| PART |
Description |
Maker |
| HA12237F |
ASSP>ICs for Cassette Deck>Voice Signal Processor for Cassette Decks
|
Renesas
|
| HA12211NT |
ASSP>ICs for Cassette Deck>Voice Signal Processor for Cassette Decks
|
Renesas
|
| HA12230NT |
ASSP>ICs for Cassette Deck>Voice Signal Processor for Cassette Decks
Audio Signal Processor for Cassette Deck
|
Renesas Electronics Corporation
|
| HA12179F |
Cassette deck sound signal processing (PB 1 chip)
Audio Signal Processer for Car Deck and Cassette Deck(Dolby B-type NR with PB Amp)
|
HITACHI[Hitachi Semiconductor]
|
| 101C473U7R5AA2B 101C422U100EA2B 101C243U030AB2B 10 |
The Ultimate in Cold Performance and ESR
|
Cornell Dubilier Electr...
|
| UICBXA12IW-A CBXF12IW-AY CBXF6IW-AY |
Mini-Com Ultimate ID Multi-Media/Fiber Surface Mount Box
|
PANDUIT CORP.
|
| 300145 300144 |
Bulk Metal Foil Technology Small Package, Ultimate Tracking Voltage Dividers 散装金属箔技术小包装，终极跟踪分压器
|
Vishay Intertechnology, Inc.
Vishay Intertechnology,Inc.
VISAY[Vishay Siliconix]
|
| FMV12 FMV0E |
3M Void Polyester Label Products
|
3M Electronics
|
| RX2600-P |
ECG Label & Adhesive Remover Pen
|
NTE Electronics, Inc.
|
| BL75R05 |
The BL75R05 IC is a dedicated chip for intelligent label applications
|
SHANGHAI BELLING CO., LTD.
|
| KF2002-GK42A |
Thermal Printheads > For POS, LABEL > KF200*-GK Series
|
ROHM
|
| SL2ICS2001V1D |
I-CODE SLI Label IC bumped wafer specification on UV-tape
|
NXP
|
