PART |
Description |
Maker |
M6MGT641S8BKT M6MGB641S8BKT |
Memory>MCP(Multi Chip Package)>S-µMCP(Stacked micro MCP)
|
Renesas
|
M6MGT647M17AKT |
Memory>MCP(Multi Chip Package)>S-µMCP(Stacked micro MCP)
|
Renesas
|
S75PL127NBFJFWGZ2 S75PL127NCFJFWGZ3 S75PL256NCFJFW |
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品(MCP
|
Spansion, Inc.
|
S73WS-P S75WS256NDGBFWLH2 S75WS256NDGBFWLH0 S75WS2 |
Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA84 Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品(MCP
|
Spansion Inc. Spansion, Inc.
|
5-968971-1 5-968972-1 5-968973-1 5-968974-1 5-9689 |
product group drawuing for amp mcp 2.8 hsg 6-21pos with secondary locking device product group drawuing for amp mcp 2.8 hsg 6-21pos with secondary locking device
|
Tyco Electronics
|
F4655-1305 |
High-Speed Response MCP Assembly Ideal for High Resolution TOF-MS Detector Incorporates a Two-Stage MCP with 4 μm Channel Diameter High-Speed Response MCP Assembly Ideal for High Resolution TOF-MS Detector Incorporates a Two-Stage MCP with 4 レm Channel Diameter
|
Hamamatsu Corporation
|
AM49DL320BGB701T AM49DL320BGT701T AM49DL320BGT701S |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous 堆叠式多芯片封装(MCP)闪存和SRAM2兆位个M × 8 2米x 16位).0伏的CMOS只,同时 Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous 堆叠式多芯片封装(MCP)闪存和SRAM2兆位4个M × 8 2米x 16位).0伏的CMOS只,同时 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 32 Mbit (2M x 16-Bit) Pseudo Static RAM SPECIALTY MEMORY CIRCUIT, PBGA73
|
Spansion, Inc. Spansion Inc. ADVANCED MICRO DEVICES INC Advanced Micro Devices, Inc.
|
K524G2GACB-A050 |
MCP MEMORY
|
Samsung semiconductor
|
MB84VD22181FM-70 MB84VD22191FM-70 |
2-Stacked MCP
|
Fujitsu
|
KA100O015E-BJTT |
MCP Specification
|
Samsung semiconductor
|
1851342 |
FK-MCP 1,5/13-STF-3,81
|
Phoenix Contact
|
MB84VD2118XEM-70 MB84VD2119XEM-70 |
2-Stacked MCP
|
Fujitsu
|