2 2 180
5 5 -
s s
k
I/Q input bias current
Note 1 Note 2
II/Q
3.5
7
16
A
V V
Power save Power save
low
VPS-TX (Low) VPS-TX (High)
0 0.9
- -
0.5 VCC
high
Notes 1. Power save pin applied voltage in sleep mode 2. Power save pin applied voltage in active mode
Preliminary Data Sheet
5
PC8139GR-7JH
ELECTRICAL SPECIFICATIONS (2)
TA = +25C, VCC = 3.0 V, unless otherwise specified, VPS = 3.0 V (high), f2ndMIXin = 243.95 MHz, P2ndMIXin = -40 dBm, f2ndMIX-LOin = 233.15 MHz, P 2ndMIX-LOin = -7 dBm, f 2ndMIXout = 10.8 MHz, f 2ndIFin = 10.8 MHz, P 2ndIFin = -15 dBm, f2ndIFout = 10.8 MHz
Parameter Receiver block total characteristics Total circuit current (RX) Dark current at power save Power save response time Power save Power save low Rise time Fall time
Note 1 Note 2
Symbol
Condition
MIN.
TYP.
MAX.
Unit
ICC (RX-TOTAL) ICC (PS-RX
TOTAL)
No signal input VPS-RX 0.3 V (Low), No signal input VPS-RX = 0 V 3 V VPS-RX = 3 V 0 V
3.5 - - - 0 2.5
4.8 0.1 2 2 - -
6 5 5 5 0.3 VCC
mA
A s s
V V
TPS-RX (Rise) TPS-RX (Fall) VPS-RX (Low) VPS-RX (High)
high
Receiver block 1 (2nd down converter) 2nd MIX conversion gain 1-dB compression output level Input 3rd order intercept point 2nd MIX noise figure 2nd MIX local leak 1 2nd MIX local leak 2 2nd MIX output resistance Receiver block 2 (IF amplifier) Limiting sensitivity 2nd IF amplifier gain 2nd IF amplifier phase shift 2nd IF amplifier output amplitude 2nd IF amplifier output rise time 2nd IF amplifier output fall time 2nd IF amplifier input resistance 2nd IF amplifier input capacitance 2nd IF amplifier output duty ratio 2nd IF amplifier output bias level SL GV SP VO tR tF Rin Cin VO (duty) VO (DC) Pin 16, Pin 17 Pin 16, Pin 17 -3 dB point P2ndIFin = 13 dBVEMF P2ndIFin = 63 to 98 dBVEMF 10 k//10 pF
Note 6 Note 5
CG2ndMIX P1dB2ndMIX IIP3 (2ndMIX) NF2ndMIX ISL (2ndLO)1 ISL (2ndLO)2 Z2ndMIXout
Combining capacitance with SG
6 -
10 93 94 8 52 24 330
14 - - - - - -
dB dBV dBV dB dBV dBV
f2ndMIXin1 = 243.95 MHz, f2ndMIXin2 = 244.25 MHz At I/O LC matching Pin 10 input -7-dBm input Pin 10 input -7-dBm input Pin 20
Note 3 Note 4
- - - - -
- - - 0.5 - - - - - -
27 80 6 0.62 13 10 330 TBD 52 1.5
32 - - 0.75 25 20 - - - -
dBVEM F dB deg VP-P ns ns pF % V
Notes 1. Power save pin applied voltage in sleep mode 2. Power save pin applied voltage in active mode 3. Leak to 2nd MIX output pin (Pin 20) of 2nd MIX-LO 4. Leak to 2nd MIX input pin (Pin 22) of 2nd MIX-LO 5. RBW of network analyzer = 3 Hz 6. 10 pF is a value including all capacitance connected to the pins (wiring pattern)
6
Preliminary Data Sheet
PC8139GR-7JH
ELECTRICAL SPECIFICATIONS (3)
TA = +25C, VCC = 3.0 V, unless otherwise specified, VPS = 3.0 V (high), f2ndMIXin = 243.95 MHz, P2ndMIXin = -40 dBm, f2ndMIX-LOin = 233.15 MHz, P 2ndMIX-LOin = -7 dBm, f 2ndMIXout = 10.8 MHz, f 2ndIFin = 10.8 MHz, P 2ndIFin = -15 dBm, P2ndIFout = 10.8 MHz
