| PART |
Description |
Maker |
| N111252 |
PACKAGING: TAPE AND REEL/ 4000 PIECES PER
|
E-SWITCH
|
| M29F04B55N1F M29F04B45K1E M29F04B90N1T M29F04B45N6 |
Reversible Motor Driver for Output 1.0A (1 Motor); Package: SIP9; Constitution materials list: Packing style: Tube packaging; Package quantity: 1000
4ch System Motor Driver ICs; Package: HSOP-M28; Constitution materials list: Packing style: Tube packaging; Package quantity: 1000; Minimum package quantity: 1000; 4兆位12KB的8，统一座）单电源闪
4 Mbit (512Kb x8, Uniform Block) Single Supply Flash Memory 4兆位12KB的8，统一座）单电源闪
Reversible Motor Drivers for Output 1.0A or more (2 Motors); Package: HSIP10; Constitution materials list: Packing style: Tube packaging; Package quantity: 500; Minimum package quantity: 500; 4兆位12KB的8，统一座）单电源闪
|
意法半导
STMicroelectronics N.V.
|
| 87911-2811 0879112811 |
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 28 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Right Angle, Through Hole, 28 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, Tube Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 87911-1611 0879111611 |
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Right Angle, Through Hole, 16 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, Tube Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 87911-8011 0879118011 |
2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, 80 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 80 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 90325-9024 |
1.27mm (.050) Pitch Picoflex庐 PF-50 Header, Vertical, Low Profile, 24 Circuits, Tin (Sn) Plating, Tube Packaging
1.27mm (.050) Pitch Picoflex? PF-50 Header, Vertical, Low Profile, 24 Circuits, Tin (Sn) Plating, Tube Packaging
|
Molex Electronics Ltd.
|
| 90325-9008 |
1.27mm (.050) Pitch Picoflex庐 PF-50 Header, Vertical, Low Profile, 8 Circuits, Tin (Sn) Plating, Tube Packaging
1.27mm (.050) Pitch Picoflex? PF-50 Header, Vertical, Low Profile, 8 Circuits, Tin (Sn) Plating, Tube Packaging
|
Molex Electronics Ltd.
|
| 90325-9006 |
1.27mm (.050) Pitch Picoflex庐 PF-50 Header, Vertical, Low Profile, 6 Circuits, Tin (Sn) Plating, Tube Packaging
1.27mm (.050) Pitch Picoflex? PF-50 Header, Vertical, Low Profile, 6 Circuits, Tin (Sn) Plating, Tube Packaging
|
Molex Electronics Ltd.
|
| 0878980526 87898-0526 |
2.54mm (.100) Pitch KK? Header, Surface Mount, Breakaway, Vertical, 5 Circuits, Tin (Sn) Overall Plating, Tube Packaging, without Cap, Lead- free
2.54mm (.100) Pitch KK垄莽 Header, Surface Mount, Breakaway, Vertical, 5 Circuits, Tin (Sn) Overall Plating, Tube Packaging, without Cap, Lead- free
|
Molex Electronics Ltd.
|
| 0353620376 35362-0376 |
2.00mm (.079) Pitch Sherlock Wire-to-Board Header, Vertical, with Positive Lock, 3Circuits, with Kinked PC Tails, Natural, Tube Packaging
2.00mm (.079) Pitch Sherlock?/a> Wire-to-Board Header, Vertical, with Positive Lock, 3Circuits, with Kinked PC Tails, Natural, Tube Packaging
|
Molex Electronics Ltd.
|
|
