| PART |
Description |
Maker |
| 0440671402 44067-1402 SD-44067-001 |
3.00mm (.118) Pitch Micro-Fit 3.0?/a> Wire-to-Board Header
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header
MOLEX Connector
|
Molex Electronics Ltd.
|
| 44914-2203 0449142203 |
3.00mm (.118) Pitch Micro-Fit 3.0 CPI Header
|
Molex Electronics Ltd.
|
| 0430250408 43025-0408 |
3.00mm (.118) Pitch Micro-Fit 3.0 Receptacle Housing, Single Row, 4 Circuits
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Receptacle Housing, Single Row, 4 Circuits
|
Molex Electronics Ltd.
|
| 0430250208 43025-0208 |
3.00mm (.118) Pitch Micro-Fit 3.0 Receptacle Housing, Single Row, 2 Circuits
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Receptacle Housing, Single Row, 2 Circuits
|
Molex Electronics Ltd.
|
| 0430250800 43025-0800 |
3.00mm (.118) Pitch Micro-Fit 3.0 Receptacle Housing, Dual Row, 8 Circuits
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Receptacle Housing, Dual Row, 8 Circuits
|
Molex Electronics Ltd.
|
| 0430450801-18 |
Micro-Fit 3.0 Right Angle Header, 3.00mm Pitch, Dual Row, 8 Circuits
|
Molex Electronics Ltd.
|
| 0436450508 43645-0508 |
3.00mm (.118) Pitch Micro-Fit 3.0 Receptacle Housing, Single Row, 5 Circuits
|
Molex Electronics Ltd.
|
| 43025-1800 0430251800 |
3.00mm (.118) Pitch Micro-Fit 3.0 Receptacle Housing, Dual Row, 18 Circuits
|
Molex Electronics Ltd.
|
| 51065-0500 |
2.00mm Pitch Micro-Latch?Wire-to-Board Housing, Friction Lock, 5 Circuits
|
Molex Electronics Ltd.
|
| SD-45280-001 0452801401 |
3.00mm (.118) Pitch Micro-Fit 3.0 BMI CPI Compliant Pin Header
|
Molex Electronics Ltd.
|
| 44067-1203 0440671203 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 12 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 12 Circuits, 0.76楼矛m (30楼矛") Gold (Au) Selecti
|
Molex Electronics Ltd.
|
| 44067-0403 0440670403 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 4 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 4 Circuits, 0.76楼矛m (30楼矛") Gold (Au) Selectiv
|
Molex Electronics Ltd.
|
|