Parameter Receiver block 3 (RSSI) RSSI linearity RSSI slope RSSI intercept RSSI output voltage 1 RSSI output voltage 2 RSSI output voltage 3 RSSI output voltage 4 RSSI output temperature stability RSSI output dynamic range RSSI rise time RSSI fall time RSSI output ripple RSSI output resistance LR SR IR VR1 VR2 VR3 VR4 ST V2ndIFin = 33 dBVEMF V2ndIFin = 63 dBV V2ndIFin = 98 dBV No signal input TA = -30C to +80C VIF = 33 to 98 dBVEMF - - - 0.6 1.44 2.4 - - 1.5 28 4 0.8 1.68 2.7 0.5 2.0 2.0 - - 1 1.92 2.9 - - dB mV/dB dBVEMF V V V V dB Symbol Condition MIN. TYP. MAX. Unit
DR trf1 trf2 RR ROR 10 pF
Note
75 - - - 28
83 1 1 30 35
- 5 5 - 42
dB
s s
mVP-P k
Note 10 pF is a value including all capacitance (wiring capacitance) connected to the pins
ELECTRICAL SPECIFICATIONS (4)
TA = +25C, VCC = 3.0 V
Parameter Common block (2nd VCO) Total circuit current (2nd VCO) ICC (2ndVCO) 3 k is attached to pin 10 externally (without pull-down resistance for pin 8) 2nd VCO output level 2nd VCO oscillating frequency P2ndVCO f2ndVCO Pin 8 pull-down resistance is 1 k -10 220 - - - 270 dBm MHz 2.5 3.2 3.5 mA Symbol Condition MIN. TYP. MAX. Unit
Preliminary Data Sheet
7
PC8139GR-7JH
PIN FUNCTIONS
Pin No. Symbol Applied Voltage (V) VCC/2 Pin Voltage (V) - Input pin for I signal. The input impedance is about 180 k. Input pin for Ib signal. The input impedance is about 180 k. Single ended input is also possible. In the case of single ended input, input only the DC voltage of Vcc/2. Input pin for Q signal. The input impedance is about 180 k. Input pin for Qb signal. The input impedance is about 180 k. Single ended input is also possible. In the case of single ended input, input only the DC voltage of Vcc/2. Power supply voltage pin for the quadrature modulator block. Ground pin for the quadrature modulator block. Form as wide a ground pattern as possible to minimize its impedance. Power supply voltage pin for the VCO block. Oscillator output pin. The output level can be adjusted with an external pulldown resistor.
470 2.2 k 470 470 2.2 k 470
Note
Function and Description
Internal Equivalent Circuit
1
I
2
Ib
VCC/2
-
1
2
3
Q
VCC/2
-
4
Qb
VCC/2
-
3
4
5
VCC1
2.7 to 4.0 0
-

6
GND1
-
7
VCC2
2.7 to 4.0 -
-
8
VCOout
1.6
8
9
GND2
0
-
Ground pin for the VCO block. Form as wide a ground pattern as possible to minimize its impedance. Emitter pin for oscillator. Ground with an external pull-down resistor. It can be oscillated by performing feedback with a resonance circuit mounted externally between this pin and Pin 11. Base pin for oscillator. It can be oscillated by performing feedback with a resonance circuit mounted externally between this pin and Pin 10. Collector pin for oscillator. Open collector.
10
VCO_E
-
2.1
12 11
11
VCO_B
-
2.9
10
12
VCO_C
2.7 to 4.0
-
: External attachment Note The pin voltage is measured on Vcc=3.0 V.
8
Preliminary Data Sheet
PC8139GR-7JH
PIN FUNCTIONS
Pin No. Symbol Applied Voltage (V) 2.7 to 4.0 - Pin Voltage (V) - Supply voltage pin for the IF amplifier and RSSI block. Output pin for the IF amplifier.
14
Note
Function and Description
Internal Equivalent Circuit
13
VCC3
14
IFout
1.5
15
RSSIou t
-
0.5 (No input signal)
Output pin for the RSSI. The output resistance is about 35 k.
15 35 k
16
IFin1
-
1.9
Input pin for the IF amplifier. The input resistance is about 330 . Input pin for the IF amplifier. The input resistance is about 330 .
