| PART |
Description |
Maker |
| AP2311GN-HF AP2311GN-HF-14 |
1.8 A, 60 V, 0.25 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electronics ...
|
| AP2305BGN-HF AP2305BGN-HF-14 |
4.2 A, 20 V, 0.053 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| TSSOP MSOP TSSOP-EP MSOP-EP |
SMALL OUTLINE PACKAGES
|
STATSCHIP[STATS ChipPAC, Ltd.]
|
| MT4LDT832HG-6XS MT2LDT432H MT2LDT432HG-5X MT2LDT43 |
SMALL-OUTLINE DRAM MODULE
|
MICRON[Micron Technology]
|
| FDG6322C |
Very small package outline SC70-6.
|
TY Semiconductor Co., L...
|
| SC70-8 |
SMALL OUTLINE TRANSISTOR PACKAGE
|
List of Unclassifed Manufacturers
|
| LCQT-TSSOP20 LCQT-TSSOP28 LCQT-TSSOP16 LCQT-TSOP32 |
Small Outline Prototyping Adapters
|
Aries Electronics, Inc.
|
| PM-1010 PM-1011 PM-1012 PM-1013 PM-1014 PM-1015 PM |
SMALL OUTLINE 10/100BASE-T ISOLATION TRANSFORMERS
|
Premier Magnetics, Inc.
|
| MINISO-8 |
8-LEAD MINI SMALL OUTLINE 8引脚小外形迷
|
STMicroelectronics N.V.
|
| CSSOP |
Ceramic Shrink Small Outline Package
|
Amkor Technology
|
| AP2301AGN-HF AP2301AGN-HF-14 |
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics Corp.
Advanced Power Electron...
|
