| PART |
Description |
Maker |
| SSM6E03TU |
Multi-chip discrete device (P-ch N-ch)
|
TOSHIBA
|
| SSM5H16TU |
Silicon N Channel MOS Type (U-MOS3)/Silicon Epitaxial Schottky Barrier Diode
Multi-chip discrete device (N-ch SBD)
|
Toshiba Semiconductor
|
| TH50VSF4682AASB TH50VSF4683AASB |
MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS SRAM AND FLASH MEMORY MIXED MULTI-CHIP PACKAGE
|
TOSHIBA
|
| 585-3211 585-3213 585-3215 585-3221 585-3225 585-3 |
Multi-Chip BASED LED T1 3/4 Bi-Pin
585 SERIES BASED LEDs-MULTI-CHIP SINGLE COLOR DISPLAY CLUSTER, RED, 5.9 mm
|
Dialight Corporation
Dialight PLC
|
| TPCF8B01 |
MOSFET TPC Series
TOSHIBA Multi-Chip Device Silicon P Channel MOS Type (U-MOS III) / Schottky Barrier Diode
|
TOSHIBA[Toshiba Semiconductor]
|
| CE201210-6N8J CE201210-5N6J CE201210-4N7J CE201210 |
IC,MOT,MC68HC908GR8CP, DIP-28, MCU FLASH 8BIT 8MHZ 4K
IC,MCU,MC68HC908JB8ADW,8-BIT SOIC-28,21 I/O,3MHZ
IC,MCU,MC68HC711E9CFN2,8-BIT 2MHz,PLCC52
8-BIT, OTPROM, 2.1 MHz, MICROCONTROLLER, PDIP20
IC,MCU,MC68HC908KX8CDW,8-BIT SOIC-16,13 I/O,8MHZ
Multi-Layer Chip Inductors 1 ELEMENT, 0.12 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0056 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.33 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0027 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0082 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
IC,MCU,MC68HC705C9ACFN,8-BIT PLCC-44,31 I/O,2MHZ 多层片式电感
Multi-Layer Chip Inductors 1 ELEMENT, 0.39 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
Bourns Inc.
Bourns, Inc.
|
| CYM1836 1836 CYM1836PZ-45C CYM1836P8-15C CYM1836P8 |
128K x 32 Static RAM Module 128K X 32 MULTI DEVICE SRAM MODULE, 15 ns, ZMA64
128K x 32 Static RAM Module 128K X 32 MULTI DEVICE SRAM MODULE, 15 ns, SMA64
128K x 32 Static RAM Module 128K X 32 MULTI DEVICE SRAM MODULE, 35 ns, SMA64
128K x 32 Static RAM Module 128K X 32 MULTI DEVICE SRAM MODULE, 30 ns, SMA64
128K x 32 Static RAM Module 128K X 32 MULTI DEVICE SRAM MODULE, 30 ns, PSMA72
128K x 32 Static RAM Module 128K X 32 MULTI DEVICE SRAM MODULE, 30 ns, ZMA64
128K x 32 Static RAM Module 128K X 32 MULTI DEVICE SRAM MODULE, 15 ns, PSMA72
128K x 32 Static RAM Module 128K X 32 MULTI DEVICE SRAM MODULE, 45 ns, PSMA72
128K x 32 Static RAM Module 128K X 32 MULTI DEVICE SRAM MODULE, 35 ns, PSMA72
128K x 32 Static RAM Module 128K X 32 MULTI DEVICE SRAM MODULE, 25 ns, PSMA72
128K x 32 Static RAM Module 128K X 32 MULTI DEVICE SRAM MODULE, 25 ns, SMA64
From old datasheet system
|
Cypress Semiconductor, Corp.
Cypress Semiconductor Corp.
CYPRESS[Cypress Semiconductor]
|
| MSM8256V-55/X0252 MSM8256V-025/X0252 MSM8256VM-025 |
256K X 8 MULTI DEVICE SRAM MODULE, 55 ns, CDIP32
256K X 8 MULTI DEVICE SRAM MODULE, 25 ns, CDIP32
256K X 8 MULTI DEVICE SRAM MODULE, 35 ns, CDXA32
|
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