16 17
17
IFin2
-
1.9
18
GND3
0
-
Ground pin for the IF amplifier, RSSI block, and 2nd down converter block. Form as wide a ground pattern as possible to minimize its impedance. Power supply voltage pin for the 2nd down converter block. Output pin for the 2nd down converter. The output resistance is about 330 .
19
VCC4
2.7 to 4.0 -
-
20
2nd MIXout
1.5
20
21
2nd MIXinb
-
1.9
Bypass pin for the 2nd down converter block. Ground this pin through an external capacitor. Input pin for the 2nd down converter. High impedance input.
22
21
22
2nd MIXin
-
1.9
: External attachment Note The pin voltage is measured on Vcc=3.0 V.
Preliminary Data Sheet
9
PC8139GR-7JH
PIN FUNCTIONS
Pin No. Symbol Applied Voltage (V) 0 to VCC Pin Voltage (V) - Power save pin for the receiver block (IF amplifier, RSSI, 2nd down converter). This pin is interlocked to the internal regulator and can control the following.
VPS (V) 2.5 to VCC 0 to 0.3 IC stat ON (Active Mode) OFF (Sleep Mode)
Note
Function and Description
Internal Equivalent Circuit
23
VPS (RX)
23
24
VPS (TX)/ VAGC
0 to VCC
-
Power save pin for the transmitter block (quadrature modulator, up converter, AGC circuit). This pin is interlocked to the internal regulator and can control the following.
VPS (V) 0.9 to VCC 0 to 0.5 IC stat ON (Active Mode) OFF (Sleep Mode)
24
25
VCC5
2.7 to 4.0 -
-
Supply voltage for the AGC block.
26
TX MIXLOinb
2.0
Bypass pin for the local input of the up converter. Ground this pin through an external capacitor. Local input pin for the up converter. High impedance input.
28 26
28
TX MIXLOin
-
2.0
27
GND5
0
-
Ground pin for the AGC and up converter. Form as wide a ground pattern as possible to minimize its impedance. Supply voltage pin for the up converter block. RF output pin for the up converter block. This is an open collector output, so an impedance matching circuit should be attached externally.
29
29
VCC6
2.7 to 4.0 2.7 to 4.0
-
30
30
TX MIXout
-
: External attachment Note The pin voltage is measured on Vcc=3.0 V.
10
Preliminary Data Sheet
PC8139GR-7JH
RELATION BETWEEN I/Q PIN INPUT SIGNAL POTENTIAL AND UPPER LIMIT AMPLITUDE
Power Supply Voltage (V) VCC I/Q bias voltage (V) VCC/2 = I = Ib = Q = Qb Input Amplitude (mVP-P) Single ended Input I=Q 400 Differential Phase Input I = Ib = Q = Qb 600
2.7 to 3.0 to 4.0
1.35 to 1.5 to 2.0
800
600
1000
600
COMPARISON OF I/Q INPUT AMPLITUDES IN THE SAME TX OUTPUT LEVEL
Power Supply Voltage (V) VCC I/Q bias voltage (V) VCC/2 = I = Ib = Q = Qb Input Amplitude (mVP-P) Single ended Input I=Q 400 800 1200 Differential Phase Input I = Ib = Q = Qb 200 400 600 Reference Characteristics TX Total Output Level (dBm) PTX-MIXout -20 -14 -10.5
2.7 3.0 4.0
1.35 1.5 2.0
Preliminary Data Sheet
11
PC8139GR-7JH
TEST CIRCUIT 1
Transmitter Block (Quadrature Modulator + Up Converter + AGC Circuit)
AWG
SPA
0
90
180
