PART |
Description |
Maker |
MDP0040 |
PACKAGE OUTLINE DRAWING QSOP - 0.150 NARROW BODY PACKAGE
|
Elantec Semiconductor
|
SC70-5 |
Surface mounted / 5 pin package Package outline
|
Zetex Semiconductors
|
AP2309AGN-HF |
3.4 A, 30 V, 0.075 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3 Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp. Advanced Power Electronics Corp.
|
DFN2X2-10 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN5X5-40 |
Package Outline
|
Global Mixed-mode Techn...
|
WDFN3X3-10 |
Package Outline
|
Global Mixed-mode Techn...
|
PG-LQFP-64-13 PG-LQFP-64-5 PG-LQFP-64-4 |
Package Outline
|
Infineon
|
DFN1.6X1.6-6 |
Package Outline
|
Global Mixed-mode Techn...
|
LQFP44 |
Package outline
|
Philips
|
TQFN4X4-28 |
Package Outline
|
Global Mixed-mode Techn...
|
WLCSP8X7-56 |
Package Outline
|
Global Mixed-mode Techn...
|