PART |
Description |
Maker |
TO263 |
Package Outline Drawing Transistor Outline 封装外形图晶体管外形
|
Electronic Theatre Controls, Inc. ETC List of Unclassifed Manufacturers
|
MDP0040 |
PACKAGE OUTLINE DRAWING QSOP - 0.150 NARROW BODY PACKAGE
|
Elantec Semiconductor
|
MK2761ASTR MK2761A MK2761AS MK2761ASLF MK2761ASLFT |
Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body)
|
ICST[Integrated Circuit Systems]
|
AP2305AGN-HF |
3.2 A, 30 V, 0.06 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3 Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp. Advanced Power Electronics Corp.
|
AP2309AGN-HF |
3.4 A, 30 V, 0.075 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3 Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp. Advanced Power Electronics Corp.
|
MSA20 |
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA20 20 -铅收缩小型封装(SSOP封装),EIAJ型二.3mm宽包MSA20
|
Fairchild Semiconductor, Corp. Fairchild Semiconductor Corporation
|
WDFN2X2-6 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN3X6-32 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN2X2-12 |
Package Outline
|
Global Mixed-mode Techn...
|
WLCSP11X12-132 |
Package Outline
|
Global Mixed-mode Techn...
|