270 I Ib Q Qb VCC VCC1 GND1 VCC VCC2 VCOout GND2 VCO_E 100 pF VCO_B VCO_C VCC VCC3 IFout 1 Tx_Mix_out VCC6 Tx_Mix_LOin GND5 Tx_Mix_LOinb VCC5 VPSTx VPS_Rx 2nd_Mix_in 2nd_Mix_inb 2nd_Mix_out VCC4 GND3 IFin2 IFin1
1p 10 nH
in
VCC 3 pF 33 pF 33 pF SG VCC
VPS 100 pF
out
SG
out
RSSIout
12
Preliminary Data Sheet
PC8139GR-7JH
TEST CIRCUIT 2
Transmitter Block + Common Block (Quadrature Modulator + Up Converter + AGC Circuit + 2nd VCO)
AWG
SPA
0 SPA
90 180 270 I Ib Q 1 Tx_Mix_out VCC6 Tx_Mix_LOin GND5 Tx_Mix_LOinb VCC5 VPSTx VPS_Rx 2nd_Mix_in 2nd_Mix_inb 2nd_Mix_out VCC4 GND3 IFin2 IFin1
1 pF 10 nH
in
VCC 3 pF 33 pF 33 pF SG VCC VPS 100 pF
100 pF in 1 k VCC
Qb VCC1 GND1 VCC VCC2 VCOout GND2 3 pF VCO_E VCO_B
1 pF
3 k
out
15 pF 10 pF 33 nH VCC
VCO_C VCC3 IFout RSSIout
Preliminary Data Sheet
13
PC8139GR-7JH
TEST CIRCUIT 3
Receiver Block (2nd Down Converter + 2nd IF Amplifier + RSSI)
SG
I Ib Q out Qb
1
Tx_Mix_out VCC6 Tx_Mix_LOin GND5 Tx_Mix_LOinb VCC5 VPSTx VPS_Rx 2nd_Mix_in 2nd_Mix_inb 2nd_Mix_out VCC4 100 pF 1 nF
SG
out
100 pF
100 nF
10 pF
VCC1 GND1 VCC2 VCOout GND2 VCO_E VCO_B VCO_C VCC3
51
100 nF
1 nF
1 nF 1 nF VCC SPA
VCC VCC
100 pF
100 pF
100 nF
10 pF
IFout
IFin2 IFin1
10 n
RSSIout Voltmeter
10 pF
GND3
100 nF
in
SPA
10 pF in 10 k in
10 nF
10 nF
SG
10 p
out
14
Preliminary Data Sheet
330
VCC 100 p
VPS
PC8139GR-7JH
TEST CIRCUIT 4
Receiver Block (2nd Down Converter + 2nd IF Amplifier + RSSI)
SG
I Ib Q out
100 pF
1
Tx_Mix_out VCC6 Tx_Mix_LOin GND5 Tx_Mix_LOinb VCC5 VPSTx VPS_Rx 2nd_Mix_in 2nd_Mix_inb 2nd_Mix_out VCC4 100 pF 1 nF
SG
100 nF
Qb VCC1 GND1 VCC2 VCOout GND2 VCO_E VCO_B VCO_C VCC3
out
10 pF
51
100 nF
1 nF
1 nF
VCC 100 p
VPS
VCC VCC
10 pF
100 pF
100 pF
100 nF
IFout
10 nF
IFin2 IFin1
10 nF
RSSIout Voltmeter
SPA
10 pF in 10 k in
10 p
10 pF
GND3
100 nF
VCC
Preliminary Data Sheet
15
PC8139GR-7JH
TEST CIRCUIT TOTAL CONFIGURATION
AWG
SPA VCC C31 C13 0 90 180 270 in C1 L1 I 1 Tx_Mix_out VCC6 Tx_Mix_Loin GND5 Tx_Mix_Loinb VCC5 VPSTx VPS_Rx 2nd_Mix_in 2nd_Mix_inb 2nd_Mix_out VCC4 GND3 IFin2 IFin1 C24 Voltmeter R2 in SG C23 BPF1 in C3 C12 C10 C22 VCC C27 C8 C21
SG
C4 VCC C9 C26 C11 C2 C32 VPS_TX-Vagc
out
C28 C14 SPA C29 C16 C6 VCC C18 C5 VCC
Ib Q Qb VCC1 GND1 VCC2 VCOout GND2 VCO_E VCO_B VCO_C VCC3 C15 C7 IFout RSSIout C25
SG
in
VPS_RX C19 C20 SPA
out
SG
VCC C30 out SPA
in out
16
R1
C17
Preliminary Data Sheet
PC8139GR-7JH
EXAMPLE OF THE TEST CIRCUIT MOUNTED ON PRINTED CIRCUIT BOARD
3
GND
I in
Iinb TXMIXout TXMIXLOIn
Q in
C9
C32
QInb
1
C29 C28 C16 C8 C14 C5
C31 C13
C21
C22 C4 C26 C11 C2 2 ndMIXIn
C19
C18
VCOout
C10
R1
C24 C3 C12 C27
2
C17 C3 C1 VCOin C7 BPF1 2 ndMIXout IFIn
R2
VPStx/Vagc RSSIout
C25
IFout
GND
VPSrx
VCC
PC8139
GND
C23
C8
1
4
Center portion on rear side
Parts List
