| PART |
Description |
Maker |
| MCF53017CMJ240 MCF53014CMJ240 MCF53015CMJ240 MCF53 |
Version 3 ColdFire? core with EMAC
Version 3 ColdFire庐 core with EMAC
Version 3 ColdFire垄莽 core with EMAC
|
Freescale Semiconductor, Inc
|
| 74062-2513 0740622513 |
2.00mm (.079) Pitch VHDM? Board-to-Board Backplane Header, Vertical, 8-Row,Guide Pin Signal Module, Shield End Version, Pin End Version, 200 Circuits, Pin
|
Molex Electronics Ltd.
|
| 0740621004 |
2.00mm (.079) Pitch VHDM? Board-to-Board Backplane Header, Vertical, 8-RowGuide Pin Signal Module, Shield End Version, Pin End Version, 80 Circuits, Pin Length
MOLEX Connector
|
Molex Electronics Ltd.
|
| PIC16F83T-10/SO PIC16F83T-10I/SO PIC16CR83 PIC16CR |
A newer version of this device is available. Please consider PIC16F84A.
This powerful (400 nanosecond instruction execution) yet easy-to-program (only 35 single word instructions) CMOS ROM/EEPROM-based 8-bit microcontroller packs Microchip’s powerful PIC architecture into an 18-pin package. Easily adapted
A newer version of a device is available. Please consider PIC16F84A
|
Microchip
|
| 0740591023 74059-1023 |
2.00mm (.079) Pitch VHDM? Board-to-Board Backplane Header, Vertical, 6-RowGuide Pin Signal Module, Shield End Version, Pin End Version, 60 Circuits, Pin Length
2.00mm (.079") Pitch VHDM庐 Board-to-Board Backplane Header, Vertical, 6-RowGuide Pin Signal Module, Shield End Version, Pin End Version, 60 Circuits, Pin Length
MOLEX Connector
|
Molex Electronics Ltd.
|
| 74059-1004 0740591004 |
2.00mm (.079") Pitch VHDM庐 Board-to-Board Backplane Header, Vertical, 6-Row,Guide Pin Signal Module, Shield End Version, Pin End Version, 60 Circuits, Pin Lengt
2.00mm (.079) Pitch VHDM? Board-to-Board Backplane Header, Vertical, 6-Row,Guide Pin Signal Module, Shield End Version, Pin End Version, 60 Circuits, Pin Length
|
Molex Electronics Ltd.
|
| EETHC2A222CA EETHC2A222DA EETHC2A272CA EETHC2A332C |
Highly miniaturized version (30% smaller than HB series) Can vent construction
Aluminum Electrolytic Capacitors
Highly miniaturized version (30% smaller than HB series)
|
Panasonic Battery Group
Panasonic Semiconductor
|
| BUK207-50Y BUK207-50Y1 |
TOPFET high side switch SMD version of BUK203-50X(BUK200-50X的SMD版本TOPFET高边开 TOPFET高边开关贴片版本BUK203 - 50倍（BUK200 - 50倍的表面贴装版本TOPFET高边开关）
TOPFET high side switch SMD version of BUK203-50Y
|
NXP Semiconductors N.V.
Philips Semiconductors
|
| R1LV0408CSP-7LI R1LV0408CSA-5SI R1LV0408CSA-7LI R1 |
Memory>Low Power SRAM
Wide Temperature Range Version 4M SRAM (512-kword 】 8-bit)
Wide Temperature Range Version 4M SRAM (512-kword 隆驴 8-bit)
Wide Temperature Range Version 4M SRAM (512-kword × 8-bit)
Wide Temperature Range Version 4M SRAM (512-kword 8-bit)
|
Renesas Electronics Corporation
HITACHI[Hitachi Semiconductor]
|
| MX93032-MI MX93032 |
APPLICATION NOTE [M1 VERSION]
APPLICATION NOTE [M1 VERSION] 应用笔记[货币供应量M1版本]
|
Macronix International Co., Ltd.
|
| AT71200M AT71200MCRER AT71200MCRERB AT71200MCRHR |
AT71200M Monochrome [Updated 2/03. 23 Pages] Full field CCD. 3500 x 2300 pixels. 4 x 25 MHz
Full field image sensor 3500 x 2300 pixels, 4 x 25 MHz
8M-pixel color image sensor. Full frame version standard image grade. Anti-reflective window.
8M-pixel color image sensor. Frame transfer version with two memories zones. Anti-reflective window.
8M-pixel color image sensor. Full frame version high image grade. Anti-reflective window.
|
Atmel
|
| BL0952 |
BL0952 / CN Version
|
Shanghai Belling
|
