| PART |
Description |
Maker |
| CY7C1019D-10ZSXI CY7C1019D-10VXI |
1-Mbit (128 K × 8) Static RAM CMOS for optimum speed/power
|
Cypress Semiconductor
|
| C850X1100YMJ C850X1100YLJ |
OPTIMUM C850X1100YJJ
|
PANDUIT CORP.
|
| 1837213 |
Closed contour for optimum stability of the plug-in connection
|
PHOENIX CONTACT
|
| C075X025YJD |
OPTIMUM C075X025YJD AND C075X025CBD COMPUTER PRINTABLE LABELS
|
PANDUIT CORP.
|
| MICROFOX-PC-DB |
Through-connected joint for permanent stability and optimum distribution of force
|
PHOENIX CONTACT
|
| MICROFOX-P-DB |
Through-connected joint for permanent stability and optimum distribution of force
|
PHOENIX CONTACT
|
| MICROFOX-EO-DB |
Through-connected joint for permanent stability and optimum distribution of force
|
PHOENIX CONTACT
|
| TC9156AP TC9155AP |
The TC9155/56AP is an optimum C2MOS IC which has been designed for electronization of tone control of audio equipment with the following features
|
Toshiba Corporation
Toshiba Semiconductor
|
| BSM101AR C67076-S1018-A2 BSM101 |
From old datasheet system
SIMOPAC Module (Power module Single switch N channel Enhancement mode) SIMOPAC模块（单开关电源模块N通道增强模式
SIMOPAC Module (Power module Single switch N channel Enhancement mode) 200 A, 50 V, 0.003 ohm, N-CHANNEL, Si, POWER, MOSFET
|
Siemens Semiconductor G...
SIEMENS[Siemens Semiconductor Group]
Infineon
SIEMENS AG
|
| C67076-A2515-A67 050D06N2 BSM50GD60DN2 |
IGBT Power Module (Power module 3-phase full-bridge Including fast free-wheel diodes)
From old datasheet system
|
SIEMENS AG
SIEMENS[Siemens Semiconductor Group]
|
| BSM50GD120DN2 C67076-A2514-A67 |
IGBT Power Module (Power module 3-phase full-bridge Including fast free-wheel diodes) IGBT功率模块（功率模相全桥包括快速滑行二极管
|
SIEMENS AG
Infineon
SIEMENS[Siemens Semiconductor Group]
|