Symbol BPF1 L1 R2 R1 C32 C26 to 31 C23 to 25 C19 to 22 C10 to 18 C8 to 9 C2 to 7 C1 4 3 2 1 BPF Chip inductor Chip resistor Chip resistor Chip capacitor Chip capacitor Chip capacitor Chip capacitor Chip capacitor Chip capacitor Chip capacitor Chip capacitor PCC pin PCC pin SMA connector Polyimide substrate 10 nH 10 k 51 3 pF 100 nF 10 nF 1 nF 100 pF 33 pF 10 pF 1 pF Name Value Model name * Specifications CFEC10.8 MK1 TFL0816-10N RR0816R-103-D RR0816R-510-D Manufacturer Murata Mfg. SSM SSM SSM Quantity 1 1 1 1 1 6 3 4 8 2 7 1 2 3 10 1
Notes on the board (1) Copper patterning on a polyimide board of 76 x 76 x 0.2 mm in size. (2) Full grounding on rear side. (3) Solder coating over patterns. (4) and holes. indicate through
GRM39B030J50PB Murata Mfg. GRM39B104J50PB Murata Mfg. GRM39B103J50PB Murata Mfg. GRM39B102J50PB Murata Mfg. GRM39B101J50PB Murata Mfg. GRM39B330J50PB Murata Mfg. GRM39B100J50PB Murata Mfg. GRM39B010J50PB Murata Mfg. A2-3PA-2.54DSA A2-1PA-2.54DSA 142-0701-881 R4775 (t0.2) Hirose Electric Hirose Electric JHONSON Matsushita Electric Works
Preliminary Data Sheet
17
PC8139GR-7JH
PACKAGE DIMENSIONS
30-pin plastic TSSOP (225 mil) (Unit: mm)
30 16
Detail of lead end
4.4.0.1
1 8.0 MAX.
15
+7 3 _ 3
0.980.07
6.40.2 4.40.1 1.00.2
1.25 MAX.
0.1250.075
0.5
+ 0.22 _ 0.10 0.05
0.10
M
0.5 MAX.
0.1450.055
0.50.2
18
Preliminary Data Sheet
PC8139GR-7JH
CAUTIONS ON USE
1. 2. 3. 4. Observe precautions for handling because this IC is an electrostatic sensitive device. Form as wide a ground pattern as possible to minimize its impedance. Keep the track length of the ground pins as short as possible (to prevent malfunction). Connect a bypass capacitor to the Vcc pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions. For soldering methods and conditions other than the recommended conditions, consult an NEC sales representative.
PC8139GR-7JH
Soldering Method Infrared reflow Soldering Conditions Package peak temperature: 235C. Duration: 30 sec. max. (210C or above) Number of times: 2, Exposure limit: None VPS Package peak temperature: 215C. Duration: 40 sec. max. (200C or above) Number of times: 2, Exposure limit: None Wave soldering Soldering bath temperature : 260C max. Duration: 10 sec. max. Number of times: 1, Exposure limit: None Partial heating method
Note Note Note
Symbol IR35-00-2
VP15-00-2
WS60-00-1
Pin temperature: 300C max. Duration: 3 sec. max. (per side of device) Exposure limit: None
Note
Note Storage period (days) after opening the dry pack. Storage conditions: 25C and 65% RH or less (This product is not dry packed.) Caution Do not use different soldering methods together (except for pin partial heating.)
For details of recommended soldering conditions, refer to the information document Semiconductor Device Mounting Technology Manual (C10535E)
Preliminary Data Sheet
19
PC8139GR-7JH
No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product.
M4 96. 5

▲Up To Search▲

Price & Availability of UPC8139GR-7JH

	To Download UPC8139GR-7JH Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .