| PART |
Description |
Maker |
| 1FHAX720-737G FHAX937-737G 2FJA168-736G FGA596-720 |
720 POS 1MM BGA SMT ADAPTER BGA720, IC SOCKET
937 POS 1MM BGA SMT ADAPTER BGA937, IC SOCKET
168 POS 0.80MM PITCH BGA SMT ADAPTER BGA168, IC SOCKET
596 POS 1.27MM BGA SMT ADAPTER BGA596, IC SOCKET
1020 POS 1MM BGA SMT ADAPTER BGA1020, IC SOCKET
860 POS 1MM BGA SMT ADAPTER BGA860, IC SOCKET
225 POS 1MM BGA SMT ADAPTER BGA225, IC SOCKET
388 POS 1MM BGA SMT ADAPTER BGA388, IC SOCKET
480 POS 1.27MM BGA SMT ADAPTER BGA480, IC SOCKET
324 POS 1MM BGA SMT ADAPTER BGA324, IC SOCKET
560 POS 1MM BGA SMT ADAPTER BGA560, IC SOCKET
BGA1036, IC SOCKET
256 POS 1.27MM BGA SMT ADAPTER
BGA320, IC SOCKET
BGA328, IC SOCKET
BGA132, IC SOCKET
BGA241, IC SOCKET
BGA255, IC SOCKET
BGA208, IC SOCKET
BGA272, IC SOCKET
BGA233, IC SOCKET
384 POS 1MM BGA SMT ADAPTER
225 POS 1.27MM BGA EXTRACTION ADAPTER
BGA696, IC SOCKET
BGA957, IC SOCKET
BGA824, IC SOCKET
BGA644, IC SOCKET
BGA352, IC SOCKET
BGA784, IC SOCKET
BGA788, IC SOCKET
BGA416, IC SOCKET
|
Advanced Interconnections, Corp.
ADVANCED INTERCONNECTIONS CORP
|
| IT3D-300S-BGA TR0636E-20027 |
IT3D(M)-300S-BGA (57) BGA Shearing Force TEST REPORT
|
Hirose Electric
|
| TSC607-ZPPACKOF10 TSC506-ZP |
IC FLEX 10KE FPGA 200K 600-BGA
780-pin FineLine BGA BEFESTIGUNGSKLAMMER多珀0ST
|
OSRAM GmbH
|
| FGA292-720G FGA272-720G FGAX168-720G 1FGA241-720G |
292 POS 1.27MM BGA SMT ADAPTER BGA292, IC SOCKET
272 POS 1.27MM BGA SMT ADAPTER BGA272, IC SOCKET
BGA168, IC SOCKET
BGA241, IC SOCKET
BGA521, IC SOCKET
BGA204, IC SOCKET
352 POS 1.27MM BGA SMT ADAPTER
BGA416, IC SOCKET
|
Advanced Interconnections, Corp.
ADVANCED INTERCONNECTIONS CORP
|
| FDZ4670 |
N-Channel PowerTrench?MOSFET BGA 30V, 25A, 2.5mΩ
N-Channel PowerTrench㈢MOSFET BGA 30V, 25A, 2.5mヘ
|
Fairchild Semiconductor
|
| IBM25PPC440GX-3FB533C IBM25PPC440GX-3CB533C IBM25P |
32-BIT, 533 MHz, RISC PROCESSOR, PBGA552 25 X 25 MM, FLIP CHIP, PLASTIC, BGA-552
32-BIT, 533 MHz, RISC PROCESSOR, CBGA552 25 X 25 MM, CERAMIC, BGA-552
32-BIT, 667 MHz, RISC PROCESSOR, CBGA552 25 X 25 MM, CERAMIC, BGA-552
|
Mitsubishi Electric, Corp.
|
| MT49H8M32BM-4 MT49H8M32FM-4 |
8M X 32 DDR DRAM, PBGA144 11 X 18.50 MM, LEAD FREE, MICRO, BGA-144
8M X 32 DDR DRAM, PBGA144 11 X 18.50 MM, MICRO, BGA-144
|
NEC, Corp.
|
| EPM7512AEBC256-10 EPM7256AEFC100-10 |
COMPLEX-EEPLD,512-CELL,10NS PROP DELAY,BGA,256PIN,PLASTIC
COMPLEX-EEPLD,256-CELL,10NS PROP DELAY,BGA,100PIN,PLASTIC
|
Altera Corp
|
| IBM25PPC750FX-GB0132T IBM25PPC750FX-EB1032T IBM25P |
32-BIT, 600 MHz, RISC PROCESSOR, CBGA292 21 X 21 MM, 1 MM PITCH, CERAMIC, BGA-292
32-BIT, 733 MHz, RISC PROCESSOR, CBGA292 21 X 21 MM, 1 MM PITCH, CERAMIC, BGA-292
32-BIT, 700 MHz, RISC PROCESSOR, CBGA292 21 X 21 MM, 1 MM PITCH, CERAMIC, BGA-292
|
Fox Electronics
|
|
