| PART |
Description |
Maker |
| HYS72V2200GU-10 HYS72V2200GU-8 HYS64V2200GU-10 HYS |
Network Cable Assembly; Connector Type A:T568A/B Modular Plug; Connector Type B:T568A/B Modular Plug; Cable Length:7ft; Approval Categories:Augmented Category 6 standards; cord color per TIA/EIA-606 standard RoHS Compliant: Yes
3.3V 2M x 64/72-Bit 1 BANK SDRAM Module 3.3V 4M x 64/72-Bit 2 BANK SDRAM Module 4M X 64 SYNCHRONOUS DRAM MODULE, 8 ns, DMA168
3.3V 2M x 64/72-Bit 1 BANK SDRAM Module 3.3V 4M x 64/72-Bit 2 BANK SDRAM Module 2M X 72 SYNCHRONOUS DRAM MODULE, 8 ns, DMA168
3.3V 2M x 64/72-Bit 1 BANK SDRAM Module 3.3V 4M x 64/72-Bit 2 BANK SDRAM Module 2M X 64 SYNCHRONOUS DRAM MODULE, 8 ns, DMA168
KPT 3C 3#20 SKT PLUG 3.3 2米x 64/72-Bit一银行内存模块3.3 4米64/72-Bit 2银行内存模块
3.3V 2M x 64/72-Bit 1 BANK SDRAM Module 3.3V 4M x 64/72-Bit 2 BANK SDRAM Module 4M X 72 SYNCHRONOUS DRAM MODULE, 6 ns, DMA168
3.3V 2M x 64/72-Bit 1 BANK SDRAM Module 3.3V 4M x 64/72-Bit 2 BANK SDRAM Module 2M X 64 SYNCHRONOUS DRAM MODULE, 6 ns, DMA168
3.3V 2M x 64/72-Bit 1 BANK SDRAM Module 3.3V 4M x 64/72-Bit 2 BANK SDRAM Module 4M X 64 SYNCHRONOUS DRAM MODULE, 6 ns, DMA168
3.3V 4M x 64/72-Bit 1 BANK SDRAM Module 3.3V 8M x 64/72-Bit 2 BANK SDRAM Module
|
Siemens Semiconductor G...
SIEMENS[Siemens Semiconductor Group]
Infineon
SIEMENS AG
SIEMENS A G
|
| HYM72V8030GS-60 HYM72V8030GS-50 HYM72V8020GS-60 HY |
8M x 72 Bit ECC FPM DRAM Module buffered
8M x 72-Bit Dynamic RAM Module (ECC - Module)
8M x 72-Bit Dynamic RAM Module 8M X 72 FAST PAGE DRAM MODULE, 60 ns, DMA168
Tools, Hand Crimp; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No
|
SIEMENS[Siemens Semiconductor Group]
Infineon
SIEMENS AG
SIEMENS A G
|
| Q67100-Q2009 Q67100-Q2010 321160X HYM321160GS-60 H |
1M x 32 Bit DRAM Module
From old datasheet system
1M x 32-Bit Dynamic RAM Module 1M X 32 FAST PAGE DRAM MODULE, 70 ns, SMA72
|
Infineon
SIEMENS[Siemens Semiconductor Group]
SIEMENS AG
|
| HYM368020GS-60 HYM368020S-60 Q67100-Q985 HYM368020 |
8M x 36 Bit FPM DRAM Module with Parity
8M x 36 Bit DRAM Module with Parity
8M x 36-Bit Dynamic RAM Module 8M X 36 FAST PAGE DRAM MODULE, 60 ns, SMA72
8M x 36-Bit Dynamic RAM Module 8米36位动态随机存储器模块
|
SIEMENS[Siemens Semiconductor Group]
Infineon
SIEMENS AG
|
| MC74HC00 MC54HC00AJ MC54HC00 MC74HC00A MC74HC00AN |
1.2 to 5.5 V 18-A, 12-V Input Non-Isolated Wide-Adjust Module 10-DIP MODULE -40 to 85 HC/UH SERIES, QUAD 2-INPUT NAND GATE, PDSO14
0.8 to 1.8 V 26-A, 12-V Input Non-Isolated Wide-Adjust Module 13-DIP MODULE -40 to 85
1.2 to 5.5 V 26-A, 12-V Input Non-Isolated Wide-Adjust Module 13-DIP MODULE -40 to 85
|
Motorola Mobility Holdings, Inc.
Motorola, Inc.
|
| HYS72V8000GU-10 HYS64V8000GU-10 HS648000 HYS64V800 |
3.3V 8M x 64-Bit SDRAM Module 3.3V 8M x 72-Bit SDRAM Module 8M X 72 SYNCHRONOUS DRAM MODULE, 7 ns, DMA168
From old datasheet system
|
SIEMENS AG
Infineon
SIEMENS[Siemens Semiconductor Group]
|
| 7MBP10PE120 7MBR10PE120 |
IGBT module (S series)
IGBT Module(Power Integrated Module)
|
FUJI[Fuji Electric]
|
| AEPDS4M8LB-80 AEPDH4M8LB-80 AEPDS4M8LB-80S AEPDS4M |
x8 Nibble Mode DRAM Module x8半字节模式记忆体模组
x8 Page Mode DRAM Module x8页面模式内存模块
x8 Static Column Mode DRAM Module x8静态列模式DRAM模块
x8 DRAM ModuleUndefined Architecture x8内存，未定义建筑
|
Analog Devices, Inc.
TOKO, Inc.
Altera, Corp.
|
| LKP5660-6EPD6T LKP5741-5D2T LKP5661-5D2T LKP5741-5 |
2-OUTPUT 250 W AC-DC PWR FACTOR CORR MODULE HEAT SINK, METAL, CASE K02, MODULE
2-OUTPUT 282 W AC-DC PWR FACTOR CORR MODULE
2-OUTPUT 278 W AC-DC PWR FACTOR CORR MODULE
|
Power-One, Inc.
|
| DP5Z2MW16PY3-12M DP5Z2MW16PH3-12M DP5Z2MW16PI3-12C |
2M X 16 FLASH 5V PROM MODULE, 120 ns, CQCC48 HERMETIC SEALED, CERAMIC, LEADLESS, MODULE, SLCC-48
2M X 16 FLASH 5V PROM MODULE, 120 ns, QFP48 HERMETIC SEALED, CERAMIC, GULLWING, MODULE, SLCC-48
2M X 16 FLASH 5V PROM MODULE, 120 ns, QIP48 HERMETIC SEALED, CERAMIC, STRAIGHT, MODULE, SLCC-48
|
Twilight Technology, Inc.
Elektron Technology PLC
|
| CYM1861AV33PM-20C CYM1861AV33PM-25C |
2M X 32 MULTI DEVICE SRAM MODULE, 20 ns, PSMA72
2,048K x 32 3.3V Static RAM Module
|
CYPRESS SEMICONDUCTOR CORP
|
