| PART |
Description |
Maker |
| H48-6G |
Thermal Conductive Pad
|
List of Unclassifed Manufacturers
|
| 16192 16192-7 |
THERMAL INTERFACE PAD, (MICRO) 热接口垫，（微）
THERMAL INTERFACE PAD (MICRO)
|
Vicor, Corp.
VICOR[Vicor Corporation]
|
| AND8044 AND8044_D AND8044/D |
Single-Channel 1206A ChipFET TM Power MOSFET Recommended Pad Pattern and Thermal Performance
|
ONSEMI
ON Semiconductor
|
| SOT545-3 |
plastic thermal enganced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad
|
NXP Semiconductors
PHILIPS[Philips Semiconductors]
|
| KF2004-GM50 KF2004-GM50A |
Thermal Printheads > For BARCODE, SCALE > KF2002*-, 300*-GM Series
Thick film thermal printhead (with thermal historical control) 厚膜热敏打印头（热历史与控制
|
ROHM[Rohm]
Rohm CO.,LTD.
Rohm Co., Ltd.
|
| EMC1428-1AP-TR EMC1428-6-AP-TR EMC1428-7-AP-TRCB7 |
1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
|
Microchip Technology
|
| EMC1428-1-AP EMC1428-6-AP |
1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
|
SMSC Corporation
|
| EMC1428 EMC1428-1-AP EMC1428-6-AP |
1∑C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
|
SMSC Corporation
|
| KD3003-DC72A |
Thick film thermal printhead (with thermal historical control)
|
Rohm
|
| SE3002-DC70A |
High speed thermal printhead (with thermal historical control)
|
Rohm
|
