| PART |
Description |
Maker |
| NP352-04808 NP352-04811 NP352-04813 NP352-1849-35 |
Fine Ball Grid Array (FBGA, 1.00mm Pitch)
|
Yamaichi Electronics Co., Ltd.
|
| AS4C64M16D3A-12BIN AS4C64M16D3A-12BCN |
96 ball FBGA PACKAGE
|
Alliance Semiconductor ...
|
| M3H71FAD-R M3H15TDD M3H52TCD-R MH75FBD MH75FAG MH7 |
8 pin DIP, 3.3 or 5.0 Volt, HCMOS/TTL Clock Oscillator
16-bit, 75 MIPS, 2.5v, 2 serial ports, host port, 80 KB RAM; Package: 144 ball CSPBGA (10x10x1.4mm); No of Pins: 144; Temperature Range: Ind
16-Bit, 80MIPS, 1.8V, 2 Serial Ports, Host Port, 20KB RAM; Package: 144 ball CSPBGA (10x10x1.4mm); No of Pins: 144; Temperature Range: Comm.
16-Bit, 80MIPS, 1.8V, 2 Serial Ports, Host Port, 80KB RAM; Package: 144 ball CSPBGA (10x10x1.4mm); No of Pins: 144; Temperature Range: Ind
16-Bit, 80MIPS, 1.8V, 2 Serial Ports, Host Port, 80KB RAM; Package: 144 ball CSPBGA (10x10x1.4mm); No of Pins: 144; Temperature Range: Comm.
16-Bit, 75 MIPS, 2.5V, 2 Serial Ports, Host Port, 40 KB RAM; Package: 144 ball CSPBGA (10x10x1.4mm); No of Pins: 144; Temperature Range: Comm.
500 MHz TigerSHARC Processor with 12 Mbit on-chip embedded DRAM; Package: 576 ball SBGA; No of Pins: 576; Temperature Range: Ind
300 MHz TigerSHARC Processor with 6 Mbit on-chip SRAM; Package: 625 ball BGA; No of Pins: 625; Temperature Range: Ind
500 MHz TigerSHARC Processor with 12 Mbit on-chip embedded DRAM; Package: BGA THERM ENH W/ HEATSINK; No of Pins: 576; Temperature Range: Ind
300 MHz TigerSHARC Processor with 6 Mbit on-chip SRAM; Package: 484 ball BGA; No of Pins: 484; Temperature Range: Ind
8 pin DIP, 3.3 or 5.0 Volt, HCMOS/TTL Clock Oscillator
|
MTRONPTI
|
| CB-9-1 |
9-Ball Wafer Level Chip Scale Package [WLCSP] Dimensions shown in millimeters
|
Analog Devices
|
| BGA-320P-M06 |
PLASTIC BALL GRID ARRAY PACKAGE 320 PIN PLASTIC
|
Fujitsu Limited
|
| CY14B104NA-ZSP20XCT CY14B104NA-ZSP20XIT CY14B104LA |
4 Mbit (512K x 8/256K x 16) nvSRAM; Organization: 256Kb x 16; Vcc (V): 2.7 to 3.6 V; Density: 4 Mb; Package: TSOP 256K X 16 NON-VOLATILE SRAM, 20 ns, PDSO54
4 Mbit (512K x 8/256K x 16) nvSRAM; Organization: 512Kb x 8; Vcc (V): 2.7 to 3.6 V; Density: 4 Mb; Package: FBGA
4 Mbit (512K x 8/256K x 16) nvSRAM; Organization: 256Kb x 16; Vcc (V): 2.7 to 3.6 V; Density: 4 Mb; Package: FBGA
|
Cypress Semiconductor, Corp.
CYPRESS SEMICONDUCTOR CORP
|
| AT91FR40162SB-CU AT91FR40162SB AT91FR40162SBPRE AT |
Flash memory in a single compact 121-ball BGA package
1024K Words 16-bit Flash Memory (2M bytes)
|
ATMEL Corporation
|
| K4S56323PF-FG K4S56323PF-F90 K4S56323PF-F75 K4S563 |
2M x 32Bit x 4 Banks Mobile SDRAM in 90FBGA 2米x 32Bit的4银行0FBGA移动SDRAM
8M X 32 SYNCHRONOUS DRAM, 6 ns, PBGA90 LEAD FREE, FBGA-90
8M X 32 SYNCHRONOUS DRAM, 7 ns, PBGA90 FBGA-90
|
Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
|
| WSFX054-SERIES XSFX054-SERIES YSFX054-SERIES WSFX0 |
Cyclone II FPGA 35K FBGA-484
Interface IC 接口IC
CYCLONE III FPGA 25K 324-FBGA 接口IC
|
Ironwood Electronics
DB Lectro, Inc.
|
| HY5PS121621AF HY5PS121621AF-C3 HY5PS121621AF-C4 HY |
512Mb DDR2 SDRAM
32M X 16 DDR DRAM, PBGA84 ROHS COMPLIANT, FBGA-84
32M X 16 DDR DRAM, PBGA84 FBGA-84
|
Hynix Semiconductor, Inc.
HYNIX SEMICONDUCTOR INC
|
