| PART |
Description |
Maker |
| MBR850 |
Guard Ring Die Construction for Transient Protection
|
Kersemi Electronic Co., Ltd.
Kersemi Electronic Co., Ltd...
|
| MBR830 MBR860 |
Guard Ring Die Construction for Transient Protection
|
Kersemi Electronic Co., Ltd.
|
| SOD-123 MMSZ5221B MMSZ5235B MMSZ5227B |
Planar Die Construction
|
SHENZHEN YONGERJIA INDUSTRY CO.,LTD
SHENZHEN YONGERJIA INDUSTRY...
SHENZHEN YONGERJIA INDU...
|
| MMBZ5250B |
Planar Die Construction
|
TY Semiconductor Co., Ltd
|
| MMBZ5221B |
Planar Die Construction
|
SK Electronics
|
| SAC7.0 SAC12 |
Glass Passivated Die Construction
|
Shanghai Semitech Semic...
|
| VS-40L15CTPBF |
Guard ring for enhanced ruggedness and long term reliability
|
Vishay Siliconix
|
| BAT54AW BAT54SW BAT54CW |
Low forward voltage Guard ring protected Very small SMD package.
|
TY Semiconductor Co., Ltd
|
| 1N5177W |
Low Forward Voltage Drop Guard Ring Constuction for Transient Protection
|
TY Semiconductor Co., Ltd
|
| BAT74S |
Low forward voltage Guard ring protected Small SMD package.
|
TY Semiconductor Co., Ltd
|
| BZT52C30 BZT52C9V1 BZT52C2V0 |
Planar Die Construction 500mW Power Dissipation on Ceramic PCB General Purpose, Medium Current
|
TY Semiconductor Co., Ltd
|
