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HSM88AS - MPAK package is suitable for high density surface mounting and high speed assembly

HSM88AS_7461414.PDF Datasheet

 
Part No. HSM88AS
Description MPAK package is suitable for high density surface mounting and high speed assembly

File Size 55.86K  /  1 Page  

Maker

TY Semiconductor Co., Ltd



JITONG TECHNOLOGY
(CHINA HK & SZ)
Datasheet.hk's Sponsor

Part: HSM88AS
Maker: 三级
Pack: SOT23
Stock: Reserved
Unit price for :
    50: $0.11
  100: $0.10
1000: $0.10

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 Full text search : MPAK package is suitable for high density surface mounting and high speed assembly
 Product Description search : MPAK package is suitable for high density surface mounting and high speed assembly


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