| PART |
Description |
Maker |
| KB8527 KB8527BQ |
1 CHIP CLP SUBSYSTEM IC
|
Samsung Electronic
|
| S1T8527C S1T8527C01-Q0R0 |
1 CHIP CLP SUBSYSTEM IC
|
Samsung Electronic
SAMSUNG[Samsung semiconductor]
|
| BS616LV2018TI BS616LV2018 BS616LV2018AC BS616LV201 |
Very Low Power/Voltage CMOS SRAM 128K X 16 bit
LM4946 Output Capacitor-Less Audio Subsystem with Programmable National 3D; Package: LLP; No of Pins: 24
LM4946 Output Capacitor-Less Audio Subsystem with Programmable National 3D; Package: MICRO SMD; No of Pins: 25
LM4947 Mono Class D and Stereo Audio Sub-System with OCL Headphone Amplifier and National 3D
|
Brilliance Semiconducto...
BSI[Brilliance Semiconductor]
BRILLIANCE SEMICONDUCTOR, INC.
|
| AD6432AST AD6432 |
GSM 3 V Transceiver IF Subsystem
|
AD[Analog Devices]
|
| AD9870 AD9870EB |
IF Digitizing Subsystem 中频数字化子系统
|
Analog Devices, Inc.
|
| AD7555-15 |
Digit ADC Subsystem
|
Analog Devices
|
| DA9034 |
Audio and Power Subsystem
|
Dialog
|
| ISL99203 ISL99203IIZ-T |
High Efficiency Audio Subsystem
|
Intersil Corporation
|
| MC13109FTA |
Universal Cordless Telephone Subsystem IC
|
Motorola, Inc.
|
| MC13109AFTA |
UNIVERSAL CORDLESS TELEPHONE SUBSYSTEM IC
|
Motorola, Inc.
|
| SSM2804 EVAL-SSM2804Z SSM2804CBZ-RL SSM2804CBZ-R7 |
Audio Subsystem with Class-D Speaker
|
Analog Devices
|
| NTE787 |
Integrated Circuit AM Receiver Subsystem
|
NTE[NTE Electronics]
|
